Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/14/2002US20020031875 Method of reducing electrical shorts from the bit line to the cell plate
03/14/2002US20020031872 Method of manufacturing thin-film transistor
03/14/2002US20020031871 Method for increasing a very-large-scale-integrated (vlsi) capacitor size on bulk silicon and silicon-on-insulator (soi) wafers
03/14/2002US20020031870 Transistor structure and method for making same
03/14/2002US20020031869 Leadframe and method for manufacturing resin-molded semiconductor device
03/14/2002US20020031868 Semiconductor flip-chip package and method for the fabrication thereof
03/14/2002US20020031867 Semiconductor device and process of production of same
03/14/2002US20020031864 Method of fabrication of stacked semiconductor devices
03/14/2002US20020031863 For preventing damage to wafer during cutting
03/14/2002US20020031862 Lead frame and production method thereof, and semiconductor device and fabrication method thereof
03/14/2002US20020031859 Microwave semiconductor device and the manufacturing method thereof for improve heat discharge and electric property
03/14/2002US20020031853 Bipolar transistor, semiconductor light emitting device and semiconductor device
03/14/2002US20020031851 Converting a surface of silicon layer to silicon carbide; epitaxially growing a epitaxially growing a layer of silicon carbide on converted surface of silicon layer; growing layers of gallium nitride to form microelectronic layer
03/14/2002US20020031850 Integrated circuit and method of designing integrated circuit
03/14/2002US20020031849 Semiconductor substrate test device and method
03/14/2002US20020031848 Method of determining the time for polishing the surface of an integrated circuit wafer
03/14/2002US20020031847 Protective structures for bond wires, methods for forming same, and test apparatus including such structures
03/14/2002US20020031846 Method and device for manufacturing ceramics, semiconductor device and piezoelectric device
03/14/2002US20020031732 Selecting wafer to be imprinted with wafer-identifying information; forming a resist layer, exposing resist layer, using a mask, to light for forming latent image of wafer-identifying information; forming patterned resist layer
03/14/2002US20020031730 Method and apparatus for heat processing of substrate
03/14/2002US20020031729 Antireflective coating compositions
03/14/2002US20020031722 Positive-working photoresist composition
03/14/2002US20020031720 Novel copolymer, photoresist composition , and process for forming resist pattern with high aspect ratio
03/14/2002US20020031719 Radiation transparent; sensitivity
03/14/2002US20020031718 Resist composition
03/14/2002US20020031712 Photomask making method and alignment method
03/14/2002US20020031686 Oriented conductive oxide electrodes on SiO2/Si and glass
03/14/2002US20020031680 Zinc oxide films containing p-type dopant and process for preparing same
03/14/2002US20020031650 Electronic chip package
03/14/2002US20020031649 Quantum dot of single electron memory device and method for fabricationg thereof
03/14/2002US20020031618 Sequential chemical vapor deposition
03/14/2002US20020031612 Scanning pattern; accuracy
03/14/2002US20020031605 Liquid crystal display; convex,concave profile
03/14/2002US20020031604 Method of and apparatus for coating a wafer with a minimal layer of photoresist
03/14/2002US20020031566 Method and apparatus for filling a gap between spaced layers of a semiconductor
03/14/2002US20020031423 Apparatus for mounting semiconductor chips
03/14/2002US20020031421 Substrate arranging apparatus and method
03/14/2002US20020031420 Single wafer load lock with internal wafer transport
03/14/2002US20020031250 Method and apparatus for examining through holes
03/14/2002US20020031249 Defect detecting apparatus
03/14/2002US20020031033 Semiconductor integrated circuit device, method of investigating cause of failure occurring in semiconductor integrated circuit device and method of verifying operation of semiconductor integrated circuit device
03/14/2002US20020031029 Semiconductor device array having dense memory cell array and hierarchical bit line scheme
03/14/2002US20020031018 Semiconductor memory and method for fabricating the same
03/14/2002US20020031009 Semiconductor memory device having source areas of memory cells supplied with a common voltage
03/14/2002US20020031008 Magnetic device and method for manufacturing the same, and solid magnetic memory
03/14/2002US20020031007 Semiconductor memory apparatus, semiconductor apparatus, data processing apparatus and computer system
03/14/2002US20020031006 Semiconductor memory device having improved memory cell and bit line pitch
03/14/2002US20020031005 Memory cell array having ferroelectric capacitors, method of fabricating the same, and ferroelectric memory device
03/14/2002US20020030960 Automatic discharge apparatus for residual charge on an electrostatic chuck
03/14/2002US20020030949 Magnetic device, magnetic head and magnetic adjustment method
03/14/2002US20020030945 Magnetoresistive element and magnetic memory element and magnetic head using the same
03/14/2002US20020030823 Method and device for measuring thickness of test object
03/14/2002US20020030808 Method and device for inspecting objects
03/14/2002US20020030805 Method and apparatus for making and using an improved fiducial for an integrated circuit
03/14/2002US20020030801 Electron beam aligner, outgassing collection method and gas analysis method
03/14/2002US20020030800 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method
03/14/2002US20020030779 Liquid crystal display device, manufacturing method thereof, and fabrication apparatus therefor
03/14/2002US20020030767 Methods of fabricating active matrix pixel electrodes
03/14/2002US20020030753 Circuit for detecting leaky access switches in cmos imager pixels
03/14/2002US20020030732 Laser marking techniques
03/14/2002US20020030575 Semiconductor packages and methods for making the same
03/14/2002US20020030530 Semiconductor switching circuit and semiconductor device using same
03/14/2002US20020030513 Logic circuit cell constituting an integrated circuit and cell library having a collection of logic circuit cells
03/14/2002US20020030510 Semiconductor integrated circuit for low power and high speed operation
03/14/2002US20020030509 Semiconductor integrated circuit device
03/14/2002US20020030500 Electro-optic sampling probe and measuring method using the same
03/14/2002US20020030496 Apparatus for measuring the focus of a light exposure system used for fabricating a semiconductor device
03/14/2002US20020030489 Magnetic multilayer structure with improved magnetic field range
03/14/2002US20020030317 Wafer latch with a ball bearing assembly
03/14/2002US20020030297 Integrated circuits of low dielectric material prepared using removable pore forming material
03/14/2002US20020030290 Semiconductor device and method for manufacturing the same
03/14/2002US20020030289 Wire arrayed chip size package and fabrication method thereof
03/14/2002US20020030288 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
03/14/2002US20020030287 Resistance-reducing conductive adhesives for attachment of electronic components
03/14/2002US20020030286 Resistance-reducing conductive adhesives for attachment of electronic components
03/14/2002US20020030285 Bonding method of small parts and module of combined small parts
03/14/2002US20020030283 Semiconductor device having wires and insulator layers with via-studs
03/14/2002US20020030282 In-situ electroplated oxide passivating film for corrosion inhibition
03/14/2002US20020030281 Structure of wires for a semiconductor device
03/14/2002US20020030280 Semiconductor device having dual damascene line structure and method for fabricating the same
03/14/2002US20020030279 Semiconductor device and method for manufacturing same
03/14/2002US20020030278 Metallization arrangement for semiconductor structure and corresponding fabrication method
03/14/2002US20020030277 Novel self-aligned, low contact resistance, via fabrication process
03/14/2002US20020030275 Compositions for improving interconnect metallization performance in integrated circuits
03/14/2002US20020030274 Barrier and electroplating seed layer
03/14/2002US20020030269 Microwave monolithic integrated circuit package
03/14/2002US20020030268 Hybrid integrated circuit device
03/14/2002US20020030267 Compound semiconductor device
03/14/2002US20020030261 Multi-flip-chip semiconductor assembly
03/14/2002US20020030259 Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof
03/14/2002US20020030258 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
03/14/2002US20020030256 Memory card
03/14/2002US20020030254 Die paddle clamping method for wire bond enhancement
03/14/2002US20020030252 Semiconductor device and method of making the same, circuit board and electronic equipment
03/14/2002US20020030250 Thick film millimeter wave transceiver module
03/14/2002US20020030249 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same
03/14/2002US20020030248 Process for producing BGA type semiconductor device, TAB tape for BGA type semiconductor device, and BGA type semiconductor device
03/14/2002US20020030247 Method for decreasing CHC degradation
03/14/2002US20020030246 Structure and method for fabricating semiconductor structures and devices not lattice matched to the substrate
03/14/2002US20020030245 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument