Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2002
04/25/2002US20020047209 Method for forming contact hole for dual damascene interconnection of semiconductor device and resultant structure
04/25/2002US20020047207 Semiconductor device and method for fabricating the same
04/25/2002US20020047206 Wiring structures containing interconnected metal and wiring levels including a continous, single crystalline or polycrystalline conductive material having one or more twin boundaries
04/25/2002US20020047205 Local interconnect structure for integrated circuit devices, source structure for the same, and method for fabricating the same
04/25/2002US20020047204 Semiconductor device
04/25/2002US20020047203 Semiconductor device having fluorine-added carbon dielectric film and method of fabricating the same
04/25/2002US20020047202 Semiconductor wafer assemblies comprising photoresist over silicon nitride materials
04/25/2002US20020047201 Semiconductor device with rare metal electrode
04/25/2002US20020047199 Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device
04/25/2002US20020047198 Semiconductor device package and lead frame with die overhanging lead frame pad
04/25/2002US20020047197 Semiconductor device module frame and group thereof
04/25/2002US20020047195 Semiconductor device and method for manufacturing same
04/25/2002US20020047192 Test circuit and multi-chip package type semiconductor device having the test circuit
04/25/2002US20020047190 Optical device using a lead frame and a process for manufacturing the same
04/25/2002US20020047187 Semiconductor device
04/25/2002US20020047185 Lead frame tooling design for bleed barrier groove
04/25/2002US20020047184 Electronic component having a semiconductor chip
04/25/2002US20020047183 Semiconductor device and method of manufacturing the same
04/25/2002US20020047182 Reducing magnetic coupling using triple well
04/25/2002US20020047181 Semiconductor integrated circuit device with electrically programmable fuse
04/25/2002US20020047180 Semiconductor assisted metal deposition for nanolithography applications
04/25/2002US20020047179 Semiconductor device
04/25/2002US20020047177 Compound semiconductor device
04/25/2002US20020047176 Horizontal, insulated gate field effect transistor and method of driving the same
04/25/2002US20020047171 Low resistance self aligned extended gate structure utilizing a T or Y shaped gate structure for high performance deep submicron FET
04/25/2002US20020047170 Semiconductor device and manufacturing method thereof
04/25/2002US20020047169 Semiconductor device and SOI substrate
04/25/2002US20020047168 Semiconductor device comprising MIS field-effect transistor, and method of fabricating the same
04/25/2002US20020047166 Semiconductor device
04/25/2002US20020047164 Device isolation structure for semiconductor device and method of fabricating the same
04/25/2002US20020047163 Semiconductor device and manufacturing method thereof
04/25/2002US20020047161 Topgraphical electrostatic protection grid for sensors
04/25/2002US20020047159 Method of manufacturing semiconductor substrate, semiconductor substrate, electro-optical apparatus and electronic equipment
04/25/2002US20020047157 Semiconductor device using an soi substrate
04/25/2002US20020047156 DRAM cell array and fabrication method thereof
04/25/2002US20020047154 Interdigitated multilayer capacitor structure for deep sub-micron CMOS
04/25/2002US20020047153 Semiconductor integrated circuit device and method of manufacturing the same
04/25/2002US20020047152 Semiconductor integrated circuit device and process for manufacturing the same
04/25/2002US20020047151 Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same
04/25/2002US20020047150 Semiconductor integrated circuit device and method for manufacturing the same
04/25/2002US20020047148 Methods of manufacturing integrated circuit capacitors having ruthenium upper electrodes and capacitors formed thereby
04/25/2002US20020047147 Semiconductor device and process for producing the semiconductor device
04/25/2002US20020047146 Ferroelectric memory device and manufacturing method thereof
04/25/2002US20020047145 MRAM device including spin dependent tunneling junction memory cells
04/25/2002US20020047144 Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides
04/25/2002US20020047143 Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
04/25/2002US20020047142 Structures comprising silicon nitride
04/25/2002US20020047141 Semiconductor device, and manufacture thereof
04/25/2002US20020047140 Arrangement in a power mosfet
04/25/2002US20020047139 Solid state image pickup device and its driving method
04/25/2002US20020047138 Nonvolatile semiconductor memory
04/25/2002US20020047135 P-N junction-based structures utilizing HVPE grown III-V compound layers
04/25/2002US20020047133 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal dispaly using the chip carrier film
04/25/2002US20020047127 P-N homojunction-based structures utilizing HVPE grown III-V compound layers
04/25/2002US20020047125 SiC semicoductor device
04/25/2002US20020047123 Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
04/25/2002US20020047122 Polycrystalline silicon layer, its growth method and semiconductor device
04/25/2002US20020047119 Image-pickup semiconductor device having a lens, a light-receiving element and a flexible substrate therebetween with a shading plate blocking undesired light rays
04/25/2002US20020047118 Method for producing semiconductor device
04/25/2002US20020047117 Technique for attaching die to leads
04/25/2002US20020047116 Coil for sputter deposition
04/25/2002US20020047113 Semiconductor device
04/25/2002US20020047111 Semiconductor device having a ferroelectric capacitor with tensile stress properties
04/25/2002US20020047098 Substrate defect inspection method and substrate defect inspection system
04/25/2002US20020047096 Electron beam exposure apparatus, electron lens, and device manufacturing method
04/25/2002US20020047095 Method and device for correcting pattern film on a semiconductor substrate
04/25/2002US20020047089 Optical proximity effect correcting method and mask data forming method in semiconductor manufacturing process, which can sufficiently correct optical proximity effect, even under various situations with regard to size and shape of design pattern, and space width and position relation between design patterns
04/25/2002US20020047004 System and method for thermal processing of a semiconductor substrate
04/25/2002US20020046997 Method and apparatus for cutting a non-metal substrate by using a laser beam
04/25/2002US20020046992 Plasma resistant quartz glass jig
04/25/2002US20020046990 Enhanced cooling IMP coil support
04/25/2002US20020046989 RF matching network with distributed outputs
04/25/2002US20020046987 Device and method for etching a substrate by using an inductively coupled plasma
04/25/2002US20020046986 Selective ratios do not cause shape defects
04/25/2002US20020046946 In-line sputtering apparatus
04/25/2002US20020046945 High performance magnetron for DC sputtering systems
04/25/2002US20020046874 Thin film metal barrier for electrical interconnections
04/25/2002US20020046860 Reflow encapsulant
04/25/2002US20020046854 Ball grid array semiconductor package with exposed base layer
04/25/2002US20020046810 Processing apparatus
04/25/2002US20020046809 Placing the semiconductor wafer inside the vacuum plasma etching device, selectively exposing the photoresist pattern to ultraviole light while the semiconductor wafer is inside the vacuum plasma etching device, etching the wafer
04/25/2002US20020046808 Plasma processing apparatus
04/25/2002US20020046807 Plasma processing apparatus
04/25/2002US20020046804 Process for making semiconductor chip assembly
04/25/2002US20020046775 Gas panel
04/25/2002US20020046765 Photovoltaic cell and process for producing the same
04/25/2002US20020046764 PV/thermal solar power assembly
04/25/2002US20020046760 Wafer container washing apparatus
04/25/2002US20020046757 A cleaning solution for cleaning substrate consists of ammonium fluoride or mixed with hydrofluroic acid, dipping and cleaning substrate by above solution, adding replenishing liquid selected from water, ammonia and aqueous ammonia
04/25/2002US20020046707 High pressure processing chamber for semiconductor substrate
04/25/2002US20020046706 Method of holding substrate and substrate holding system
04/25/2002US20020046705 Atomic layer doping apparatus and method
04/25/2002US20020046704 Infra-red transparent thermal reactor cover member
04/25/2002US20020046694 Single crystalline silicon wafer, ingot, and producing method thereof
04/25/2002US20020046693 Nitride semiconductor growth method, nitride semiconductor substrate, and nitride semiconductor device
04/25/2002US20020046460 Die packing device and die bonding apparatus
04/25/2002US20020046450 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
04/25/2002US20020046435 Polishing cloth and method of manufacturing semiconductor device using the same
04/25/2002US20020046434 Cleaning member, cylindrical cleaning element of cleaning member, methods for producing cleaning member and cylindrical cleaning element, and tool for enlarging diameter of cylindrical cleaning element
04/25/2002EP1145159A3 Block based design methodology