Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2002
04/02/2002US6365422 Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing same
04/02/2002US6365420 Method of forming dielectric film with good crystallinity and low leak
04/02/2002US6365419 High density MRAM cell array
04/02/2002US6365333 Low temperature anti-reflective coating for IC lithography
04/02/2002US6365328 Semiconductor structure and manufacturing method
04/02/2002US6365327 Forming a stack including insulating layers, a stop layer and two masks; tantalum or silicon element or compound dielectrics; copper, aluminum, tungsten, nickel, polysilicon,or gold conductor
04/02/2002US6365323 High performance curable polymers and processes for the preparation thereof
04/02/2002US6365322 Photoresist composition for deep UV radiation
04/02/2002US6365320 Process for forming anti-reflective film for semiconductor fabrication using extremely short wavelength deep ultraviolet photolithography
04/02/2002US6365306 Photosensitive polymer composition, method for forming relief patterns, and electronic parts
04/02/2002US6365302 Automatic overlap process using a plurality of linear patterns; faster with greater reproducibility and reliability semiconductor substrate with a photoresist film
04/02/2002US6365266 Spinning solution of a ceramic precursor, acid catalyst, a surfactant and solvent applied to silicon wafer, removing solvent, calcining to form a ceramic film having reduced halide content and reduced metal content
04/02/2002US6365235 Streams of active particles are created, these being directed onto the surface which is to be treated, and caused to interact with the surface
04/02/2002US6365228 Process for spin-on coating with an organic material having a low dielectric constant
04/02/2002US6365085 Comprises a cavity to which a plurality of bus bars are juxtaposedly inserted provided with gap portions to which a resin material to be injected therethrough and a plurality of holder pins provided
04/02/2002US6365064 Method for evenly immersing a wafer in a solution
04/02/2002US6365063 Plasma reactor having a dual mode RF power application
04/02/2002US6365062 Treatment on silicon oxynitride
04/02/2002US6365060 Method for controlling plasma processor
04/02/2002US6365057 Circuit manufacturing using etched tri-metal media
04/02/2002US6365042 Sequestering metals
04/02/2002US6365027 Preirradiation with pulsed laser
04/02/2002US6365025 Multilstage, multizonal
04/02/2002US6365020 Wafer plating jig
04/02/2002US6365015 Method for depositing high density plasma chemical vapor deposition oxide in high aspect ratio gaps
04/02/2002US6364958 Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridges
04/02/2002US6364957 Support assembly with thermal expansion compensation
04/02/2002US6364955 Particulary of all types of storage disks for reactive and nonreactive processes; a carrousel-type conveyor for rotating about an axis and a transport element to be moved out and back radially and controlled at given positions; apertures
04/02/2002US6364953 Method and apparatus for making aerogel film
04/02/2002US6364947 Method and apparatus for manufacturing a silicon single crystal having few crystal defects, and a silicon single crystal and silicon wafers manufactured by the same
04/02/2002US6364922 Substrate transport container
04/02/2002US6364919 Constant pressure in dispersion chambers prevents macro particles would lead to scratching
04/02/2002US6364762 Wafer atmospheric transport module having a controlled mini-environment
04/02/2002US6364751 Method for singling semiconductor components and semiconductor component singling device
04/02/2002US6364745 Mapping system for semiconductor wafer cassettes
04/02/2002US6364744 CMP system and slurry for polishing semiconductor wafers and related method
04/02/2002US6364743 Composite lapping monitor resistor
04/02/2002US6364742 Chemical-mechanical polishing apparatus
04/02/2002US6364731 Circuit device manufacturing equipment
04/02/2002US6364595 Reticle transfer system
04/02/2002US6364593 Material transport system
04/02/2002US6364592 Small footprint carrier front end loader
04/02/2002US6364331 Method and apparatus for transferring wafer cassettes in microelectronic manufacturing environment
04/02/2002US6364196 Method and apparatus for aligning and attaching balls to a substrate
04/02/2002US6364089 Multi-station rotary die handling device
04/02/2002US6363976 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
04/02/2002US6363968 System for conserving a resource by flow interruption
04/02/2002US6363958 Flow control of process gas in semiconductor manufacturing
04/02/2002US6363950 Apparatus for processing substrate using process solutions having desired mixing ratios
04/02/2002US6363882 Lower electrode design for higher uniformity
04/02/2002US6363881 Plasma chemical vapor deposition apparatus
04/02/2002US6363808 Conveying device
04/02/2002US6363626 Method and device for treating items stored in containers and storage apparatus equipped with such a device
04/02/2002US6363624 Apparatus for cleaning a semiconductor process chamber
04/02/2002US6363623 Apparatus and method for spinning a work piece
04/02/2002CA2241676C Platinum-free ferroelectric memory cell with intermetallic barrier layer and method of making same
04/02/2002CA2233132C Semiconductor substrate and process for producing same
04/02/2002CA2231625C Semiconductor substrate having compound semiconductor layer, process for its production, and electronic device fabricated on semiconductor substrate
04/02/2002CA2163739C Memory material and method for its manufacture
04/02/2002CA2070836C Electronic articles containing a fluorinated poly(arlene ether) dielectric
03/2002
03/28/2002WO2002025825A2 Method for assembling components and antennae in radio frequency identification devices
03/28/2002WO2002025750A1 Electrode and/or conductor track for organic components and production method therefor
03/28/2002WO2002025749A2 Magnetic layer system and a component comprising such a layer system
03/28/2002WO2002025742A2 Method for producing a semiconductor-metal contact through a dielectric layer
03/28/2002WO2002025740A1 High-voltage diode and method for the production thereof
03/28/2002WO2002025739A1 Thin-film transistor, and liquid crystal display and electroluminescence display which comprise it
03/28/2002WO2002025733A2 Non-volatile memory cell array and methods of forming
03/28/2002WO2002025730A2 Self aligned trench and method of forming the same
03/28/2002WO2002025729A2 Control of separation between gate and storage node in vertical dram
03/28/2002WO2002025728A2 Dual thickness gate oxide fabrication method using plasma surface treatment
03/28/2002WO2002025727A2 Method of forming conductive interconnections on an integrated circuit device
03/28/2002WO2002025726A1 Method to recess interconnects in damascene patterning
03/28/2002WO2002025725A2 Semiconductor device and process for forming the same
03/28/2002WO2002025724A2 Correction of overlay offset between inspection layers in integrated circuits
03/28/2002WO2002025723A2 Lateral shift measurement using an optical technique
03/28/2002WO2002025722A2 Method and system for determining pressure compensation factors in an ion implanter
03/28/2002WO2002025721A1 Method for installing a chip on a substrate
03/28/2002WO2002025720A1 Chip mounting device and calibration method therein
03/28/2002WO2002025719A2 Reduced capacitance scaled hbt using a separate base post layer
03/28/2002WO2002025718A1 Method of producing anneal wafer and anneal wafer
03/28/2002WO2002025717A1 Silicon wafer and silicon epitaxial wafer and production methods therefor
03/28/2002WO2002025716A1 Method of producing silicon wafer and silicon wafer
03/28/2002WO2002025715A2 Method of fabricating conductor structures with metal comb bridging avoidance
03/28/2002WO2002025714A1 A process for dry-etching a semiconductor wafer surface
03/28/2002WO2002025713A1 Gas compositions for cleaning the interiors of reactors as well as for etching films of silicon-containing compounds
03/28/2002WO2002025709A2 Integrated thin film capacitor/inductor/interconnect system and method
03/28/2002WO2002025708A2 Methods and systems for semiconductor fabrication processes
03/28/2002WO2002025707A2 Method and apparatus for alignment of carriers and semiconductor processing equipment
03/28/2002WO2002025706A2 Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers
03/28/2002WO2002025701A2 Body-tied silicon on insulator semiconductor device structure and method therefor
03/28/2002WO2002025700A2 Semiconductor device and method of forming a semiconductor device
03/28/2002WO2002025698A2 Cooling body, especially for cooling electronic components
03/28/2002WO2002025697A2 Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto
03/28/2002WO2002025696A2 Reducing deposition of process residues on a surface in a chamber
03/28/2002WO2002025695A2 Tunable focus ring for plasma processing
03/28/2002WO2002025665A2 Non-volatile passive matrix and method for readout of the same
03/28/2002WO2002025379A1 Developing solution for photoresist
03/28/2002WO2002025376A2 Oxime derivatives and the use thereof as latent acids
03/28/2002WO2002025375A2 Pinhole defect repair by resist flow
03/28/2002WO2002025374A2 Antireflective composition