Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2002
04/16/2002US6372570 Method of formation of a capacitor on an integrated circuit
04/16/2002US6372569 Selective formation of hydrogen rich PECVD silicon nitride for improved NMOS transistor performance
04/16/2002US6372567 Control of oxide thickness in vertical transistor structures
04/16/2002US6372566 Method of forming a silicide layer using metallic impurities and pre-amorphization
04/16/2002US6372565 Method of manufacturing SRAM cell
04/16/2002US6372564 Method of manufacturing V-shaped flash memory
04/16/2002US6372563 Self-aligned SOI device with body contact and NiSi2 gate
04/16/2002US6372562 Method of producing a semiconductor device
04/16/2002US6372561 Fabrication of fully depleted field effect transistor formed in SOI technology with a single implantation step
04/16/2002US6372560 Simplified process for forming thin film transistor matrix for liquid crystal display
04/16/2002US6372559 Method for self-aligned vertical double-gate MOSFET
04/16/2002US6372558 Electrooptic device, driving substrate for electrooptic device, and method of manufacturing the device and substrate
04/16/2002US6372557 Method of manufacturing a lateral fet having source contact to substrate with low resistance
04/16/2002US6372554 Semiconductor integrated circuit device and method for production of the same
04/16/2002US6372553 Disposable mold runner gate for substrate based electronic packages
04/16/2002US6372550 Semiconductor device and method for manufacturing same
04/16/2002US6372549 Semiconductor package and semiconductor package fabrication method
04/16/2002US6372548 Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate
04/16/2002US6372547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board
04/16/2002US6372546 Method of producing semiconductor device and configuration thereof, and lead frame used in said method
04/16/2002US6372545 Method for under bump metal patterning of bumping process
04/16/2002US6372544 Method to reduce occurrences of fillet cracking in flip-chip underfill
04/16/2002US6372543 Wrap-around interconnect for fine pitch ball grid array
04/16/2002US6372542 Method of component manufacture
04/16/2002US6372541 Method of fabricating a microcircuit card
04/16/2002US6372539 Leadless packaging process using a conductive substrate
04/16/2002US6372537 Pinned photodiode structure in a 3T active pixel sensor
04/16/2002US6372536 Contact structures with which it is possible to produce low-loss p-type contact with p-conducting zinc-selenium semiconductor layer
04/16/2002US6372535 Manufacturing method of a thin film transistor
04/16/2002US6372534 Method of making a TFT array with photo-imageable insulating layer over address lines
04/16/2002US6372531 Semiconductor device and fabrication process therefor
04/16/2002US6372528 Burn-in method and burn-in device
04/16/2002US6372527 Methods of making semiconductor chip assemblies
04/16/2002US6372526 Method of manufacturing semiconductor components
04/16/2002US6372524 Method for CMP endpoint detection
04/16/2002US6372523 Etching method and etching device
04/16/2002US6372522 Use of optimized film stacks for increasing absorption for laser repair of fuse links
04/16/2002US6372521 Post epitaxial thermal oxidation
04/16/2002US6372520 Sonic assisted strengthening of gate oxides
04/16/2002US6372519 Providing an oxide containing substrate having layer comprised of metals capable of forming a ferroelectric oxide; heating layer such that metals reacts with oxide containing substrate to reduce oxide to form metal silicide
04/16/2002US6372518 Method using unreactive gas anneal and low temperature pretreatment for fabricating layered superlattice materials and making electronic devices including same
04/16/2002US6372414 Coating substrate with layer of liquid positive photoresist; soft baki to remove solvent from photoresist layer; contacting with aqueous alkaline developer; placing mask containing a pattern over photoresist; exposure to actinic radiation
04/16/2002US6372413 Method for cleaning the surface of substrate to which residues of resist stick
04/16/2002US6372412 Method of producing an integrated circuit chip using frequency doubling hybrid photoresist and apparatus formed thereby
04/16/2002US6372410 Resist stripping composition
04/16/2002US6372406 Deactivated aromatic amines as additives in acid-catalyzed resists
04/16/2002US6372403 Photosensitive resin composition
04/16/2002US6372391 Template mask lithography utilizing structured beam
04/16/2002US6372390 Photo mask with an ESD protective function
04/16/2002US6372356 Compliant substrates for growing lattice mismatched films
04/16/2002US6372301 Method of improving adhesion of diffusion layers on fluorinated silicon dioxide
04/16/2002US6372292 Insulating paste composition for rib formation and method of rib pattern formulation
04/16/2002US6372291 In situ deposition and integration of silicon nitride in a high density plasma reactor
04/16/2002US6372286 Forming metal electrode, depositing liquid precursor comprising barium, strontium, and titanium in common solution to form film, annealing film to form peroyskite layer of barium strontium titanate on electrode
04/16/2002US6372151 Controlled etchant gas flow of sulfur hexafluoride, oxygen, and nitrogen
04/16/2002US6372150 High vapor plasma strip methods and devices to enhance the reduction of organic residues over metal surfaces
04/16/2002US6372116 Adhesion, uniformity; supersonic waves.
04/16/2002US6372114 Method of forming a semiconductor device
04/16/2002US6372084 Plasma processing apparatus with a dielectric plate having a thickness based on a wavelength of a microwave introduced into a process chamber through the dielectric plate
04/16/2002US6372083 Masking and doping are carried out continuously without exposing the substrate to the atmosphere; thin film transistor
04/16/2002US6372082 Method and apparatus for semiconductor device fabrication
04/16/2002US6372081 Process to prevent copper contamination of semiconductor fabs
04/16/2002US6372051 Rinsing and cleaning semiconductor wafers with deionized water
04/16/2002US6372050 Non-corrosive stripping and cleaning composition
04/16/2002US6372048 Gas processing apparatus for object to be processed
04/16/2002US6372044 Method for dispensing a liquid
04/16/2002US6372042 System for processing semiconductor wafers producing a downward laminar flow of clean air in front of baking units
04/16/2002US6372041 Method and apparatus for single crystal gallium nitride (GaN) bulk synthesis
04/16/2002US6372039 Method and apparatus for irradiation of a pulse laser beam
04/16/2002US6372034 Adding pb acetate to 2-methoxyethanol solvent at ambient temperature and pressure in nitrogen-filled gloved box, refluxing, fractionally distilling, adding germanium tetraalkoxy compound; ferroelectricity, transistors
04/16/2002US6372003 Polishing abrasive of crystalline ceric oxide particles having surfaces modified with hydroxyl groups
04/16/2002US6371840 Method and apparatus for processing a planar structure
04/16/2002US6371838 Polishing pad conditioning device with cutting elements
04/16/2002US6371836 Groove cleaning device for chemical-mechanical polishing
04/16/2002US6371716 Apparatus and method for unloading substrates
04/16/2002US6371713 Substrate processing apparatus
04/16/2002US6371712 Support frame for substrates
04/16/2002US6371310 Boat for land grid array packages
04/16/2002US6371135 Using a charged particle beam directed at the particle to be removed.
04/16/2002US6371134 Stripping the patterned resist from the semiconductor structure; contacting carbon containing resist debris remaining on the semiconductor structure with ozone to reduc the amount of carbon debris thereon.
04/16/2002US6370965 Capacitive sensing array devices
04/16/2002US6370897 Semiconductor manufacturing facility
04/16/2002US6370796 Heater block cooling system for wafer processing apparatus
04/16/2002US6370793 Apparatus for controlling the temperature of a wafer located at a pre-alignment stage
04/16/2002US6370791 Processing machine with lockdown rotor
04/16/2002US6370785 Strip counting gauge
04/16/2002US6370774 Radiator with thin fins and method for producing the same
04/16/2002US6370750 Component affixing method and apparatus
04/11/2002WO2002029949A2 Semiconductor device with protective functions
04/11/2002WO2002029912A1 Solid state embossing of polymer devices
04/11/2002WO2002029911A2 Tunelling magnetoresistance (tmr) material having ultra-thin magnetic layer
04/11/2002WO2002029903A2 Silicon-on-insulator (soi) trench photodiode and method of forming same
04/11/2002WO2002029902A1 Nonvolatile semiconductor storage device and production method therefor
04/11/2002WO2002029901A1 Thin film transistor, liquid crystal display device comprising it, and electroluminescence display device
04/11/2002WO2002029900A2 Silicon carbide power mosfets having a shorting channel and methods of fabrication them
04/11/2002WO2002029891A1 Method and apparatus for a dense metal programmable rom
04/11/2002WO2002029890A2 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
04/11/2002WO2002029889A2 Vertical transistor dram cell and method of making the same
04/11/2002WO2002029888A2 Vertical transistor trench capacitor dram cell and method of making the same
04/11/2002WO2002029887A2 One-step etch processes for dual damascene metallization