Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2002
07/11/2002US20020090776 Insulating film formation method, semiconductor device, and production apparatus
07/11/2002US20020090775 Method and composite for decreasing charge leakage
07/11/2002US20020090774 Bottom gate-type thin-film transistor and method for manufacturing the same
07/11/2002US20020090773 Aluminum nitride and aluminum oxide/aluminum nitride heterostructure gate dielectric stack based field effect transistors and method for forming same
07/11/2002US20020090772 Method for manufacturing semiconductor lamination, method for manufacturing lamination, semiconductor device, and electronic equipment
07/11/2002US20020090771 Self-align offset gate structure and method of manufacture
07/11/2002US20020090770 Semiconductor device and method for forming the same
07/11/2002US20020090769 Liquid crystal device, liquid crystal display panel and method for manufacturing the same
07/11/2002US20020090768 Ground-plane device with back oxide topography
07/11/2002US20020090767 Method of fabricating a gate dielectric layer for a thin film transistor
07/11/2002US20020090766 Method for crystallizing silicon film and thin film transistor and fabricating method using the same
07/11/2002US20020090765 Method of manufacturing a semiconductor device
07/11/2002US20020090764 Semiconductor device and method of manufacturing the same
07/11/2002US20020090763 Method of forming a substrate contact electrode in a SOI wafer
07/11/2002US20020090759 Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment
07/11/2002US20020090758 Method and resulting device for manufacturing for double gated transistors
07/11/2002US20020090757 Semiconductor device and method of manufacturing the same
07/11/2002US20020090756 Semiconductor device and method of manufacturing the same
07/11/2002US20020090754 Interconnect assembly and z-connection method for fine pitch substrates
07/11/2002US20020090752 Semiconductor device, and apparatus and method for die bonding the same
07/11/2002US20020090750 Underfill system for semiconductor package
07/11/2002US20020090748 Pinned photodiode structure in a 3T active pixel sensor
07/11/2002US20020090746 Method and system for detecting metal contamination on a semiconductor wafer
07/11/2002US20020090745 Rule to determine CMP polish time
07/11/2002US20020090743 Method of measuring meso-scale structures on wafers
07/11/2002US20020090742 Ferroelectric film formed above first electrode, and a second electrode formed above ferroelectric film; intermediate layer of perovskite crystal structure formed at boundaries between electrodes and ferroelectric film
07/11/2002US20020090735 Protection of semiconductor fabrication and similar sensitive processes
07/11/2002US20020090589 Method of adhering wafer and wafer adhering device
07/11/2002US20020090577 Method for forming-photoresist mask
07/11/2002US20020090576 Resist surface of the exposed (or unexposed) area is silylated while the unexposed (or exposed) area is not silylated; reactive ion etching to do dry development after exposure and silylation of a photoresist pattern.
07/11/2002US20020090574 Polymers and use thereof
07/11/2002US20020090570 Positive-working chemical-amplification photoresist composition
07/11/2002US20020090569 Radiation-sensitive resin composition
07/11/2002US20020090568 Prepared from acetoxystyrene and either 5-benzofuranonyl (meth)acrylate or 3-hydroxy-4-chromenon-6-yl (meth)acrylate
07/11/2002US20020090567 Terpolymer of 50-85% of (a) hydroxyl group-containing styrene units, 15-35% of (b) styrene units, and 2-20% of (c) tert-butyl (meth)acrylate units; and 1-20 parts by weight of a radiation-sensitive acid-generating agent
07/11/2002US20020090565 Methods and apparatus for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging
07/11/2002US20020090564 Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate.
07/11/2002US20020090558 For protecting a reticle, on which a circuit pattern is formed for manufacturing a semiconductor device, from an attachment of a foreign matter
07/11/2002US20020090557 Mask and method of manufacturing semiconductor device
07/11/2002US20020090518 Inhibiting polarization mode dispersion of lithography light utilizing low birefringence mask blanks and photomasks; for manufacturing integrated circuits with deep ultraviolet wavelengths; semiconductors
07/11/2002US20020090484 Plating bath
07/11/2002US20020090455 Plasma generation chamber is divided from a deposition chamber, radicals are extracted plasma generation chamber to the deposition chamber and caused to react with a process gas
07/11/2002US20020090452 Terpolymer of units 9-anthracenemethylimineethyl acrylate, 2-hydroxyethyl acrylate, and 9-anthracenemethyl methacrylate; semiconductors
07/11/2002US20020090450 Method for fabricating a precious-metal electrode
07/11/2002US20020090413 Molds for wafer scale molding of protective caps
07/11/2002US20020090310 Vacuum exhaust apparatuses and vacuum exhaust methods
07/11/2002US20020090288 Single drive aligner elevation apparatus for an integrated circuit handler
07/11/2002US20020090287 Frictionless transport apparatus and method
07/11/2002US20020090284 Loading and unloading station for semiconductor processing installations
07/11/2002US20020090283 Flexible material comprising film of high temperature stable polymeric material bonded to fabric of nonmetallic fibers by flame retardant adhesive; combination has specified thickness and flammability, flame propagation or burnthrough value
07/11/2002US20020090282 Actuatable loadport system
07/11/2002US20020090167 Electronic device having a barrier region including aluminum and a method of manufacture therefor
07/11/2002US20020090162 Electronic device and optical transmission module
07/11/2002US20020090128 Hardware configuration for parallel data processing without cross communication
07/11/2002US20020090057 X-ray system
07/11/2002US20020090054 Apparatus and method for containing debris from laser plasma radiation sources
07/11/2002US20020089889 Charge pump circuit and operation method of a nonvolatile memory using the same
07/11/2002US20020089888 Sense amplifier control circuit of semiconductor memory device
07/11/2002US20020089881 High speed semiconductor memory device with short word line switching time
07/11/2002US20020089874 Thermally-assisted switching of magnetic memory elements
07/11/2002US20020089871 Ferroelectric memory devices with memory cells in a row connected to different plate lines
07/11/2002US20020089870 Ferroelectric memory
07/11/2002US20020089836 Injection molded underfill package and method of assembly
07/11/2002US20020089832 Semiconductor package with flash-proof device
07/11/2002US20020089811 Capacitor using high dielectric constant film for semiconductor memory device and fabrication method therefor
07/11/2002US20020089810 Integrated thin film capacitor/inductor/interconnect system and method
07/11/2002US20020089755 Apparatus and method for laser radiation
07/11/2002US20020089734 Apparatus, system, and method for active compensation of aberrations in an optical system
07/11/2002US20020089677 Apparatus for monitoring intentional or unavoidable layer depositions and method
07/11/2002US20020089657 Stage devices configured for use in a vacuum environment of a charged-particle-beam microlithography apparatus
07/11/2002US20020089655 Substrate transport apparatus and method
07/11/2002US20020089654 Projection exposure apparatus and device manufacturing method using the same
07/11/2002US20020089652 Exposure control apparatus in a lithography system and method thereof
07/11/2002US20020089628 Reflection type liquid crystal display and a method for manufacturing the same
07/11/2002US20020089617 Liquid crystal display
07/11/2002US20020089369 Voltage conversion circuit
07/11/2002US20020089367 Circuit configuration for supplying voltage to an integrated circuit via a pad
07/11/2002US20020089343 Contact structure for electrical communication with contact targets
07/11/2002US20020089342 Method for producing a contact structure
07/11/2002US20020089340 Method for measuring reticle leveling in stepper
07/11/2002US20020089288 Extraction and deceleration of low energy beam with low beam divergence
07/11/2002US20020089256 Surface acoustic wave device having bump electrodes and method for producing the same
07/11/2002US20020089239 Linear motor and exposure apparatus using the same
07/11/2002US20020089097 Molding of protective caps
07/11/2002US20020089096 Use of infrared radiation in molding of protective caps
07/11/2002US20020089095 Molding assembly for wafer scale molding of protective caps
07/11/2002US20020089071 Liquid epoxy resin composition and semiconductor device
07/11/2002US20020089070 Apparatus and methods for coupling conductive leads of semiconductor assemblies
07/11/2002US20020089069 Low capacitance coupling wire bonded semiconductor device
07/11/2002US20020089068 Microwave semiconductor device and the manufacturing method thereof for improve heat discharge and electric property
07/11/2002US20020089067 Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
07/11/2002US20020089066 Method and system for decapsulating a multi-chip package
07/11/2002US20020089063 Copper dual damascene interconnect technology
07/11/2002US20020089061 Semiconductor device for suppressing detachment of conductive layer and method for manufacturing the semiconductor device
07/11/2002US20020089060 Semiconductor device with porous interlayer insulating film
07/11/2002US20020089059 Semiconductor device and method for manufacturing the same
07/11/2002US20020089058 Electronic component with flexible bonding pads and method of producing such a component
07/11/2002US20020089057 Semiconductor device including a semiconductor pellet having bump electrodes to pad electrodes of an interconnect board and method for manufacturing same
07/11/2002US20020089054 Semiconductor device having a ball grid array and a fabrication process thereof
07/11/2002US20020089053 Package having array of metal pegs linked by printed circuit lines