Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2002
07/04/2002US20020084480 Top electrode in a strongly oxidizing environment
07/04/2002US20020084479 High density capacitor using topographic surface
07/04/2002US20020084478 Funnel shaped structure in polysilicon
07/04/2002US20020084477 Semiconductor integrated circuit device and the process of manufacturing the same
07/04/2002US20020084476 Methods for manufacturing semiconductor devices and semiconductor devices
07/04/2002US20020084474 Back illuminated imager with enhanced UV to near IR sensitivity
07/04/2002US20020084473 Method for forming contact hole and spacer of semiconductor device
07/04/2002US20020084471 Integrated circuit capacitors having a dielectric layer between a u-shaped lower electrode and a support layer and methods of fabricating the same
07/04/2002US20020084470 Semiconductor device and semiconductor device assembly
07/04/2002US20020084467 Nitride semiconductor device with reduced polarization fields
07/04/2002US20020084465 Thin-film transistors and method for producing the same
07/04/2002US20020084461 Structure and method for fabricating III-V nitride devices utilizing the formation of a compliant substrate
07/04/2002US20020084460 Thin film transistor matrix device and method for fabricating the same
07/04/2002US20020084457 Semiconductor device having embedded array
07/04/2002US20020084456 Multilayered wiring board and production method thereof
07/04/2002US20020084455 Transparent and conductive zinc oxide film with low growth temperature
07/04/2002US20020084450 Semiconductor device and method for fabricating a semiconductor device
07/04/2002US20020084428 Extreme ultraviolet radiation transparent structure in a vacuum chamber wall, e.g. for use in a lithographic projection apparatus
07/04/2002US20020084427 Method and apparatus for improved ion acceleration in an ion implantation system
07/04/2002US20020084425 Self-cleaning optic for extreme ultraviolet lithography
07/04/2002US20020084424 Windows used in thermal processing chambers
07/04/2002US20020084422 Particle-optical component and system comprising a particle-optical component
07/04/2002US20020084419 X-ray detecting device and fabricating method thereof
07/04/2002US20020084411 Substrate inspection system and method for controlling same
07/04/2002US20020084402 Facilities connection bucket for pre-facilitation of wafer fabrication equipment
07/04/2002US20020084315 Ball bumping substrates, particuarly wafers
07/04/2002US20020084311 Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
07/04/2002US20020084308 Method, apparatus and computer readable medium for evaluating configuration of solder external terminals of a semiconductor device
07/04/2002US20020084265 Electric outfit room in microwave oven
07/04/2002US20020084261 Heat treatment apparatus and method of manufacturing a semiconductor device
07/04/2002US20020084257 Intergrated low k dielectrics and etch stops
07/04/2002US20020084256 Method of forming high aspect ratio apertures
07/04/2002US20020084255 Plasma processing method
07/04/2002US20020084254 Srbi2nb2o9 containing no lead nor lead compounds
07/04/2002US20020084250 Method for forming a passivation on berry diffusion layer of a non-volatile memory
07/04/2002US20020084249 Methods of fabricating microelectromechanical and microfluidic devices
07/04/2002US20020084242 Methods of fabricating microelectromechanical and microfluidic devices
07/04/2002US20020084220 Recovering a copper component from a cleaning agent that has been used for removing a phosphine or a silane contained as a harmful component in a harmful gas.
07/04/2002US20020084193 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound
07/04/2002US20020084192 Depositing a phosphorus doped seed layer on a conductive substrate, and then depositing a conductive metal layer on the phosphorus doped seed layer to form a conductive film.
07/04/2002US20020084191 Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same
07/04/2002US20020084182 Connecting the metal film on a wafer and/or a stage to a ground; and forming a metal oxide film on said wafer using the sputtering process while said metal film is being grounded.
07/04/2002US20020084181 Alternate steps of IMP and sputtering process to improve sidewall coverage
07/04/2002US20020084036 Susceptor with internal support
07/04/2002US20020084034 Dry etching apparatus and a method of manufacturing a semiconductor device
07/04/2002US20020084033 Apparatus having platforms positioned for precise centering of semiconductor wafers during processing
07/04/2002US20020084032 Multiple chamber vacuum processing system configuration for improving the stability of mark shielding process
07/04/2002US20020084019 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A
07/04/2002US20020084000 A method of creating flat, crack-free low-dislocation-density mismatched semiconductor layers.
07/04/2002US20020083984 System for and method of monitoring the flow of semiconductor process gases from a gas delivery system
07/04/2002US20020083967 Used in magnetic disk or integrated circuit manufacturing.
07/04/2002US20020083961 Method and apparatus for cleaning semiconductor wafer
07/04/2002US20020083960 Apparatus and methods for processing a workpiece
07/04/2002US20020083959 Method for removing foreign matter, method for forming film, semiconductor device and film forming apparatus
07/04/2002US20020083957 Translating the reticle within the lithography system; directing an ionized gas (especially N2) onto a mask surface of the reticle; and removing contaminants from the mask surface of the reticle.
07/04/2002US20020083938 Techniques for dicing substrates during integrated circuit fabrication
07/04/2002US20020083899 Film-forming device with a substrate rotating mechanism
07/04/2002US20020083889 Thermal annealing process for producing low defect density single crystal silicon
07/04/2002US20020083886 Cruicible and growth method for polycrystal silicon using same
07/04/2002US20020083849 Method of press-working inorganic substrate and press machine therefor
07/04/2002US20020083810 In-process tape bur monitoring
07/04/2002US20020083650 Polishing of semiconductor substrates
07/04/2002US20020083614 Lockdown rotor for a processing machine
07/04/2002US20020083583 Device for handling components
07/04/2002US20020083577 Polishing member and apparatus
07/04/2002US20020083571 Method for producing metal sputtering target
07/04/2002US20020083557 Sequential lateral solidification apparatus includes a laser generator; X-Y stage movable in two orthogonal axial directions; and a mask between the laser generator and the X-Y stage.
07/04/2002DE10164606A1 Flip chip semiconductor device for integrated circuit has signal connection surfaces arranged outside energy lead connection surfaces
07/04/2002DE10164585A1 Halbleitereinrichtung mit Anschlussstreifenelektrode einer Mehrlagenstruktur A semiconductor device with a multi-layer strip electrode connection structure
07/04/2002DE10162576A1 Ätzmittel und Ätzverfahren für Flüssigkristallanzeigevorrichtungen Etchant and etching processes for liquid crystal display devices
07/04/2002DE10159762A1 Halbleiterspeicher Semiconductor memory
07/04/2002DE10158706A1 Semiconductor device e.g. metal oxide semiconductor transistor, has gate electrode with polysilicon layer having reverse tapering portion to enlarge distance between gate electrode and contact plug
07/04/2002DE10143239A1 Verfahren zur Herstellung einer Membranmaske A method for producing a membrane mask
07/04/2002DE10143231A1 Einkristalliner Siliziumwafer, Rohling und Herstellungsverfahren derselben Monocrystalline silicon wafer, blank and manufacturing method thereof
07/04/2002DE10140826A1 Processing a thin semiconductor wafer comprises heat treating the rear side of the wafer, applying a metal-based bonding covering layer, contacting the rear side substrate with wafer forming conducting side, etc.
07/04/2002DE10136246A1 Halbleitervorrichtung mit kapazitivem Element und Verfahren zu ihrer Herstellung A semiconductor device having a capacitive element and process for its preparation
07/04/2002DE10131716A1 Verfahren zur Herstellung eines Kondensators für eine Halbleiterspeichervorrichtung durch eine zweistufige Thermalbehandlung A method of manufacturing a capacitor for a semiconductor memory device by a two stage thermal treatment
07/04/2002DE10107923A1 Integrated SOI semiconductor circuit comprises an active transistor region, an active contact region, a semiconductor residual layer formed over a trenched insulating layer
07/04/2002DE10065723A1 Anordnung zur Temperaturmessung und -regelung Arrangement for temperature measurement and control
07/04/2002DE10065027A1 Wäßrige Dispersion, Verfahren zu deren Herstellung und Verwendung An aqueous dispersion, a process for their preparation and use
07/04/2002DE10064685A1 Lithographieobjektiv mit einer ersten Linsengruppe, bestehend ausschließlich aus Linsen positiver Brechkraft Lithography lens with a first lens group consisting exclusively of lenses having a positive refractive power
07/04/2002DE10064494A1 Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement, wobei das Halbleiterbauelement insbesondere eine bewegliche Masse aufweist A process for producing a semiconductor device as well as a product produced by the process semiconductor device, wherein the semiconductor component comprises in particular a movable mass
07/04/2002DE10064479A1 Verfahren zur Herstellung eines mikroelektronischen Bauelements A process for producing a microelectronic device
07/04/2002DE10064478A1 Verfahren zur Prüfung einer integrierten Schaltung A method for testing an integrated circuit
07/04/2002DE10064456A1 Maskless process for forming metallic nanostructure in thin dielectric layers uses ultrashort wavelength laser pulses
07/04/2002DE10064448A1 Verfahren zum Aufrauhen eines Halbleiterchips für die Optoelektronik A method of roughening of a semiconductor chip for optoelectronics
07/04/2002DE10063907A1 Detektor zum Detektieren von elektromagnetischer Strahlung Detector for detecting electromagnetic radiation,
07/04/2002DE10063600A1 Process for etching a wafer using an aqueous solution of sulfuric acid and hydrogen peroxide comprises removing a sample from a wafer processing tank, and comparing the concentration of hydrogen fluoride in the solution in the sample
07/04/2002DE10063443A1 Production of an electrode of a semiconductor element used in the production of power transistors, especially power FETs comprises preparing a semiconductor body (10) having a first zone
07/04/2002DE10063041A1 Verfahren zum Herstellen einer integrierten Schaltung A method of fabricating an integrated circuit
07/04/2002DE10062639A1 Production of conducting pathways, especially aluminum pathways used in CMOS circuits or DRAM cells comprises applying an aluminum conducting layer, a titanium nitride layer and a lacquer mask onto a substrate, and structuring
07/04/2002DE10062245A1 Nichtflüchtige Halbleiterspeicherzelle sowie dazugehörige Halbleiterschaltungsanordnung und Verfahren zu deren Herstellung A non-volatile semiconductor memory cell as well as related semiconductor circuit arrangement, and processes for their preparation
07/04/2002DE10062014A1 Process for thinning and separating selected regions of thin sheets and sheetlike semiconductor workpieces uses etch resistant layer
07/04/2002CA2433153A1 Method for eliminating reaction between photoresist and organosilicate glass
07/03/2002EP1220574A2 Electric outfit room in microwave oven
07/03/2002EP1220569A2 Heating device assembly and method
07/03/2002EP1220393A2 Semiconductor laser device having InGaAs compressive-strain active layer, GaAsP tensile-strain barrier layers and InGaP optical waveguide layers
07/03/2002EP1220336A2 Separation method for Gallium Nitride devices on lattice-mismatch substrates
07/03/2002EP1220333A2 Method for fabricating semiconductor, method for fabricating semiconductor substrate, and semiconductor light emitting device
07/03/2002EP1220330A1 A method of producing a semiconductor layer on a substrate