Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2002
07/11/2002US20020089052 Semiconductor device and a method of manufacturing the same
07/11/2002US20020089043 Semiconductor package with shortened electric signal paths
07/11/2002US20020089042 Semiconductor leadframe for staggered board attach
07/11/2002US20020089041 Lead-frame design modification to facilitate removal of resist tape from the lead-frame
07/11/2002US20020089040 Semiconductor device having a ball grid array and a fabrication process thereof
07/11/2002US20020089038 Fully-depleted-collector silicon-on-insulator (SOI) bipolar transistor useful alone or in SOI BiCMOS
07/11/2002US20020089037 Semiconductor memory device and method for manufacturing the same
07/11/2002US20020089036 Semiconductor device, method of manufacturing the same and method of designing the same
07/11/2002US20020089035 Semiconductor integrated circuit device suppressing a junction leak and method of manufacturing the same
07/11/2002US20020089034 Isolating region forming methods
07/11/2002US20020089033 Semiconductor device and semiconductor assembly apparatus for semiconductor device
07/11/2002US20020089032 Processing method for forming dislocation-free silicon-on-insulator substrate prepared by implantation of oxygen
07/11/2002US20020089031 Novel method of body contact for SOI mosfet
07/11/2002US20020089030 Semiconductor substrate with functional circuit structures and dummy structures
07/11/2002US20020089029 Method and apparatus for integrating flash eprom and sram cells on a common substrate
07/11/2002US20020089028 High voltage breakdown isolation semiconductor device and manufacturing process for making the device
07/11/2002US20020089027 Apparatus for filling apertures in a film layer on a semiconductor structure
07/11/2002US20020089024 Magnetoresistive memory device
07/11/2002US20020089023 Low leakage current metal oxide-nitrides and method of fabricating same
07/11/2002US20020089022 Semiconductor arrangement with transistor gate insulator
07/11/2002US20020089021 Semiconductor device with an anti-doped region
07/11/2002US20020089020 N-channel metal oxide semiconductor (nmos) driver circuit and method of making same
07/11/2002US20020089019 MOSFET device
07/11/2002US20020089018 Semiconductor device
07/11/2002US20020089016 Thin layer semi-conductor structure comprising a heat distribution layer
07/11/2002US20020089013 Semiconductor device allowing electrical writing and erasing of information and method of manufacturing the same
07/11/2002US20020089012 Memory device, method of manufacturing the same, and integrated circuit
07/11/2002US20020089010 Semiconductor device comprising a non-volatile memory cell
07/11/2002US20020089009 Capacitance dielectric film and method of manufacturing the same
07/11/2002US20020089008 Method of fabricating a stacked poly-poly and MOS capacitor using a SiGe integration scheme
07/11/2002US20020089007 Vertical mosfet
07/11/2002US20020089006 Field-effect transistor and corresponding manufacturing method
07/11/2002US20020089005 Ferroelectric storage read-write memory
07/11/2002US20020089004 Multi-trench region for accumulation of photo-generated charge in a CMOS imager
07/11/2002US20020089003 Transistor in a semiconductor device and method of manufacturing the same
07/11/2002US20020089002 Nonvolatile semiconductor memory device and process for same
07/11/2002US20020089001 Power lateral diffused mos transistor
07/11/2002US20020088998 Three-dimensional memory array and method of fabrication
07/11/2002US20020088997 Integrated circuit and circuit configuration for supplying power to an integrated circuit
07/11/2002US20020088996 Memory device comprising single transistor having functions of RAM and ROM and methods for operating and manufacturing the same
07/11/2002US20020088994 Semiconductor device with a super lattice buffer
07/11/2002US20020088993 Heterojunction bipolar transistor capable of restraining the conductivity modulation of the ballast layer
07/11/2002US20020088991 Power semiconductor device containing at least one zener diode provided in chip periphery portion
07/11/2002US20020088988 Light emitting semiconductor package
07/11/2002US20020088987 Optical device and method for manufacturing the same, and electronic apparatus
07/11/2002US20020088984 Semiconductor chip mounting substrate, electrooptical device, liquid-crystal device, electroluminescent device, and electronic equipment
07/11/2002US20020088982 LCD with increased pixel opening sizes
07/11/2002US20020088979 Semiconductor laminated substrate, semiconductor crystal substrate and semiconductor device and method of manufacturing the same
07/11/2002US20020088978 Method of manufacturing an active matrix substrate
07/11/2002US20020088976 Semiconductor device and method of manufacturing the same
07/11/2002US20020088974 Method for evaulating of molding material with dams formed on a semiconductor substrate to define slits for capturing the fillers contained in the molding material
07/11/2002US20020088972 Abrupt pn junction diode formed using chemical vapor deposition processing
07/11/2002US20020088971 Semiconductor device and method of manufacturing the same
07/11/2002US20020088970 Self-assembled quantum structures and method for fabricating same
07/11/2002US20020088951 Method and apparatus for detecting aberrations in an optical system
07/11/2002US20020088950 Ion production device for ion beam irradiation apparatus
07/11/2002US20020088949 Semiconductor processing apparatus having a moving member and a force compensator therefor
07/11/2002US20020088843 Solder ball pitcher
07/11/2002US20020088797 Method and apparatus for improving exhaust gas consumption in an exhaust conduit
07/11/2002US20020088780 Control of laser machining
07/11/2002US20020088776 Plasma processing apparatus suitable for power supply of higher frequency
07/11/2002US20020088774 Variable time etching system according to the accumulated number of devices being processed and a method for etching in the same manner
07/11/2002US20020088771 Physical vapor deposition apparatus with modified shutter disk and cover ring
07/11/2002US20020088769 Method of inspecting an anisotropic etch in a microstructure
07/11/2002US20020088716 Depositing a copper alloy seed layer over a surface of a substrate, copper alloy seed layer comprising an alloying material selected from the group of aluminum, magnesium
07/11/2002US20020088715 For electroplating a metal on a semiconductor substrate; for forming electrical contacts on the semiconductor substrate using a liquid conductor
07/11/2002US20020088713 Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte
07/11/2002US20020088709 Method and apparatus for forming interconnects, and polishing liquid and polishing method
07/11/2002US20020088708 Cup type plating apparatus
07/11/2002US20020088707 Method for improving thermal stability of fluorinated amorphous carbon low dielectric constant materials
07/11/2002US20020088646 Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure
07/11/2002US20020088634 QFN package and a fabrication method thereof
07/11/2002US20020088632 Integrated circuit package including opening exposing portion of an IC
07/11/2002US20020088610 Thermal insulator having a honeycomb structure and heat recycle system using the thermal insulator
07/11/2002US20020088608 Method and apparatus for heating a wafer, and method and apparatus for baking a photoresist film on a wafer
07/11/2002US20020088558 Method and apparatus for separating composite member using fluid
07/11/2002US20020088556 Spatula for separation of thinned wafer from mounting carrier
07/11/2002US20020088548 Apparatus for generating inductively coupled plasma
07/11/2002US20020088546 Dry etching apparatus
07/11/2002US20020088545 Gas injector comprising block of ceramic material having gas injection holes extending therethrough, and etching apparatus incorporating the same
07/11/2002US20020088544 Substrate processing apparatus
07/11/2002US20020088543 Integrated system for processing semiconductor wafers
07/11/2002US20020088542 Plasma processing apparatus
07/11/2002US20020088540 Method for joining large substrates
07/11/2002US20020088537 Wafer scale molding of protective caps
07/11/2002US20020088524 System for making wallboard or backerboard sheets including aerated concrete
07/11/2002US20020088478 Holding substrate in tank and filling tank with gas mixture comprising water vapor, ozone and an additive acting as a scavenger
07/11/2002US20020088477 Process for removing chemical mechanical polishing residual slurry
07/11/2002US20020088476 Using reducing gas plasma selected from mixture of nitrogen/hydrogen or mixture of ammonia/hydrogen in vacuum chamber to clean semiconductor wafer surface
07/11/2002US20020088400 Plasma processing apparatus including a plurality of plasma processing units having reduced variation
07/11/2002US20020088399 Processing apparatus and method for processing workpiece
07/11/2002US20020088393 Coating film forming apparatus and coating film forming method
07/11/2002US20020088117 Chromium adhesion layer for copper vias in low-k technology
07/11/2002US20020088101 Method of fixing a plurality of lower members each having reference bore for installing upper member, and fixing jigs
07/11/2002US20020088069 Wafer cleaning apparatus
07/11/2002DE10162222A1 Optical test system for testing integrated circuits via optical coupling uses a device under test to hold an optical fibre in optical alignment by applying an alignment holder
07/11/2002DE10150507A1 Verbindungsverfahren und Verbindungsstruktur von Anschlussflächenelektroden und Prüfverfahren für den Verbindungszustand derselben Connection method and connection structure of pad electrodes and test methods for the connection state of the same
07/11/2002DE10148885A1 Verfahren zur Wärmebehandlung eines Halbleiterwafers und ein Halbleiterwafer, der durch dasselbe hergestellt wird A method for heat treating a semiconductor wafer and a semiconductor wafer which is prepared by the same
07/11/2002DE10134019A1 Integrierte Halbleiterschaltung A semiconductor integrated circuit
07/11/2002DE10128211C1 Storage cell used as dynamic random access memory storage cell in integrated circuits comprises a substrate with a trench containing a trench capacitor, a selectively grown epitaxial layer, a selective transistor, and a conductive contact