Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2002
06/26/2002CN1355930A Low temp. oxidation of conductive layers for semiconductor fabrication
06/26/2002CN1355929A Method and system for cleaning semiconductor wafer
06/26/2002CN1355892A Method of fabricating semiconductor device
06/26/2002CN1355858A Low dielectric mano-porous material obtainable from polymer decomposition
06/26/2002CN1355832A Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
06/26/2002CN1355769A Improved ceria oxide powder
06/26/2002CN1355669A Manufacturing method for ceramic sheet and used laser beam machine
06/26/2002CN1355668A Method for manufacturing metal support frame, metal support frame and its application
06/26/2002CN1355664A Light-emitting device and its driving method
06/26/2002CN1355570A LED and its preparing process
06/26/2002CN1355567A Circuit structure for integrating power distributed function of circuit and lead frame to chip surface
06/26/2002CN1355564A Semiconductor package and its making method
06/26/2002CN1355563A Substrate structure for preventing crack generation on weld shielding layer at device position
06/26/2002CN1355562A Turbolating plate with downward bent part
06/26/2002CN1355561A Technology for manufacturing flat display with film transistors
06/26/2002CN1355560A Coded tray for preserving packaged semiconductor device
06/26/2002CN1355559A Carrier for testing chip
06/26/2002CN1355558A Device for testing defect in semiconductor device and method for using said device
06/26/2002CN1355557A Structure of key size measuring strip
06/26/2002CN1355556A Semiconductor chip device and its package method
06/26/2002CN1355555A Method for generating convex welding points on semiconductor chip
06/26/2002CN1355554A Method for manufacturing thin film transistor containing crystallization silicon active layer
06/26/2002CN1355553A Technology for cutting and grinding wafer
06/26/2002CN1355552A Application of YB2 monocrystal
06/26/2002CN1355551A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/26/2002CN1355535A Method for avoiding unhoped programmed in magnetoresistive memory device
06/26/2002CN1355417A Method for measuring equivalent length of grid channel by C-V method
06/26/2002CN1086843C Semiconductor circuit and device
06/26/2002CN1086842C Semiconductor elemetn and data processing equipment used it
06/26/2002CN1086811C Photomask for the measurement of resolution of exposure equipment
06/26/2002CN1086610C Sand-blast medium and method for cleaning electronic hardware components
06/25/2002USRE37769 Contact structure provides electrical contact between two polycrystalline silicon interconnect layers; lower layer has a silicide layer on its upper surface.
06/25/2002US6412103 Routing method removing cycles in vertical constraint graph
06/25/2002US6412099 Apparatus and method for converting logical connection information of circuit
06/25/2002US6412097 Compacting method of circuit layout by moving components using margins and bundle widths in compliance with the design rule, a device using the method and a computer product enabling processor to perform the method
06/25/2002US6412095 Method and apparatus for compacting wiring layout
06/25/2002US6411859 Flow control in a semiconductor fabrication facility
06/25/2002US6411642 Techniques for fabricating and packaging multi-wavelength semiconductor laser array devices (chips) and their applications in system architectures
06/25/2002US6411549 Reference cell for high speed sensing in non-volatile memories
06/25/2002US6411547 Nonvolatile memory cell and method for programming and/or verifying the same
06/25/2002US6411518 High-density mounted device employing an adhesive sheet
06/25/2002US6411492 Structure and method for fabrication of an improved capacitor
06/25/2002US6411490 Integrated power modules for plasma processing systems
06/25/2002US6411426 Apparatus, system, and method for active compensation of aberrations in an optical system
06/25/2002US6411391 Crystal section shape measuring method
06/25/2002US6411386 Aligning apparatus and method for aligning mask patterns with regions on a substrate
06/25/2002US6411377 Optical apparatus for defect and particle size inspection
06/25/2002US6411365 Exposure method and exposure apparatus
06/25/2002US6411351 Active matrix type display device comprising a discharge pattern or a short ring and method of manufacturing the same
06/25/2002US6411350 Method of manufacturing an electrode substrate resistant to wire breakage for an active matrix display device
06/25/2002US6411349 Semiconductor device, display apparatus using such devices and method of manufacturing such an apparatus as well as that of manufacturing such an apparatus
06/25/2002US6411243 Mode control circuit
06/25/2002US6411160 Semiconductor integrated circuit device
06/25/2002US6411157 Self-refresh on-chip voltage generator
06/25/2002US6411155 Power integrated circuit
06/25/2002US6411116 Method for testing a product integrated circuit wafer using a stimulus integrated circuit wafer
06/25/2002US6411070 Power control apparatus for timely powering down individual circuit block
06/25/2002US6411023 Vacuum processing apparatus and ion pump capable of suppressing leakage of ions and electrons from ion pump
06/25/2002US6410991 Semiconductor device and method of manufacturing the same
06/25/2002US6410989 Chip-scale package
06/25/2002US6410987 Semiconductor device and a method of manufacturing the same and an electronic device
06/25/2002US6410985 Silver metallization by damascene method
06/25/2002US6410984 Conductive structure in an integrated circuit
06/25/2002US6410979 Ball-grid-array semiconductor device with protruding terminals
06/25/2002US6410976 Integrated circuitry having conductive passageway interconnecting circuitry on front and back surfaces of a wafer fragment
06/25/2002US6410975 Bipolar transistor with reduced base resistance
06/25/2002US6410974 Simplified high Q inductor substrate
06/25/2002US6410973 Thin film SOI MOSFET
06/25/2002US6410972 Standard cell having a special region and semiconductor integrated circuit containing the standard cells
06/25/2002US6410969 Thin film transistor and method of manufacturing the same
06/25/2002US6410968 Semiconductor device with barrier layer
06/25/2002US6410967 Transistor having enhanced metal silicide and a self-aligned gate electrode
06/25/2002US6410962 Structure for SOI wafers to avoid electrostatic discharge
06/25/2002US6410960 Hybrid integrated circuit component
06/25/2002US6410959 Method of fabricating semiconductor device
06/25/2002US6410958 Power MOSFET having laterally three-layered structure formed among element isolation regions
06/25/2002US6410957 Method of forming poly tip to improve erasing and programming speed in split gate flash
06/25/2002US6410956 Method and system for using a spacer to offset implant damage and reduce lateral diffusion in flash memory devices
06/25/2002US6410955 Comb-shaped capacitor for use in integrated circuits
06/25/2002US6410954 Multilayered capacitor structure with alternately connected concentric lines for deep sub-micron CMOS
06/25/2002US6410953 Integrated circuit device with MIM capacitance circuit
06/25/2002US6410952 MOSFET with a thin gate insulating film
06/25/2002US6410951 Structure for improving static refresh
06/25/2002US6410949 Flash memory device with monitor structure for monitoring second gate over-etch
06/25/2002US6410948 Memory cell arrays comprising intersecting slanted portions
06/25/2002US6410947 Semiconductor device and process of production of same
06/25/2002US6410946 Semiconductor device with source and drain electrodes in ohmic contact with a semiconductor layer
06/25/2002US6410945 Usable in a monolithic microwave integrated circuit for a portable telephone. for preventing the thermal runaway, it is known to change the composition ratio of aluminum in an algaas emitter layer and to provide a ballast resistor.
06/25/2002US6410944 Very high density doped p-type gaas or graded p-type al-ga-as reduces the potential barrier formed in the p-type gan, thus significantly reducing the ohmic resistance.
06/25/2002US6410939 Semiconductor light-emitting device and method of manufacturing the same
06/25/2002US6410938 Semiconductor-on-insulator device with nitrided buried oxide and method of fabricating
06/25/2002US6410937 Integrated circuit chip carrier
06/25/2002US6410936 Semiconductor device
06/25/2002US6410935 Semiconductor assisted metal deposition for nanolithography applications
06/25/2002US6410934 Silicon nanoparticle electronic switches
06/25/2002US6410928 EUV illumination system
06/25/2002US6410927 Semiconductor wafer alignment method using an identification scribe
06/25/2002US6410889 Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing system
06/25/2002US6410888 Process chamber cooling
06/25/2002US6410881 Process for manufacturing electronic circuits