Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/19/2002US6358797 Method of forming a non-volatile memory cell
03/19/2002US6358796 Method to fabricate a non-smiling effect structure in split-gate flash with self-aligned isolation
03/19/2002US6358795 Method of making stacked capacitor in memory device
03/19/2002US6358794 Capacitor of semiconductor device and method of fabricating the same
03/19/2002US6358793 Method for localized masking for semiconductor structure development
03/19/2002US6358792 Method for fabricating metal capacitor
03/19/2002US6358791 Method for increasing a very-large-scale-integrated (VLSI) capacitor size on bulk silicon and silicon-on-insulator (SOI) wafers and structure formed thereby
03/19/2002US6358790 Filling trench with conductive material, patterns, electrodes and capacitors
03/19/2002US6358789 Forming a hydrogen barrier layer to prevent a capacitor thin film from damage from chemical vapor deposition by forming a passivation layer; heating/oxidizing a nitride layer of titanium/aluminum on a dielectric layer of the capacitor
03/19/2002US6358788 Method of fabricating a wordline in a memory array of a semiconductor device
03/19/2002US6358787 Method of forming CMOS integrated circuitry
03/19/2002US6358786 Method for manufacturing lateral bipolar mode field effect transistor
03/19/2002US6358785 Method for forming shallow trench isolation structures
03/19/2002US6358784 Process for laser processing and apparatus for use in the same
03/19/2002US6358783 Semiconductor device and method of manufacturing the same
03/19/2002US6358782 Method of fabricating a semiconductor device having a silicon-on-insulator substrate and an independent metal electrode connected to the support substrate
03/19/2002US6358779 Technique for reducing dambar burrs
03/19/2002US6358778 Semiconductor package comprising lead frame with punched parts for terminals
03/19/2002US6358777 Spectrally detectable low-k dielectric marker layer for plasma-etch of integrated-circuit structure
03/19/2002US6358776 Method of fabricating an electronic component and apparatus used therefor
03/19/2002US6358773 Method of making substrate for use in forming image sensor package
03/19/2002US6358772 Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package
03/19/2002US6358771 Low oxygen assembly of glass sealed packages
03/19/2002US6358770 Method for growing nitride semiconductor crystals, nitride semiconductor device, and method for fabricating the same
03/19/2002US6358766 Method of fabricating a semiconductor device
03/19/2002US6358765 Method for manufacturing organic electroluminescence display device
03/19/2002US6358763 Methods of forming a mask pattern and methods of forming a field emitter tip mask
03/19/2002US6358762 Manufacture method for semiconductor inspection apparatus
03/19/2002US6358760 Etching semiconductors in plasma etch chamber, silicon on titanium layers with carbon tetrafluoride and nitrogen, monitoring optical emissions then termination the etching
03/19/2002US6358759 Method for manufacturing electro-optical device, electro-optical device, and electronic equipment
03/19/2002US6358758 Low imprint ferroelectric material for long retention memory and method of making the same
03/19/2002US6358757 Method for forming magnetic memory with structures that prevent disruptions to magnetization in sense layers
03/19/2002US6358756 Self-aligned, magnetoresistive random-access memory (MRAM) structure utilizing a spacer containment scheme
03/19/2002US6358755 Ferroelectric memory device structure useful for preventing hydrogen line degradation
03/19/2002US6358673 Multistage reaction and photoresists, exposure and rinsing
03/19/2002US6358672 Method of forming semiconductor device pattern including cross-linking and flow baking a positive photoresist
03/19/2002US6358666 Photoresists, acid generators and styrene polymers
03/19/2002US6358627 Rolling ball connector
03/19/2002US6358573 Mixed frequency CVD process
03/19/2002US6358559 Dielectric films from organohydridosiloxane resins with low organic content
03/19/2002US6358439 For forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices
03/19/2002US6358430 Providing a layer of electrical insulating material on a supporting surface; immersing the layer of electrical insulating material in the passivated etching solution; directing light onto the surface to be etched
03/19/2002US6358429 Electronic device and method for producing the same
03/19/2002US6358388 Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
03/19/2002US6358376 Biased shield in a magnetron sputter reactor
03/19/2002US6358362 Methods and arrangements for determining an endpoint for an in-situ local interconnect etching process
03/19/2002US6358361 Plasma processor
03/19/2002US6358360 Precision polishing apparatus for polishing a semiconductor substrate
03/19/2002US6358359 Apparatus for detecting plasma etch endpoint in semiconductor fabrication and associated method
03/19/2002US6358329 Resist residue removal apparatus and method
03/19/2002US6358325 Polysilicon-silicon dioxide cleaning process performed in an integrated cleaner with scrubber
03/19/2002US6358323 Method and apparatus for improved control of process and purge material in a substrate processing system
03/19/2002US6358316 Method for producing semiconductor device, method for producing semiconductor laser device, and method for producing quantum wire structure
03/19/2002US6358313 Method of manufacturing a crystalline silicon base semiconductor thin film
03/19/2002US6358288 Touchless stabilizer for processing spherical devices
03/19/2002US6358132 Apparatus for grinding spherical objects
03/19/2002US6358131 Polishing apparatus
03/19/2002US6358130 Polishing pad
03/19/2002US6358129 Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members
03/19/2002US6358128 Polishing apparatus
03/19/2002US6358126 Polishing apparatus
03/19/2002US6358125 Polishing liquid supply apparatus
03/19/2002US6358124 Pad conditioner cleaning apparatus
03/19/2002US6358122 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
03/19/2002US6358121 Carrier head with a flexible membrane and an edge load ring
03/19/2002US6358115 Dicing apparatus
03/19/2002US6357996 Edge gripping specimen prealigner
03/19/2002US6357984 Storage assembly for wafers
03/19/2002US6357938 Coating and developing process system
03/19/2002US6357650 Method of wire-bonding between pad on semiconductor chip and pad on circuit board on which the semiconductor chip is mounted
03/19/2002US6357649 Method and apparatus for automatically soldering a lead wire to a solar battery
03/19/2002US6357604 Long tooth rails for semiconductor wafer carriers
03/19/2002US6357595 Tray for semiconductor integrated circuit device
03/19/2002US6357474 System and method for shielding an opening of a tube from a liquid
03/19/2002US6357457 Substrate cleaning apparatus and method
03/19/2002US6357432 Silicon support members for wafer processing fixtures
03/19/2002US6357385 Plasma device
03/19/2002US6357330 Method and apparatus for cutting a wafer
03/19/2002US6357275 Apparatus and method for providing mechanically pre-formed conductive leads
03/19/2002US6357143 Method and apparatus for heating and cooling substrates
03/19/2002US6357142 Method and apparatus for high-pressure wafer processing and drying
03/19/2002US6357138 Drying apparatus and method
03/19/2002US6357111 Inter-electrode connection structure, inter-electrode connection method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic apparatus
03/19/2002US6357106 Method for mounting parts and making an IC card
03/19/2002US6357098 Methods and devices for positioning and bonding elements to substrates
03/19/2002US6357071 Rotating belt wafer edge cleaning apparatus
03/19/2002CA2245498C Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
03/14/2002WO2002021695A2 Depopulated programmable logic array
03/14/2002WO2002021693A2 Field programmable gate array and microcontroller system-on-a-chip
03/14/2002WO2002021613A1 Integrated circuit having organic semiconductor and anodized gate dielectric
03/14/2002WO2002021605A1 The semiconductor led device and producing method
03/14/2002WO2002021603A1 Multiplication device comprising resin-dispersed organic semiconductor film and method for producing the same
03/14/2002WO2002021601A1 Semiconductor device
03/14/2002WO2002021600A1 Short-channel switching element and its manufacturing method
03/14/2002WO2002021597A1 Integrated arrangement of bipolar transistors with different collector widths
03/14/2002WO2002021593A2 Method of forming titanium nitride (tin) films using metal-organic chemical vapor deposition (mocvd)
03/14/2002WO2002021592A2 Method for producing an electroconductive layer on the wall of through holes in a substrate
03/14/2002WO2002021591A1 Method for producing electrically conductive layers on the wall of through holes in a substrate
03/14/2002WO2002021590A2 Electrostatic chuck with porous regions
03/14/2002WO2002021589A1 Substrate transporting device
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