| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/27/2002 | US20020079298 Method for processing ceramic green sheet and laser beam machine used therefor |
| 06/27/2002 | US20020079294 Plasma processing apparatus |
| 06/27/2002 | US20020079290 Water, an alkaline reagent, isopropanol and an aqueous alkaline ethylene glycol solution |
| 06/27/2002 | US20020079287 Methods of fabricating microelectromechanical and microfluidic devices |
| 06/27/2002 | US20020079276 Substrate positioning apparatus and exposure apparatus |
| 06/27/2002 | US20020079230 Method and apparatus for controlling thickness uniformity of electroplated layer |
| 06/27/2002 | US20020079217 Methods of treating physical vapor deposition targets |
| 06/27/2002 | US20020079195 Carrier positional displacement detecting mechanism |
| 06/27/2002 | US20020079192 Dual lane conveying apparatus |
| 06/27/2002 | US20020079056 Substrate processing unit |
| 06/27/2002 | US20020079048 Method for bonding heat sinks to overmold material |
| 06/27/2002 | US20020078980 System for processing substrate with liquid |
| 06/27/2002 | US20020078976 Method and apparatus for reducing he backside faults during wafer processing |
| 06/27/2002 | US20020078895 Plasma treatment apparatus |
| 06/27/2002 | US20020078894 Bubbler |
| 06/27/2002 | US20020078892 Substrate processing device and through-chamber |
| 06/27/2002 | US20020078891 Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage |
| 06/27/2002 | US20020078889 Apparatus and method for detecting a presence or position of a substrate |
| 06/27/2002 | US20020078882 Apparatus for forming an epitaxial silicon wafer with a denuded zone |
| 06/27/2002 | US20020078881 Sputtering a group III metal in a nitrogen or ammonia environment and depositing it on a growth surface |
| 06/27/2002 | US20020078880 Vacancy, dominsated, defect-free silicon |
| 06/27/2002 | US20020078793 Highly filled composites of powered fillers and polymer matrix |
| 06/27/2002 | US20020078778 Drive system for multiple axis robot arm |
| 06/27/2002 | US20020078770 Method for confirming alignment of a substrate support mechanism in a semiconductor processing system |
| 06/27/2002 | US20020078632 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof |
| 06/27/2002 | US20020078562 Process of fabricating a circuitzed structure |
| 06/27/2002 | US20020078561 Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof |
| 06/27/2002 | US20020078550 Manufacturing method of magnetoresistive element and film forming apparatus |
| 06/27/2002 | DE10162971A1 Chemisch verstärkende, positiv arbeitende Resistmasse Chemically amplified positive resist composition |
| 06/27/2002 | DE10160962A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 06/27/2002 | DE10157223A1 Contact electrode formation for semiconductor device manufacture, involves transferring substrate to plasma pretreatment module and deposition module, to remove bottom layer of contact hole and fill with depositing material |
| 06/27/2002 | DE10152096A1 Halbleiter-Wafer Semiconductor wafer |
| 06/27/2002 | DE10135559A1 Statische Halbleiterspeichervorrichtung mit einem Redundanzsystem The static semiconductor memory device having a redundancy system |
| 06/27/2002 | DE10135558A1 Halbleiterspeichervorrichtung und Verfahren zu deren Herstellung A semiconductor memory device and methods for their preparation |
| 06/27/2002 | DE10133244A1 Verfahren und Vorrichtung zum Herstellen einer Halbleiter-Vorrichtung und durch das Verfahren hergestellte Halbleiter-Vorrichtung Method and apparatus for manufacturing a semiconductor device produced by the method and semiconductor device |
| 06/27/2002 | DE10111803A1 Arrangement for contacting a semiconductor substrate comprises a substrate, a conducting layer, a conducting layer arranged on the conducting layer, and a contact needle inserted through the insulating layer up to the conducting layer |
| 06/27/2002 | DE10109218A1 Production of a storage capacitor used in DRAM cells comprises forming a lower capacitor electrode on a silicon base material in a self-adjusting manner so that exposed silicon |
| 06/27/2002 | DE10066053A1 Halbleiterbauelement mit erhöhter Durchbruchspannung A semiconductor device with an increased breakdown voltage |
| 06/27/2002 | DE10063492A1 Verfahren zum chemisch-mechanischen Polieren von Isolationsschichten nach der STI-Technik bei erhöhten Temperaturen A method for chemical mechanical polishing of insulating layers after the STI technology at elevated temperatures |
| 06/27/2002 | DE10063491A1 Saure Polierslurry für das chemisch-mechanische Polieren von SiO¶2¶-Isolationsschichten Acid polishing slurry for chemical mechanical polishing of SiO¶2¶ insulating layers |
| 06/27/2002 | DE10063488A1 Polierslurry für das chemisch-mechanische Polieren von Siliciumdioxid-Filmen Polishing slurry for chemical mechanical polishing of silicon dioxide films |
| 06/27/2002 | DE10063469A1 Production of an electronic chip used in transistors, capacitors and resistors comprises applying a dielectric to a semiconductor substrate, processing contact holes |
| 06/27/2002 | DE10062016A1 Contact mask made from monocrystalline silicon used in ion implantation comprises openings permeable for high energy ions arranged between the upper side of the mask and the lower side of the mask |
| 06/27/2002 | DE10062011A1 Halteeinrichtung Holding device |
| 06/27/2002 | DE10061628A1 Vorrichtung und Verfahren zum Ergreifen und Transportieren von Wafern Apparatus and method for grasping and transporting wafers |
| 06/27/2002 | DE10061580A1 Speichereinrichtung und Verfahren zu deren Betrieb Memory means and method for its operation |
| 06/27/2002 | DE10061529A1 Semiconductor component arranged in a semiconductor body used as a MOSFET comprises a source zone and a drain zone both, a body zone arranged between the source and drain zones, and a gate electrode insulated from the body via a dielectric |
| 06/27/2002 | DE10061248A1 Verfahren und Vorrichtung zur In-situ-Dekontamination eines EUV-Lithographiegerätes Method and apparatus for in situ decontamination of an EUV lithography device |
| 06/27/2002 | DE10060828A1 Semiconductor component for MOS transistor or IGBT devices has drain up configuration and edge region contact |
| 06/27/2002 | DE10060697A1 Producing semiconductor wafers used in the production of processor and storage components comprises polishing both sides of the wafer using polishing plates |
| 06/27/2002 | CA2432062A1 Apparatus and method for extracting biomass |
| 06/27/2002 | CA2431162A1 Gate length control for semiconductor chip design |
| 06/26/2002 | EP1217665A2 Structure and method for doping of III-V compounds |
| 06/26/2002 | EP1217663A1 A method of producing a semiconductor layer on a substrate |
| 06/26/2002 | EP1217661A2 Transistor circuit with varying resistance lightly doped diffused regions for electrostatic discharge ("esd") protection |
| 06/26/2002 | EP1217658A2 Process for producing high quality PZT films for ferroelectric memory integrated circuits |
| 06/26/2002 | EP1217657A1 Method of forming a buried strap in a dram cell |
| 06/26/2002 | EP1217656A1 Process for manufacturing components in a semiconductor material with reduction in the starting wafer thickness |
| 06/26/2002 | EP1217655A1 Method of handling a thin wafer |
| 06/26/2002 | EP1217654A2 Process for automatically monitoring the manufacture of integrated circuits depending on the number of process steps performed, associated units and associated program |
| 06/26/2002 | EP1217653A1 Method of fabricating an active matrix photodiode array |
| 06/26/2002 | EP1217652A1 A method for controlling interfacial oxide at a polycrystalline/monocrystalline silicon interface |
| 06/26/2002 | EP1217651A1 Acid polishing slurry for the chemical mechanical polishing of SiO2-isolation layers |
| 06/26/2002 | EP1217650A1 Polishing slurry for the chemical mechanical polishing of silicon dioxide films |
| 06/26/2002 | EP1217649A2 Method for forming insulating film between interconnect layers in microelectronic devices |
| 06/26/2002 | EP1217648A2 Method of manufacturing an interlayer dielectric layer with low dielectric constant |
| 06/26/2002 | EP1217647A1 Substrate loading apparatus |
| 06/26/2002 | EP1217646A1 Semiconductor product container and equipment for handling a semiconductor product container |
| 06/26/2002 | EP1217630A2 Test method for integrated circuit |
| 06/26/2002 | EP1217626A1 Enhancement-mode NMOS transistor |
| 06/26/2002 | EP1217485A2 Industrial machine management system |
| 06/26/2002 | EP1217450A2 Light integrator for an irradiation device |
| 06/26/2002 | EP1217449A2 Device for exposure of a peripheral area of a film circuit board |
| 06/26/2002 | EP1217448A2 Exposure method and system |
| 06/26/2002 | EP1217412A2 Lithography objective with a first lens group comprising lenses of positive power only |
| 06/26/2002 | EP1217387A2 Scintillation detector for electromagnetic radiation |
| 06/26/2002 | EP1217366A2 Structure, method of manufacturing the same and DNA separation device using the same |
| 06/26/2002 | EP1217322A2 Heat Exchanger |
| 06/26/2002 | EP1217104A2 Method of manufacturing semiconductor wafers |
| 06/26/2002 | EP1217102A2 Plating apparatus and method of managing plating liquid composition |
| 06/26/2002 | EP1216958A2 Method for production of aqueous dispersion and use thereof |
| 06/26/2002 | EP1216487A1 Semiconductor wafer level package |
| 06/26/2002 | EP1216486A1 Methods and apparatus for treating seed layer in copper interconnections |
| 06/26/2002 | EP1216485A1 Method of manufacturing a semiconductor device by using chemical mechanical polishing |
| 06/26/2002 | EP1216484A1 Method for manufacturing of a semiconductor device |
| 06/26/2002 | EP1216483A1 Electron-optical lens arrangement with an axis that can be largely displaced |
| 06/26/2002 | EP1216476A1 Self-erasing memory cell |
| 06/26/2002 | EP1216420A1 Integrated test cell |
| 06/26/2002 | EP1216419A1 Measuring probe for measuring high frequencies and a method for producing the same |
| 06/26/2002 | EP1216412A1 Method and apparatus for characterization of microelectronic feature quality |
| 06/26/2002 | EP1216125A1 A homogenization enhancing thermoplastic foam extrusion screw |
| 06/26/2002 | EP1216118A1 Polishing pad treatment for surface conditioning |
| 06/26/2002 | EP1216109A1 METHOD AND SYSTEM FOR i IN SITU /i CLEANING OF SEMICONDUCTOR MANUFACTURING EQUIPMENT USING COMBINATION CHEMISTRIES |
| 06/26/2002 | EP1216107A1 Method and apparatus for controlling air over a spinning microelectronic substrate |
| 06/26/2002 | EP1216106A1 Improved apparatus and method for growth of a thin film |
| 06/26/2002 | CN1355937A Layout and wiring scheme for memory cells with vertical transistors |
| 06/26/2002 | CN1355934A 半导体及其制造方法 The semiconductor manufacturing method thereof |
| 06/26/2002 | CN1355933A Cmos处理过程 Cmos process |
| 06/26/2002 | CN1355932A Method for preparation of epitaxial silicon wafer with intrinsic gettering |
| 06/26/2002 | CN1355931A Multilayered body, method for fabricating multilayered body and semiconductor device |