Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2002
04/11/2002US20020040983 Silicon wafer with embedded optoelectronic material for monolithic OEIC
04/11/2002US20020040981 Method of manufacturing semiconductor device over glass substrate having heat resistance
04/11/2002US20020040921 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
04/11/2002US20020040920 Wire bonding apparatus having wire clamp
04/11/2002US20020040897 Thermal process apparatus for measuring accurate temperature by a radiation thermometer
04/11/2002US20020040886 Plasma gas etching
04/11/2002US20020040885 Vapor deposition
04/11/2002US20020040884 Probe tip configuration and a method of fabrication thereof
04/11/2002US20020040853 Method of manufacturing a semiconductor component and plating tool therefor
04/11/2002US20020040852 Stabilization with complex
04/11/2002US20020040849 Cathode cartridge and anode cartridge of testing device for electroplating
04/11/2002US20020040847 Method of forming a dielectric film
04/11/2002US20020040766 Etching silicon oxide with fluorohydrocarbon or fluorine; controlling temperature
04/11/2002US20020040765 Apparatus and methods for processing surface of semiconductor substrate
04/11/2002US20020040764 High density plasma vapor deposition
04/11/2002US20020040754 Method for bonding substrates
04/11/2002US20020040751 Adhesive control during stiffener attachment to provide co-planarity in flip chip packages
04/11/2002US20020040727 Apparatus and method for optimizing the efficiency of germanium junctions in multi-junction solar cells
04/11/2002US20020040724 Wafer cleaning module and method for cleaning the surface of a substrate
04/11/2002US20020040722 Surface treatment method for GaAs substrate
04/11/2002US20020040679 Semiconductor processing apparatus
04/11/2002US20020040568 Plant for producing semiconductor products
04/11/2002US20020040521 Methods of bonding solder balls to bond pads on a substrate, and bonding frames
04/11/2002DE19613561C2 Verfahren zum Vereinzeln von in einem Körper miteinander verbundenen, elektrisch getesteten elektronischen Elementen Method for separating in a body interconnected electrically tested electronic elements
04/11/2002DE10100844A1 Abschirmungsschaltung und integrierte Schaltung, in der die Abschirmungsschaltung verwendet wird Shielding circuit and integrated circuit in which the shield circuit is used
04/11/2002DE10064944A1 Verfahren zum Abscheiden von insbesondere kristallinen Schichten, Gaseinlassorgan sowie Vorrichtung zur Durchführung des Verfahrens A method for depositing in particular crystalline layers, gas inlet element, and device for carrying out the method
04/11/2002DE10064941A1 Gaseinlassorgan Gas inlet element
04/11/2002DE10058078C1 Integrated circuit with analyzer protection has gaps left by first group of conducting tracks in wiring plane and filled by second group of conducting tracks provided for protection of IC
04/11/2002DE10050045A1 In-situ structurization and cleaning of metal wiring of semiconductor, used for producing device, integrated circuit or connection between them, uses 3-stage reactive ionic etching and fourth etching stage to remove polymer
04/11/2002DE10047214A1 Frequency filtering or selection circuit for HF signal reception and/or generation incorporated in IC metallisation with constant ohmic resistance
04/11/2002DE10045202A1 Kassette für flache Werkstücke Cassette for flat workpieces
04/11/2002DE10044257A1 Verfahren zum Erzeugen von Masken-Layout-Daten für die Lithografiesimulation und von optimierten Masken-Layout-Daten sowie zugehörige Vorrichtung und Programme A method for generating mask data for the layout and lithography simulation of the optimized mask layout data, and associated apparatus and programs
04/11/2002CA2457919A1 Silicon carbide metal-oxide semiconductor field effect transistors and fabicating methods therefor
04/10/2002EP1195986A2 Charge transfer device, CCD image sensor, and CCD image pickup system
04/10/2002EP1195902A2 Semiconductor integrated circuit with reduced leakage current
04/10/2002EP1195821A1 Spin valve device with spin-dependent specular reflection
04/10/2002EP1195820A2 Integrated magnetoresistive circuit
04/10/2002EP1195815A1 Inductive structure integrated on a semiconductor substrate
04/10/2002EP1195813A2 Semiconductor device, semiconductor module and hard disk
04/10/2002EP1195812A2 Semiconductor device, semiconductor module and hard disk
04/10/2002EP1195811A1 Semiconductor device
04/10/2002EP1195809A2 Process for producing semiconductor device
04/10/2002EP1195808A1 Method of fabricating a thin, free-standing semiconductor device layer and of making a three-dimensionally integrated circuit
04/10/2002EP1195807A1 Open/close device for open/close lid of untreated object storing box and treating system for untreated object
04/10/2002EP1195806A2 Method for underfilling a flip-chip semiconductor device
04/10/2002EP1195805A2 Heat radiation substrate and semiconductor module
04/10/2002EP1195804A1 Method for producing silicon epitaxial wafer
04/10/2002EP1195803A2 Post-etch cleaning treatment
04/10/2002EP1195802A1 Process for forming conductor lines on a semiconductor product
04/10/2002EP1195801A2 Process for plasma treating an isolation layer with low permittivity
04/10/2002EP1195800A1 Device and method for evaluating reliability of metallic interconnection and recorded medium on which evaluation of reliability of metallic interconnection is recorded
04/10/2002EP1195799A1 High pressure process for the formation of crystallized ceramic films at low temperatures
04/10/2002EP1195798A1 Method for producing semiconductor wafer and semiconductor wafer
04/10/2002EP1195797A2 Method for plasma hardening photoresist in etching of semiconductor and superconductor films
04/10/2002EP1195795A2 Vacuum apparatus and method
04/10/2002EP1195793A2 Passive bipolar arc control system and method
04/10/2002EP1195772A1 Fuse circuit
04/10/2002EP1195746A2 Semiconductor device, semiconductor module and hard disk
04/10/2002EP1195455A1 Silicon wafer, method for determining condition under which silicon single crystal is produced, and method for producing silicon wafer
04/10/2002EP1195454A2 Cathode cartridge and anode cartridge of testing device for electroplating
04/10/2002EP1195451A1 Method of decreasing the dielectric constant in a SiOC layer
04/10/2002EP1195450A2 Semiconductor processing system and method for controlling moisture level therein
04/10/2002EP1195400A1 Crosslinkable elastomer composition, sealing material produced from the composition, and filler for use therein
04/10/2002EP1195188A1 Chemical filter
04/10/2002EP1195083A1 Underfilling material for semiconductor package
04/10/2002EP1195004A2 Voltage limiting bias circuit for reduction of hot electron degradation effects in mos cascode circuits
04/10/2002EP1194957A1 A method in the fabrication of organic thin-film semiconducting devices
04/10/2002EP1194954A1 Electrostatic chuck and its manufacturing method
04/10/2002EP1194953A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent
04/10/2002EP1194952A2 Fluorine based plasma etch method for anisotropic etching of high open area silicon structures
04/10/2002EP1194951A1 Method for making a thin film using pressurisation
04/10/2002EP1194950A1 Process for polycrystalline silicon film growth and apparatus for same
04/10/2002EP1194949A1 Surface finishing of soi substrates using an epi process
04/10/2002EP1194948A1 Handling system
04/10/2002EP1194947A1 Methods and apparatus for alignment of ion beam systems using beam current sensors
04/10/2002EP1194814A1 Mask manufacturing methods comprising patterns to control corner rounding
04/10/2002EP1194803A1 Broad band ultraviolet catadioptric imaging system
04/10/2002EP1194764A2 Apparatus and method for testing of sheet material
04/10/2002EP1194731A1 Interferometric apparatus and method that compensate refractive index fluctuations
04/10/2002EP1194619A1 Doped diamond
04/10/2002EP1194610A1 Method and system for pumping semiconductor equipment from transfer chambers
04/10/2002EP1194607A2 Copper sputtering target assembly and method of making same
04/10/2002EP1002142B1 Method and apparatus for reducing deposition of contaminants
04/10/2002EP0972092A4 Multipurpose processing chamber for chemical vapor deposition processes
04/10/2002EP0956516B1 Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate
04/10/2002EP0915919B1 Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
04/10/2002EP0880801B1 DIE ATTACHED SiC AND DIE ATTACH PROCEDURE FOR SiC
04/10/2002EP0807318B1 Process for producing a glass-coated article and article produced thereby
04/10/2002EP0803660B1 Driving screw and method of forming film of lubricant
04/10/2002EP0780023B1 Process for self-aligned source for high density memory
04/10/2002EP0754351B1 Integrated circuits with borderless vias
04/10/2002EP0753193B1 Improvements in an apparatus and method of use of radiofrequency identification tags
04/10/2002EP0737366B1 Field effect device
04/10/2002EP0692137B1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
04/10/2002CN1344436A Methods and appts. for bipolar elimination in silicon-on-insulator (sol) domino circuits
04/10/2002CN1344426A Improved integrated oscillators and tuning circuits
04/10/2002CN1344425A Lead frame moisture barrier for molded plastic electronic packages
04/10/2002CN1344424A Process line for underfilling controlled collapse chip connection (C4) integrated circuit package
04/10/2002CN1344336A Prodn. of bulk single crystals of aluminum nitride, silicon carbide and aluminum nitride: silicon carbide alloy
04/10/2002CN1344194A Workpiece handling robot