Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/21/2002WO2002023620A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component
03/21/2002WO2002023617A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same
03/21/2002WO2002023616A1 Integrating metal with ultra low-k dielectrics
03/21/2002WO2002023615A1 Method for annealing using partial absorber layer exposed to radiant energy and article made with partial absorber layer
03/21/2002WO2002023614A1 Method for film formation of gate insulator, apparatus for film formation of gate insulator, and cluster tool
03/21/2002WO2002023613A2 Metal cmp process with reduced dishing
03/21/2002WO2002023612A2 Process for removing an oxide during the fabrication of a resistor
03/21/2002WO2002023611A2 Integration of silicon etch and chamber cleaning processes
03/21/2002WO2002023610A1 Plasma machining device, and electrode plate, electrode supporter, and shield ring of the device
03/21/2002WO2002023609A1 High speed silicon etching method
03/21/2002WO2002023608A1 Cleaning gasses and etching gases
03/21/2002WO2002023607A1 Metal-assisted chemical etch porous silicon formation method
03/21/2002WO2002023605A1 Dry isotropic removal of inorganic anti-reflective coating after poly gate etching
03/21/2002WO2002023603A1 Method for the epitaxy of (indium, aluminum, gallium) nitride on foreign substrates
03/21/2002WO2002023602A1 Method for selective metal film layer removal using carbon dioxide jet spray
03/21/2002WO2002023601A2 Method for contact etching using a hardmask and advanced resist technology
03/21/2002WO2002023600A1 Ceramic heater for semiconductor manufacturing and inspecting equipment
03/21/2002WO2002023599A1 Bi-directional processing chamber and method for bi-directional processing of semiconductor substrates
03/21/2002WO2002023597A2 Double dual slot load lock for process equipment
03/21/2002WO2002023596A1 Heat treatment apparatus
03/21/2002WO2002023595A2 A method for forming a semiconductor device, and a semiconductor device formed by the method
03/21/2002WO2002023594A2 Apparatus and method for reducing contamination on thermally processed semiconductor substrates
03/21/2002WO2002023593A1 Cassette for flat workpieces
03/21/2002WO2002023592A2 Method and apparatus for reducing ic die mass and thickness while improving strength characteristics
03/21/2002WO2002023588A2 Capacitively coupled plasma reactor
03/21/2002WO2002023582A2 Faraday system for ion implanters
03/21/2002WO2002023564A1 Method of manufacturing a spin valve structure
03/21/2002WO2002023289A2 Adaptive sampling method for improved control in semiconductor manufacturing
03/21/2002WO2002023279A1 Thermally induced phase switch for laser thermal processing
03/21/2002WO2002023272A1 Dual layer reticle blank and manufacturing process
03/21/2002WO2002023231A2 Generation of a library of periodic grating diffraction signals
03/21/2002WO2002023119A1 Determination of a wafer notch/cam position (in the transport path) with reflected edge light
03/21/2002WO2002023114A1 Method and structure for temperature stabilization in semiconductor devices
03/21/2002WO2002023109A1 Lamp array for thermal processing chamber
03/21/2002WO2002022919A2 Forming a single crystal semiconductor film on a non-crystalline surface
03/21/2002WO2002022915A2 Removable modular cell for electro-chemical plating
03/21/2002WO2002022710A1 A process for preparing organic silicate polymer
03/21/2002WO2002022469A2 Loadlock with integrated pre-clean chamber
03/21/2002WO2002022321A2 Multiple blade robot adjustment apparatus and associated method
03/21/2002WO2002022308A1 Polishing sheet and method
03/21/2002WO2002022303A1 Method of retrofitting a probe station
03/21/2002WO2002001621A3 Method to restore hydrophobicity in dielectric films and materials
03/21/2002WO2001097260A3 Holder for a substrate cassette and device provided with such a holder
03/21/2002WO2001096964A8 Photoresist remover composition
03/21/2002WO2001091172A3 A semiconductor device and a method for forming patterns
03/21/2002WO2001090819A3 Method and system for selective linewidth optimization during a lithographic process
03/21/2002WO2001088986A3 Staggered bitline strapping of a non-volatile memory cell
03/21/2002WO2001086727A3 Silicon carbide metal-semiconductor field effect transistors and methods of fabricating silicon carbide metal-semiconductor field effect transistors
03/21/2002WO2001084614A3 Method of low-selectivitiy etching of dissimilar materials
03/21/2002WO2001082355A3 Method and apparatus for plasma cleaning of workpieces
03/21/2002WO2001078149A3 Interdigitated multilayer capacitor structure for deep sub-micron cmos
03/21/2002WO2001074708A3 Method for depositing polycrystalline sige suitable for micromachining and devices obtained thereof
03/21/2002WO2001069607A3 Memory cell, method of formation, and operation
03/21/2002WO2001066260A3 Apparatus for the application of developing solution to a semiconductor wafer
03/21/2002WO2001063864A3 Chromeless alternating phase-shift reticle for producing semiconductor device features
03/21/2002WO2001057916A3 Bipolar transistor
03/21/2002WO2001050501A3 Silicon corner rounding by ion implantation for shallow trench isolation
03/21/2002WO2001048812A3 Method and system for efficiently computing a number of integrated circuit dies
03/21/2002WO2001047010A3 Trench-diffusion corner rounding in a shallow-trench (sti) process
03/21/2002WO2001017004A3 Method of forming a conductive silicide layer on a silicon comprising substrate and method of forming a conductive silicide contact
03/21/2002US20020035719 Method and apparatus for designing semiconductor integrated circuits
03/21/2002US20020035718 Semiconductor device trimming method, semiconductor device trimming apparatus, and method for creating semiconductor device trimming table
03/21/2002US20020035717 Navigation method and device for pattern observation of semiconductor device
03/21/2002US20020035654 Semiconductor device and a computer product
03/21/2002US20020035462 Method of and device for simulation
03/21/2002US20020035461 Visual analysis and verification system using advanced tools
03/21/2002US20020035455 Generation of a library of periodic grating diffraction signals
03/21/2002US20020035447 Remote diagnosing system for semiconductor manufacturing equipment and a remote diagnosing method
03/21/2002US20020035435 Method for inspecting defect and system therefor
03/21/2002US20020035418 Automated-guided vehicle system and method for controlling the same
03/21/2002US20020035412 Method and apparatus for controlling the strategy of compounding pharmaceutical admixtures
03/21/2002US20020035279 Novel ester compounds having alicyclic and oxirane structures and method for preparing the same
03/21/2002US20020035201 No-flow reworkable epoxy underfills for flip-chip applications
03/21/2002US20020034925 Process for fabricating a semiconductor device
03/21/2002US20020034888 Insulating interposer between two electronic components and process thereof
03/21/2002US20020034886 Double dual slot load lock for process equipment
03/21/2002US20020034884 Spin coating for maximum fill characteristic yielding a planarized thin film surface
03/21/2002US20020034883 Substrate processing pallet and related substrate processing method and machine
03/21/2002US20020034881 Selecting surface quality for surface of etched wafer and quantity of silicon to be removed from surface of wafer during the etching process; determining concentration of hydrofluoric acid in an aqueous etching solution; etching
03/21/2002US20020034880 Wherein gas is introduced into a vacuum chamber for treating a substrate to be processed
03/21/2002US20020034878 Method of manufacturing semiconductor device and method of manufacturing infrared image sensor
03/21/2002US20020034877 Method of forming a self-aligned contact, and method of fabricating a semiconductor device having a self-aligned contact
03/21/2002US20020034876 Method of manufacturing semiconductor device for protecting Cu layer from post chemical mechanical polishing-corrosion and chemical mechanical polishing equipment used in the same
03/21/2002US20020034875 For manufacturing semiconductor device
03/21/2002US20020034874 Method of manufacturing a semiconductor device
03/21/2002US20020034873 Mechanical strength, thermal resistance, and adhesion to a substrate
03/21/2002US20020034872 Semiconductor device and mounted semiconductor device structure
03/21/2002US20020034871 Process for forming a dual damascene bond pad structure over active circuitry
03/21/2002US20020034870 Covering an interconnection having a bonding pad with an insulating film; forming a photoresist film; anisotropic etching; removing, with an amine-based organic solvent a metal polymer film formed on an inner side surface of second opening
03/21/2002US20020034869 Container structure for floating gate memory device and method for forming same
03/21/2002US20020034868 Forming and patterning first insulating film and a non-silicide conductive film on semiconductor substrate; forming and planarizing insulating film on entire surface; depositing refractory metal layer; forming silicide layer
03/21/2002US20020034867 Performing a reactive plasma treatment process to perform a reduction reaction on the substrate, wherein the reactive plasma treatment process comprises a reactive plasma for pre-cleaning
03/21/2002US20020034866 Semiconductor memory device for reducing damage to interlevel dielectric layer and fabrication method thereof
03/21/2002US20020034865 Semiconductor device and method of fabricating the same
03/21/2002US20020034864 Semiconductor device and method of manufacturing the same
03/21/2002US20020034863 Thin film semiconductor and method for manufacturing the same, semiconductor device and method for manufacturing the same
03/21/2002US20020034862 Method and apparatus for use in manufacturing a semiconductor device
03/21/2002US20020034861 Method of growing p-type ZnO based oxide semiconductor layer and method of manufacturing semiconductor light emitting device
03/21/2002US20020034860 Methods of processing semiconductor wafer and producing IC card, and carrier
03/21/2002US20020034859 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method
1 ... 5112 5113 5114 5115 5116 5117 5118 5119 5120 5121 5122 5123 5124 5125 5126 5127 5128 5129 5130 5131 5132 ... 6590