Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2002
03/28/2002US20020036307 Semiconductor device having ferroelectric material capacitor and method of making the same
03/28/2002US20020036306 Semiconductor device having a reduced leakage current and a fabrication process thereof
03/28/2002US20020036305 Ferroelectric memory device and method for manufacturing same
03/28/2002US20020036302 Method and structure for improved alignment tolerance in multiple, singularized plugs
03/28/2002US20020036290 Semiconductor device having MIS field effect transistors or three-dimensional structure
03/28/2002US20020036289 Liquid crystal display element and method of manufacturing the same
03/28/2002US20020036288 Semiconductor display device and manufacturing method thereof
03/28/2002US20020036287 Gallium nitride-based HFET and a method for fabricating a gallium nitride-based HFET
03/28/2002US20020036273 Methods for manufacturing reticles for charged-particle-beam microlithography exhibiting reduced proximity effects, and reticles produced using same
03/28/2002US20020036272 Charged-particle-beam microlithography methods and apparatus providing reduced reticle heating
03/28/2002US20020036267 Planar X-ray detector
03/28/2002US20020036235 Semiconductor device and an information management system thereof
03/28/2002US20020036227 Low temperature solder chip attach structure
03/28/2002US20020036187 Plasma processing device
03/28/2002US20020036183 Method for forming pattern
03/28/2002US20020036182 Flattening fine roughness existing on a side face of a silicon block or a silicon stack used for manufacturing the silicon wafer.
03/28/2002US20020036181 CMP process
03/28/2002US20020036144 Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming copper interconnect of semiconductor device using the same
03/28/2002US20020036143 Method of electroless plating and electroless plating apparatus
03/28/2002US20020036133 Magnetron sputtering source
03/28/2002US20020036100 Microbeam assembly for integrated circuit interconnection to substrates
03/28/2002US20020036077 Workpiece chuck
03/28/2002US20020036066 Method and apparatus for processing substrates
03/28/2002US20020036065 Semiconductor processing module and apparatus
03/28/2002US20020036064 Reactor with heated and textured electrodes and surfaces
03/28/2002US20020036055 Device transfer method
03/28/2002US20020036054 Printed circuit board and method manufacturing the same
03/28/2002US20020036011 Method of manufacturing a solar cell
03/28/2002US20020036006 Wet cleaning process and wet cleaning equipment
03/28/2002US20020036005 Method of and appratus for processing substrate
03/28/2002US20020036004 Rotating a substrate in a chamber, spraying a cleaning solution onto the substrate, thereby forming a cleaning gas mist in the chamber, introducing a cleaning gas into the chamber and exhausting mist and cleaing gas from the chamber
03/28/2002US20020036002 Cleaning processing method and cleaning processing apparatus
03/28/2002US20020036001 A container which retains the substrate has an inlet port for introducing a solution into the container in controllable manner and an outlet for discharging the solution, an oxygen water high concentration inlet pipe for feeding oxygen-water
03/28/2002US20020035962 Photo-excited gas processing apparatus for semiconductor process
03/28/2002US20020035961 Forming a ceramic film by crystallizing a raw material body which contains different types of raw material in mixed state, the different types of raw materials differ from one another in crystal growth condition and crystallization mechanism
03/28/2002US20020035807 Slurry for chemical mechanical polishing of a semiconductor device and preparation method thereof
03/28/2002US20020035782 Method and apparatus for manufacturing electronic parts
03/28/2002US20020035763 Substrate cleaning tool and substrate cleaning apparatus
03/28/2002US20020035762 Substrate processing apparatus
03/28/2002DE19961533A1 Vorrichtung und Verfahren zum Behandeln von Substraten Apparatus and method for processing substrates
03/28/2002DE10145147A1 Connecting structure used for forming electrical connection in highly integrated circuits comprises connecting substrate, connecting elements mounted on horizontal surface of the substrate, base region, and spring region
03/28/2002DE10143761A1 Wafer used in the production of semiconductor devices comprises a region with a central axis, a region having no flow structure defect, a region with an oxidation-induced stacking fault region
03/28/2002DE10141916A1 MOS-Halbleitervorrichtung und Verfahren zum Herstellen derselben MOS semiconductor device and method of manufacturing the same
03/28/2002DE10134961A1 Coating substrate surface with metal or alloy using electrolyte solution, e.g. for galvanizing wafer, involves applying stabilizer to substrate surface to maintain metal or alloy in electrolyte solution
03/28/2002DE10119383A1 Hochfrequenz-Halbleitervorrichtung High-frequency semiconductor device
03/28/2002DE10115489A1 Semiconductor device e.g. MOSFET has gate insulating film consisting of deuterium atom content silicon nitride film and silicon oxide film
03/28/2002DE10054969A1 Method for structuring metal layers by lithography and subsequent plasma etching comprises applying the required antireflection layer as a dielectric layer before the reactive ion etching of the uppermost metal layer of several metal layers
03/28/2002DE10046379A1 System zur gezielten Deformation von optischen Elementen System for targeted deformation of optical elements
03/28/2002DE10045466A1 Production of a thick layer/thin layer hybrid circuit on metal oxide substrates comprises applying conducting pathways, resistance surfaces and insulating layers on an insulating layer of a metal oxide produced
03/28/2002DE10043586A1 Manufacture of array of dynamic random access memory cells forming array of openings in cap insulation layer, in word lines, and in lower gate isolation oxide to capacitor electrodes
03/28/2002DE10042948A1 Integrated component used in electronic devices comprises an intermediate layer acting as a diffusion barrier arranged between a copper-containing conducting pathway and a covering layer
03/28/2002DE10042932A1 CMP process used in the manufacture of electronic components comprises using an auxiliary layer between the dielectric and liner in a region surrounding structures
03/28/2002DE10042931A1 Process for fixing semiconductor chip to substrate comprises forming profile on the edge on the lower side of the chip to create larger distance between the chip and the substrate
03/28/2002DE10042343A1 Bipolar transistor used for high frequency circuits and highly integrated electronic circuits comprises a base layer having a partial vertical structure and a contact arranged on a side wall of the vertical structure
03/28/2002CA2456871A1 Deposition of thin films by laser ablation
03/28/2002CA2435025A1 Magnetic layer system and a component having such a layer system
03/28/2002CA2423028A1 Semiconductor device and method of forming a semiconductor device
03/28/2002CA2422572A1 Isolation device between optically conductive areas
03/28/2002CA2421206A1 Oxime derivatives and the use thereof as latent acids
03/27/2002EP1191831A1 Apparatus for mounting semiconductor chips
03/27/2002EP1191827A2 X-ray system
03/27/2002EP1191696A2 Programmable logic devices with function-specific blocks
03/27/2002EP1191604A2 Semiconductor memory device
03/27/2002EP1191603A2 Trench MOS device and termination structure
03/27/2002EP1191602A2 Method of forming trench MOS device and termination structure
03/27/2002EP1191600A2 Insulated gate semiconductor device
03/27/2002EP1191599A2 Interstitial diffusion barrier
03/27/2002EP1191598A1 Method for fabricating a pn junction in a semiconductor device
03/27/2002EP1191597A2 Sidewall process to improve the flash memory cell performance
03/27/2002EP1191596A2 Semiconductor memory device and its manufacturing method
03/27/2002EP1191595A2 Integrated memory device with memory cells and buffer capacitors
03/27/2002EP1191592A2 Cathode contact structures in organic electroluminescent devices
03/27/2002EP1191590A2 Semiconductor device and semiconductor module
03/27/2002EP1191589A2 Semiconductor device having lead frame and metal plate
03/27/2002EP1191588A2 A spiral contactor and manufacturing method therefor
03/27/2002EP1191586A2 Floating gate memory and manufacturing method
03/27/2002EP1191585A2 Floating gate memory and manufacturing method
03/27/2002EP1191584A2 Floating gate memory and manufacturing method
03/27/2002EP1191583A2 Low voltage transistor
03/27/2002EP1191582A1 Production method for semiconductor device
03/27/2002EP1191581A1 Electrostatic chuck and treating device
03/27/2002EP1191579A2 Solid state electronic device fabrication using crystalline defect control
03/27/2002EP1191578A2 Semiconductor apparatus and method for producing the same
03/27/2002EP1191577A1 MOSFET transistor
03/27/2002EP1191576A1 Wet etching process for forming an HEMT IC
03/27/2002EP1191575A2 Centrifugal wafer carrier cleaning apparatus
03/27/2002EP1191574A2 Chip feeder and method for feeding semiconductor chips
03/27/2002EP1191569A2 Method for reducing plasma-induced damage
03/27/2002EP1191557A2 Integrated adjustable capacitor
03/27/2002EP1191457A2 Monolithic systems with dynamically focused input/output
03/27/2002EP1191399A2 Method of and apparatus for designing EB mask
03/27/2002EP1191377A2 System for the controlled deformation of optical elements
03/27/2002EP1191361A1 Heater module for optical waveguide device
03/27/2002EP1191344A2 Magnetoresistive element and magnetoresistive device using the same
03/27/2002EP1191308A2 Fault detection method and apparatus
03/27/2002EP1191265A2 Fluid control apparatus and gas treatment system comprising same
03/27/2002EP1191128A2 Plating method and plating apparatus
03/27/2002EP1191124A1 Copper source liquid for MOCVD processes and method for the preparation thereof
03/27/2002EP1191123A2 Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers
03/27/2002EP1191002A1 Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck