Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/21/2002US20020033489 Semiconductor device
03/21/2002US20020033488 Semiconductor device and dummy pattern placing method
03/21/2002US20020033487 Semiconductor device
03/21/2002US20020033486 Method for forming an interconnection line using a hydrosilsesquioxane (HSQ) layer as an interlayer insulating layer
03/21/2002US20020033484 Wiring line assembly for thin film transistor array substrate and a method for fabricating the same
03/21/2002US20020033483 Process for fabricating semiconductor device
03/21/2002US20020033482 Semiconductor device provided with a built-in minute charge detecting circuit
03/21/2002US20020033462 Vacuum exhaust valve
03/21/2002US20020033461 Pilot-type two-port vacuum valve
03/21/2002US20020033458 Charged particle beam exposure system
03/21/2002US20020033457 Pattern lock system
03/21/2002US20020033446 Neutral beam processing apparatus and method
03/21/2002US20020033408 Controlled attenuation capillary with planar surface
03/21/2002US20020033382 Chemical mechanical polishing method useful for copper substrates
03/21/2002US20020033381 Susceptor and surface processing method
03/21/2002US20020033377 Replacement of fluorocarbons with hydrogen; decomposition
03/21/2002US20020033342 Forming chip connectors; electrolytic cells
03/21/2002US20020033341 Immersion in electrolytic cell
03/21/2002US20020033339 Uniform thickness
03/21/2002US20020033274 Low resistance contacts fabricated in high aspect ratio openings by resputtering
03/21/2002US20020033232 Quartz wafer processing chamber
03/21/2002US20020033231 Apparatus and method for plasma etching
03/21/2002US20020033230 Cold forming of thin walls into bowed out sections by reverse extrusion to form deep grooves; increase the "pull- out" resistance by increasing the "footprint" of the deformed sections; for attaching screws through walls or sheets
03/21/2002US20020033229 Apparatus for etching semiconductor samples and a source for providing a gas by sublimination thereto
03/21/2002US20020033195 Fluid control apparatus and gas treatment system comprising same
03/21/2002US20020033191 Silicon-type thin-film formation process, silicon-type thin film, and photovoltaic device
03/21/2002US20020033186 Processes and apparatus for treating electronic components
03/21/2002US20020033183 Method and apparatus for enhanced chamber cleaning
03/21/2002US20020033136 Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
03/21/2002US20020033133 Substrate processing pallet and related substrate processing method and machine
03/21/2002US20020033130 Method of producing silicon carbide device by cleaning silicon carbide substrate with oxygen gas
03/21/2002US20020033129 In situ regrowth and purification of crystalline thin films
03/21/2002US20020033087 Cutter wheel for brittle sheets
03/21/2002US20020032989 Prewashing; slurrying in water
03/21/2002US20020032987 Chemical mechanical polishing slurry and method for using same
03/21/2002US20020032973 Method of and apparatus for drying a wafer using isopropyl alcohol
03/21/2002US20020032972 Substrate changing-over mechanism in vacuum tank
03/21/2002US20020032962 Method for producing an electrically conducting connection
03/21/2002US20020032940 Method for polishing leads for semiconductor packages
03/21/2002DE10136510A1 Optisches Beleuchtungssystem in einer Belichtungseinheit Illumination optical system in an exposure unit
03/21/2002DE10133885A1 Vorrichtung zur Herstellung von Drahtverbindungen An apparatus for producing wire bonds
03/21/2002DE10133715A1 Novel anthracene compounds are useful for the production of anti-reflective coatings for semiconductor devices
03/21/2002DE10129329A1 Fehlersimulationsverfahren und Fehlersimulator für einen Halbleiter-IC Fault simulation method and fault simulator for a semiconductor IC
03/21/2002DE10123805A1 Process control method e.g. for semiconductor disc or wafer manufacture has readiness point for each successive process sequence step provided in dependence on start point of preceding step
03/21/2002DE10111709A1 Manufacturing method for semiconductor device involves transferring basic pattern to first process, measuring dimension of transfer pattern and correcting optical distortion for every region
03/21/2002DE10103966A1 Semiconductor device comprises a semiconductor chip having a connecting surface-fixing surface provided with a contacting surface, an insulating layer formed on the connecting surface-fixing surface, and a conducting body
03/21/2002DE10045265A1 Vorrichtung zum Bündeln der Strahlung einer Lichtquelle Apparatus for bundling the radiation from a light source
03/21/2002DE10043731A1 Measuring probe for detection of IC signals has lever arm of high conductivity material covered by insulation layer provided with window at apex of probe point
03/21/2002DE10043159A1 Speicherzellenanordnung und Verfahren zu deren Herstellung Memory cell arrangement, and processes for their preparation
03/21/2002DE10042123A1 Parameter measuring device for semiconductor wafer manufacturing, has case which is attached to vacuum adapter to bellows and flange in cover plate
03/21/2002DE10041699A1 Niedertemperatur-Prozessierung ferroelektrischer Strontium-Wismuth-Tantalat-Schichten und Herstellung ferroelektrischer Bauelemente daraus Low-temperature processing ferroelectric strontium-bismuth-tantalum layers and producing ferroelectric devices thereof
03/21/2002DE10041685A1 Verfahren zur Herstellung eines mikroelektronischen Bauelements A process for producing a microelectronic device
03/21/2002DE10041137A1 Anordnung zum Testen von integrierten Schaltkreisen Arrangement for the testing of integrated circuits
03/21/2002CA2421799A1 Integrating metal with ultra low-k dielectrics
03/21/2002CA2421755A1 Dual position linear displacement micromechanism
03/20/2002EP1189496A1 Apparatus for mounting semiconductor chips
03/20/2002EP1189495A1 Method of manufacturing multilayer ceramic substrate, and conductor paste
03/20/2002EP1189491A1 Apparatus for detecting plasma anomalous discharge and method of detecting the same
03/20/2002EP1189308A1 Electrical connection material and electrical connection method
03/20/2002EP1189293A2 Monolithic integrable inductor
03/20/2002EP1189290A1 Semiconductor device having ZnO based oxide semiconductor layer and method of manufacturing the same
03/20/2002EP1189286A1 Semiconductor device
03/20/2002EP1189285A1 Production method for bonding wafer and bonding wafer produced by this method
03/20/2002EP1189284A1 Arrangement for improving ESD protection of a CMOS buffer
03/20/2002EP1189276A1 Methods of making an integrated circuit having field implants and a high voltage PN junction, and corresponding integrated circuit
03/20/2002EP1189275A1 Substrate transfer device
03/20/2002EP1189274A1 Ceramic board for semiconductor production and inspection devices
03/20/2002EP1189273A2 Semiconductor device and production process
03/20/2002EP1189272A1 Module with built-in electronic elements and method of manufacture thereof
03/20/2002EP1189271A2 Wiring boards and mounting of semiconductor devices thereon
03/20/2002EP1189270A2 Semiconductor device
03/20/2002EP1189269A1 Production method for annealed wafer
03/20/2002EP1189268A1 Method for manufacturing silicon mirror wafer, silicon mirror wafer, and heat treatment furnace
03/20/2002EP1189267A1 Method for preparing porous sog film
03/20/2002EP1189266A1 Production method for silicon wafer and soi wafer, and soi wafer
03/20/2002EP1189265A1 Water for storing silicon wafers and storing method
03/20/2002EP1189264A1 Apparatus for manufacturing semiconductor wafer
03/20/2002EP1189263A2 Precision high-frequency capacitor formed on semiconductor substrate
03/20/2002EP1189262A2 Semiconductor device comprising a capacitor and method of manufacturing the same
03/20/2002EP1189261A2 Batch-type heat treatment apparatus and method for controlling it
03/20/2002EP1189260A1 Wafer cleaning apparatus
03/20/2002EP1189242A2 X-ray exposure apparatus and method, semiconductor manufacturing apparatus and microstructure
03/20/2002EP1189237A1 Data storage devices
03/20/2002EP1189236A1 Integrated memory with magnetoresistive storage effect memory cells and driving method for such a memory
03/20/2002EP1189112A2 Projection exposure apparatus
03/20/2002EP1189110A2 Method of making a multi-level reticle using bi-level photoresist, including a phase-shiffed multi-level reticle
03/20/2002EP1189089A2 Device for concentrating radiation of a light source
03/20/2002EP1189087A2 A monolithic photonic receiver with self aligned fiber holder suitable for flip chip assembly
03/20/2002EP1189068A2 Method of testing electronic components using mean deviation values
03/20/2002EP1189067A2 A semiconductor device provided with a built-in minute charge detecting circuit
03/20/2002EP1189018A2 Six axes positioning system with a space free from magnetic field
03/20/2002EP1188847A2 Plasma processing method and apparatus
03/20/2002EP1188807A2 Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing
03/20/2002EP1188723A1 Synthetic quartz glass and method of production
03/20/2002EP1188518A2 Use of acoustic spectral analysis for monitoring/control of CMP processes
03/20/2002EP1188516A1 Method and apparatus for polishing outer peripheral chamfered part of wafer
03/20/2002EP1188492A1 Cleaning sponge roller
03/20/2002EP1188188A1 Multi-channel mosfet and method for producing the same
03/20/2002EP1188186A1 Method of modifying an integrated circuit
03/20/2002EP1188185A1 Semiconductor and manufacturing method for semiconductor