| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/30/2002 | US6379785 Glass-coated substrates for high frequency applications |
| 04/30/2002 | US6379782 Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same |
| 04/30/2002 | US6379757 Silicon dioxide deposition by plasma activated evaporation process |
| 04/30/2002 | US6379747 Thin film forming method and apparatus |
| 04/30/2002 | US6379745 Applying conductor pattern to substrate; heating |
| 04/30/2002 | US6379642 Vacancy dominated, defect-free silicon |
| 04/30/2002 | US6379577 Hydrogen peroxide and acid etchant for a wet etch process |
| 04/30/2002 | US6379576 Systems and methods for variable mode plasma enhanced processing of semiconductor wafers |
| 04/30/2002 | US6379575 Treatment of etching chambers using activated cleaning gas |
| 04/30/2002 | US6379574 Flushing; oxygen-based plasma treatment; cleaning; for semiconductors |
| 04/30/2002 | US6379573 Self-limiting isotropic wet etching process |
| 04/30/2002 | US6379569 Masking with hot melt ink |
| 04/30/2002 | US6379491 Plasma chamber with erosion resistive securement screws |
| 04/30/2002 | US6379490 System for improving the total thickness variation of a wafer |
| 04/30/2002 | US6379484 Where a resin supply control means controls the amount of resin so more resin is supplied near a central portion of the semiconductor chip than near end portions of the semiconductor chip to fill gap between chip and mount board |
| 04/30/2002 | US6379470 Partially lifting out of treament fluid with a device in a reciprocating manner and transferring to second dry device for total removal out of the fluid |
| 04/30/2002 | US6379469 Apparatus and method for washing substrate |
| 04/30/2002 | US6379428 Reduction of particles, positioning a clean room and opening |
| 04/30/2002 | US6379406 Water polish mixture, abrasive particles of metal oxide for ions |
| 04/30/2002 | US6379235 Wafer support for chemical mechanical planarization |
| 04/30/2002 | US6379231 Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
| 04/30/2002 | US6379230 Automatic polishing apparatus capable of polishing a substrate with a high planarization |
| 04/30/2002 | US6379229 Polishing apparatus |
| 04/30/2002 | US6379228 Polishing machine having a plurality of abrasive pads |
| 04/30/2002 | US6379226 Method for storing carrier for polishing wafer |
| 04/30/2002 | US6379225 Planarization process with abrasive polishing slurry that is selective to a planarized surface |
| 04/30/2002 | US6379223 Method and apparatus for electrochemical-mechanical planarization |
| 04/30/2002 | US6379222 Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
| 04/30/2002 | US6379221 Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system |
| 04/30/2002 | US6379219 Chemical mechanical polishing machine and chemical mechanical polishing method |
| 04/30/2002 | US6379159 Interposer for chip size package and method for manufacturing the same |
| 04/30/2002 | US6379103 Substrate transfer apparatus |
| 04/30/2002 | US6379095 Robot for handling semiconductor wafers |
| 04/30/2002 | US6379057 Resist developing process |
| 04/30/2002 | US6379056 Substrate processing apparatus |
| 04/30/2002 | US6379024 Dielectric barrier excimer lamp and ultraviolet light beam irradiating apparatus with the lamp |
| 04/30/2002 | US6378758 Conductive leads with non-wettable surfaces |
| 04/30/2002 | US6378756 Solder ball arrangement device |
| 04/30/2002 | US6378600 Thermally conductive chuck with thermally separated sealing structures |
| 04/30/2002 | US6378538 Durable, multi-piece rotor for spray acid tools |
| 04/30/2002 | US6378534 Semiconductor wafer cleaning system |
| 04/30/2002 | US6378378 Wafer to measure pressure at a number of points in a process chamber |
| 04/30/2002 | US6378200 Dynamically reconfigurable assembly line for electronic products |
| 04/30/2002 | US6378192 Method of fixing a plurality of lower members each having reference bore for installing upper member, and fixing jigs |
| 04/30/2002 | CA2360312A1 Novel gate dielectric |
| 04/30/2002 | CA2088931C Phosphonooxy and carbonate derivatives of taxol |
| 04/25/2002 | WO2002034019A1 Method of manufacturing an integrated circuit carrier |
| 04/25/2002 | WO2002033755A2 Method of fabricating heterojunction photodiodes integrated with cmos |
| 04/25/2002 | WO2002033754A1 Non-volatile semiconductor storage location configuration and method for the production thereof |
| 04/25/2002 | WO2002033753A2 Integrated circuit provided with overvoltage protection and method for manufacture thereof |
| 04/25/2002 | WO2002033751A2 Microelectronic substrate with integrated devices |
| 04/25/2002 | WO2002033750A1 Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchip bonding |
| 04/25/2002 | WO2002033748A2 Method and apparatus for introducing an equivalent rc circuit in a mos device using resistive wells |
| 04/25/2002 | WO2002033747A1 Method of etching dual damascene structure |
| 04/25/2002 | WO2002033746A1 Layer transfer of low defect sige using an etch-back process |
| 04/25/2002 | WO2002033745A2 Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system |
| 04/25/2002 | WO2002033743A1 Wafer holder, wafer support member, wafer holding device, and heat treating furnace |
| 04/25/2002 | WO2002033742A1 Post-etching cleaning of a copper-associated dielectric |
| 04/25/2002 | WO2002033741A1 Method for forming insulation film and method for manufacturing semiconductor device |
| 04/25/2002 | WO2002033739A1 Control trimming of hard mask for transistor gate |
| 04/25/2002 | WO2002033738A1 Semiconductor device and method of manufacture thereof |
| 04/25/2002 | WO2002033737A2 Multiprobe detection system for chemical-mechanical planarization tool |
| 04/25/2002 | WO2002033736A1 Chemical-mechanical polishing slurry and method |
| 04/25/2002 | WO2002033735A2 Device for thermally treating substrates |
| 04/25/2002 | WO2002033734A2 Ion processing element with composite media |
| 04/25/2002 | WO2002033733A2 System and method for automated monitoring and assessment of fabrication facility |
| 04/25/2002 | WO2002033729A2 Plasma reactor with reduced reaction chamber |
| 04/25/2002 | WO2002033728A1 Device and method for the etching of a substrate by means of an inductively coupled plasma |
| 04/25/2002 | WO2002033489A2 Compositions for microlithography |
| 04/25/2002 | WO2002033485A1 Silica-based light-weight euv lithography stages |
| 04/25/2002 | WO2002033467A1 8-mirrored microlithographic projector lens |
| 04/25/2002 | WO2002033385A2 Biochip excitation and analysis structure |
| 04/25/2002 | WO2002033033A1 Stabilized alkaline compositions for cleaning microelectronic substrates |
| 04/25/2002 | WO2002033023A1 Slurry for chemical-mechanical polishing copper damascene structures |
| 04/25/2002 | WO2002033018A2 Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same |
| 04/25/2002 | WO2002033017A2 Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same |
| 04/25/2002 | WO2002032825A1 Surface contouring by controlled application of processing fluid using marangoni effect |
| 04/25/2002 | WO2002032809A1 Oxide material, method for preparing oxide thin film and element using said material |
| 04/25/2002 | WO2002032667A1 A method for separating a film and a substrate |
| 04/25/2002 | WO2002032636A2 Method for making micromolds |
| 04/25/2002 | WO2002032589A2 Porous layers and method for production thereof by means of spin-coating |
| 04/25/2002 | WO2002004322A3 SMIF container latch mechanism |
| 04/25/2002 | WO2001099169A3 Etch stop layer system for sige devices |
| 04/25/2002 | WO2001097284A3 Method for forming dual damascene structure |
| 04/25/2002 | WO2001097258A3 Fast recovery diode and method for its manufacture |
| 04/25/2002 | WO2001093328A3 Lead frame laminate and method for manufacturing semiconductor parts |
| 04/25/2002 | WO2001069660A3 Method and apparatus for supporting a substrate |
| 04/25/2002 | WO2001048822A3 Thin-film transistor circuitry |
| 04/25/2002 | WO2001024235A3 Methods and apparatuses for trench depth detection and control |
| 04/25/2002 | WO2000019343A3 Block based design methodology |
| 04/25/2002 | US20020049957 Method of designing semiconductor integrated circuit device, and apparatus for designing the same |
| 04/25/2002 | US20020049572 Device and method for generating an arrangement of a set of particles |
| 04/25/2002 | US20020049554 Cross-correlation timing calibration for wafer-level IC tester interconnect systems |
| 04/25/2002 | US20020049127 Glass, plasma resisting component, component for electromagnetic wave-transparent window and plasma processing apparatus |
| 04/25/2002 | US20020049033 Polishing pad comprising a filled translucent region |
| 04/25/2002 | US20020049030 Wafer polishing device |
| 04/25/2002 | US20020049026 Method and apparatus for planarizing semiconductor device |
| 04/25/2002 | US20020049024 Carrier head with a substrate sensor |
| 04/25/2002 | US20020048973 Contact structure and production method thereof and probe contact assembly using same |
| 04/25/2002 | US20020048972 Semiconductor device and method for fabricating the same |