Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2002
04/18/2002WO2002031858A2 Gas distribution apparatus for semiconductor processing
04/18/2002WO2002031595A2 Dissolution inhibitors in photoresist compositions for microlithography
04/18/2002WO2002031232A1 Method and device for producing optical fluoride crystals
04/18/2002WO2002031231A1 Semiconductor production device and production method for semiconductor device
04/18/2002WO2002031227A2 Deposition uniformity control for electroplating apparatus, and associated method
04/18/2002WO2002031219A1 Electrostatically clamped edge ring for plasma processing
04/18/2002WO2002031217A2 Sputter targets
04/18/2002WO2002031072A1 Cmp slurry composition and a method for planarizing semiconductor device using the same
04/18/2002WO2002031018A1 Die-attaching paste and semiconductor device
04/18/2002WO2002031011A2 Fractionation of resins using a static mixer and a liquid-liquid centrifuge
04/18/2002WO2002030840A2 Glass member resistant to plasma corrosion
04/18/2002WO2002030618A1 Activated slurry cmp system and methods for implementing the same
04/18/2002WO2002030617A1 Polishing pad comprising a filled translucent region
04/18/2002WO2002030173A2 Method and apparatus for communicating images, data, or other information in a defect source identifier
04/18/2002WO2002012585A3 Processing apparatus and cleaning method
04/18/2002WO2002011147A3 Integrated circuit with a temperature sensor
04/18/2002WO2002007201A3 Method for etching trenches for the fabrication of semiconductor devices
04/18/2002WO2002007194A3 Cleaning gas for semiconductor production equipment
04/18/2002WO2002007191A3 Silica zeolite low-k dielectric thin films
04/18/2002WO2002005314A3 Apparatus for processing a microelectronic workpiece including a workpiece cassette inventory assembly
04/18/2002WO2002003472A3 Aerosol silicon nanoparticles for use in semiconductor device fabrication
04/18/2002WO2002001643A3 Soft recovery power diode and related method
04/18/2002WO2002001608A3 METHOD FOR ACHIEVING IMPROVED EPITAXY QUALITY (SURFACE TEXTURE AND DEFECT DENSITY) ON FREE-STANDING (ALUMINUM, INDIUM, GALLIUM) NITRIDE ((Al,In,Ga)N) SUBSTRATES FOR OPTO-ELECTRONIC AND ELECTRONIC DEVICES
04/18/2002WO2002001234A3 System for calibrating timing of an integrated circuit wafer tester
04/18/2002WO2001099182A3 Insitu diffusion barrier and copper metallization for improving reliability of semiconductor devices
04/18/2002WO2001098836A3 Method of reducing post-development defects in and around openings formed in photoresist by use of non-patterned exposure
04/18/2002WO2001097584A3 Encapsulation using microcellular foamed materials
04/18/2002WO2001096961A3 Multipass multiphoton absorption method and apparatus
04/18/2002WO2001095396A3 Double-implant high performance varactor and method for manufacturing same
04/18/2002WO2001095389A3 Shielding of analog circuits on semiconductor substrates
04/18/2002WO2001093333A3 Bandgap reference circuit and related method
04/18/2002WO2001091176A3 Trilayer/bilayer solder bumps and fabrication methods therefor
04/18/2002WO2001071804A3 Lateral asymmetric lightly doped drain mosfet
04/18/2002WO2001071426A3 Apparatus for generating a laser pattern on a photomask and associated methods
04/18/2002WO2001070628A3 Plasma processing for porous silica thin film
04/18/2002WO2001068954A3 Axial gradient transport apparatus and process
04/18/2002WO2001067505A3 Substrate thermal management system
04/18/2002WO2001067071B1 Evaluating a property of a multilayered structure
04/18/2002WO2001065596A3 Method for controlling uniformity of treatment of a surface of material for microelectronics with an electrically charged particle beam and equipment therefor
04/18/2002WO2001064391A3 Planarization system with a wafer transfer corridor and multiple polishing modules
04/18/2002WO2001063266A3 System for imaging a cross-section of a substrate
04/18/2002WO2001059814A3 Semiconductor structure
04/18/2002WO2001046996A3 Substrate holder
04/18/2002WO2001039266A9 Power semiconductor die attach process using conductive adhesive film
04/18/2002WO2001004643A3 Wafer-level burn-in and test cartridge and methods
04/18/2002WO2000072368A9 Process for etching a silicon wafer
04/18/2002WO2000066969A9 Interferometry system having a dynamic beam-steering assembly for measuring angle and distance
04/18/2002US20020046391 Method for generating behavior model description of circuit and apparatus for logic verification
04/18/2002US20020046389 Automatic cell placement and routing apparatus and automatic cell placement and routing method used for the apparatus
04/18/2002US20020046318 Flash eeprom system
04/18/2002US20020046140 Information providing method and system
04/18/2002US20020046001 Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system
04/18/2002US20020045967 Substrate processing system
04/18/2002US20020045966 Chemical vapor deposition process and apparatus for performing the same
04/18/2002US20020045709 Liquid epoxy resin composition and semiconductor device
04/18/2002US20020045693 Composition for film formation, method of film formation and silica-based film
04/18/2002US20020045556 Method for treating surface of substrate and surface treatment composition used for the same
04/18/2002US20020045414 Cutting machine
04/18/2002US20020045413 Substrate cleaning apparatus and substrate polishing apparatus with substrate cleaning apparatus
04/18/2002US20020045412 Method for supplying slurry to polishing apparatus
04/18/2002US20020045410 Polishing apparatus
04/18/2002US20020045362 Method of forming a silicon nitride layer on a semiconductor wafer
04/18/2002US20020045361 Plasma processes for depositing low dielectric constant films
04/18/2002US20020045360 Semiconductor device and method of manufacturing thereof
04/18/2002US20020045359 Fluorine-containing materials and processes
04/18/2002US20020045358 Fabrication of DRAM and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process
04/18/2002US20020045357 Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small production runs
04/18/2002US20020045356 To eliminate delamination in the interface between a layer of passivation and an overlying layer of epoxy
04/18/2002US20020045355 Method of manufacturing a semiconductor device having a silicide layer
04/18/2002US20020045354 Acid resistance glass; smooth surface
04/18/2002US20020045353 Placing a semiconductor substrate with a silicon oxide containing layer thereon into a plasma reaction chamber, supplying a linear octafluoro1-butene or octafluoro-2-butene etchant gas into the chamber, etching silicon oxide layer
04/18/2002US20020045352 Method for controlling flatness of wafer and manufacturing method of thin-film magnetic head
04/18/2002US20020045351 Method of manufacturing a substrate for an electronic device by using etchant and electronic device having the substrate
04/18/2002US20020045350 Cerium oxide; water soluble carboxylic or sulfonic acid or salt; forming shallow trench isolations using this abrasive composition.
04/18/2002US20020045348 Semiconductor wafer treating method and device for removing deposit on a semiconductor wafer
04/18/2002US20020045346 Formation of diamond particle interconnects
04/18/2002US20020045345 Enhance performance of copper damascene process by embedding conformal tin layer
04/18/2002US20020045344 Method of forming polycrystalline cosi2 salicide and products obtained thereof
04/18/2002US20020045343 Employed to form diffusion barrier layers on microelectronic devices via vapor deposition.
04/18/2002US20020045342 Semiconductor structure having a doped conductive layer
04/18/2002US20020045341 Reducing reflectivity on a semiconductor wafer by annealing titanium and aluminum
04/18/2002US20020045340 Method of manufacturing group iii-v compound semiconductor
04/18/2002US20020045339 Manufacture method for semiconductor with small variation in MOS threshold voltage
04/18/2002US20020045338 Semiconductor device and method for manufacturing the same
04/18/2002US20020045337 Methods of planarizing insulating layers on regions having different etching rates
04/18/2002US20020045336 Methods for forming improved passivation layers for integrated circuits
04/18/2002US20020045335 Passivation integrity improvements
04/18/2002US20020045334 Interconnection system and method for producing the same
04/18/2002US20020045333 Semiconductor device manufacturing method and semiconductor device
04/18/2002US20020045332 Method of fabricating a semiconductor device using a damascene metal gate
04/18/2002US20020045331 Method of producing a semiconductor device using feature trimming
04/18/2002US20020045329 Dielectrically separated wafer and method of manufacturing the same
04/18/2002US20020045328 Method of manufacturing a semiconductor integrated circuit device
04/18/2002US20020045327 Method and apparatus for separating sample
04/18/2002US20020045326 Methods for making semiconductor devices
04/18/2002US20020045325 Thin tensile layers in shallow trench isolation and method of making same
04/18/2002US20020045324 Method for forming shallow trench isolation
04/18/2002US20020045322 Method of depositing tungsten nitride using a source gas comprising silicon
04/18/2002US20020045321 Process for fabricating a semiconductor component
04/18/2002US20020045320 Nonvolatile memory device and method for manufacturing the same