Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2002
07/11/2002WO2002053796A1 Methods of sputtering using krypton
07/11/2002WO2002053795A1 Device and method for deposition, electron beam exposure device, deflecting device, and method of manufacturing deflecting device
07/11/2002WO2002053794A1 Carbonitride coated component of semiconductor processing equipment and method of manufacturing thereof
07/11/2002WO2002053480A1 Feeder for polyhedron inspection, and polyhedron inspector
07/11/2002WO2002053338A1 Method of laminating green sheet
07/11/2002WO2002053324A1 Polishing pad and method of use thereof
07/11/2002WO2002053322A2 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
07/11/2002WO2002053320A2 Wafer support for chemical mechanical planarization
07/11/2002WO2002053300A1 Method and apparatus for critical flow particle removal
07/11/2002WO2002053273A2 Process and apparatus for blending and distributing a slurry solution
07/11/2002WO2002052979A1 Gel-form lipstick
07/11/2002WO2002037343A8 Method and apparatus for physical budgeting during rtl floorplanning
07/11/2002WO2002027779A3 Singulation of semiconductor packages by tie bar cutting
07/11/2002WO2002027402A3 Illumination system particularly for microlithography
07/11/2002WO2002027400A3 Illumination system particularly for microlithography
07/11/2002WO2002025374A3 Antireflective composition
07/11/2002WO2002023616A8 Integrating metal with ultra low-k dielectrics
07/11/2002WO2002021592A3 Method for producing an electroconductive layer on the wall of through holes in a substrate
07/11/2002WO2002019336A3 Mtj mram parallel-parallel architecture
07/11/2002WO2002015280B1 Thick oxide layer on bottom of trench structure in silicon
07/11/2002WO2002015277A8 Dense arrays and charge storage devices, and methods for making same
07/11/2002WO2002013236A3 Method and apparatus for removing unwanted substance from semiconductor wafer
07/11/2002WO2002012589A3 Barrier layer structure for copper metallization and method of forming the structure
07/11/2002WO2002011183B1 Shape accuracy improvement using a novel calibration approach
07/11/2002WO2002005316B1 Wafer container washing apparatus
07/11/2002WO2001097279A3 Method and apparatus for using scatterometry to perform feedback and feed-forward control
07/11/2002WO2001091181A3 Liner materials
07/11/2002WO2001050525A3 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
07/11/2002WO2001046999A3 Method and apparatus for supercritical processing of a workpiece
07/11/2002WO2001040145A3 Power assisted automatic supervised classifier creation tool for semiconductor defects
07/11/2002WO2001014227A9 Material delivery system for clean room environments
07/11/2002WO2000079257A9 Molecular and atomic scale evaluation of biopolymers
07/11/2002WO2000073396A9 Slurry composition and method of chemical mechanical polishing using same
07/11/2002WO2000067951A9 Optical endpoint detection during chemical mechanical planarization
07/11/2002WO2000055573A9 Systems and methods for characterizing and correcting cyclic errors in distance measuring and dispersion interferometry
07/11/2002US20020091978 Method for reducing leakage current of LSI
07/11/2002US20020091465 Vacuum processing apparatus and semiconductor manufacturing line using the same
07/11/2002US20020090895 Abrasive, method of polishing target member and process for producing semiconductor device
07/11/2002US20020090894 Method for polishing a semiconductor substrate member
07/11/2002US20020090888 Method of fabricating semiconductor device and polishing apparatus used therefor
07/11/2002US20020090887 Polishing pad with built-in optical sensor
07/11/2002US20020090884 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
07/11/2002US20020090843 Socket structure for grid array (GA) packages
07/11/2002US20020090837 Method of manufacturing a semiconductor device having contact pads
07/11/2002US20020090836 Wafer processing system
07/11/2002US20020090835 Methods and materials for depositing films on semiconductor substrates
07/11/2002US20020090834 Method for depositing silicon dioxide on a substrate surface using hexamethyldisiloxane (HMDSO) as a precursor gas
07/11/2002US20020090833 Recess formed selectively in a main surface of insulating film including an alkylsilane bond; and a surface protective layer including Si-H bond, being formed in a surface of said insulating film in an inner wall of said recess.
07/11/2002US20020090832 Method for forming micro-pattern of semiconductor device
07/11/2002US20020090831 Thin-film circuit substrate and method of producing same
07/11/2002US20020090830 Semiconductor device and method for manufacturing the same
07/11/2002US20020090829 ALD method to improve surface coverage
07/11/2002US20020090828 Method of reducing stress between a nitride silicon spacer and a substrate
07/11/2002US20020090827 Method of processing residue of ion implanted photoresist, and method of producing semiconductor device
07/11/2002US20020090826 Plasma processing method
07/11/2002US20020090825 Method of manufacturing a semiconductor device
07/11/2002US20020090824 Self-aligned collar and strap formation for semiconductor devices
07/11/2002US20020090822 Plasma treatment of low-k dielectric films to improve patterning
07/11/2002US20020090821 Hardening of copper to improve copper CMP performance
07/11/2002US20020090820 Tantalum removal during chemical mechanical polishing
07/11/2002US20020090819 Windowless belt and method for improved in-situ wafer monitoring
07/11/2002US20020090818 Apparatus and method for surface finishing a silicon film
07/11/2002US20020090817 Method for selectively etching silicon and/or metal silicides
07/11/2002US20020090816 Cantilever epitaxial process
07/11/2002US20020090814 Method for forming interconnects and semiconductor device
07/11/2002US20020090813 Method for forming a dual damascene opening by liquid phase deposition
07/11/2002US20020090812 Method for forming trench
07/11/2002US20020090811 Method of fabricating metal lines in a semiconductor device
07/11/2002US20020090810 Method of forming interconnectings in semiconductor devices
07/11/2002US20020090809 Method of manufacturing semiconductor device having passivation film and buffer coating film
07/11/2002US20020090808 Method of manufacturing a self-aligned contact from a conductive layer that is free of voids
07/11/2002US20020090807 Method for forming a line of semiconductor device
07/11/2002US20020090806 Copper dual damascene interconnect technology
07/11/2002US20020090805 Electroplating method of fabrication of the solder bumps which method does not damage air bridges, micro-electromechanical structures, or optical surfaces that can be otherwise damaged
07/11/2002US20020090804 Copper interconnect for an integrated circuit and methods for its fabrication
07/11/2002US20020090802 Safe arsenic gas phase doping
07/11/2002US20020090801 Single crystal TFT from continuous transition metal delivery method
07/11/2002US20020090800 Electronic apparatus and manufacturing method for an electronic apparatus
07/11/2002US20020090799 Substrate grinding systems and methods to reduce dot depth variation
07/11/2002US20020090798 Contact structure of substrates of touch panel and method of bonding the same
07/11/2002US20020090797 Method for protecting insulation corners of shallow trenches by oxidation of poly silicon
07/11/2002US20020090796 Silicon layer to improve plug filling by CVD
07/11/2002US20020090795 Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
07/11/2002US20020090794 Air gap semiconductor structure and method of manufacture
07/11/2002US20020090793 Method for fabricating a semiconductor device
07/11/2002US20020090792 Method for forming inner-cylindrical capacitor without top electrode mask
07/11/2002US20020090791 Method for reduced capacitance interconnect system using gaseous implants into the ild
07/11/2002US20020090789 Semiconductor device and method for fabricating the same
07/11/2002US20020090788 Method for independent control of polycrystalline silicon-germanium in a silicon-germanium HBT and related structure
07/11/2002US20020090787 Self-aligned elevated transistor
07/11/2002US20020090786 Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad and integrated circuit devices formed thereby
07/11/2002US20020090785 Buried bit line memory circuitry
07/11/2002US20020090784 Method for manufacturing a semiconductor device
07/11/2002US20020090783 Use of atomic oxidation for fabrication of oxide-nitride-oxide stack for flash memory devices
07/11/2002US20020090782 Method of manufacturing a semiconductor memory device having a capacitor with improved dielectric layer
07/11/2002US20020090781 DRAM cell with high integration density, and associated method
07/11/2002US20020090780 Vertical MOSFET
07/11/2002US20020090779 Method for forming lower electrode of cylinder-shaped capacitor preventing twin bit failure
07/11/2002US20020090778 Method for fabricating a cylinder-type capacitor for a semiconductor device
07/11/2002US20020090777 Methods of forming capacitor structures, and capacitor structures