Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/06/2002US6427850 Electronic device workpiece carriers
08/06/2002US6427824 Overhead conveying device and overhead conveying vehicle
08/06/2002US6427748 Sample processing apparatus and method
08/06/2002US6427747 Apparatus and method of separating sample and substrate fabrication method
08/06/2002US6427717 Process solution supplying apparatus and fluid passageway opening-closing valve device for process solution supplying apparatus
08/06/2002US6427705 Simplified method for cleaning silicon wafers after application of laser marks
08/06/2002US6427703 Oxidation of carbon deposits; semiconductors
08/06/2002US6427676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
08/06/2002US6427623 Chemical vapor deposition system
08/06/2002US6427622 Hot wire chemical vapor deposition method and apparatus using graphite hot rods
08/06/2002US6427587 Method and stencil for extruding material on a substrate
08/06/2002US6427566 Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
08/06/2002US6427470 Cooling system for reducing particles pollution
08/06/2002US6427462 Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method
08/06/2002US6427359 Systems and methods for processing workpieces
08/06/2002US6427324 Inherently robust repair process for thin film circuitry using UV laser
08/06/2002CA2252926C All-metal, giant magnetoresistive, solid-state component
08/06/2002CA2211703C Test device for flat electronic assemblies
08/01/2002WO2002060229A1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
08/01/2002WO2002059985A1 Method of producing a track on a substrate
08/01/2002WO2002059981A2 Production of electrical connections in substrate openings on circuit units by means of angularly directed deposition of conducting layers
08/01/2002WO2002059980A1 Semiconductor device manufacturing method
08/01/2002WO2002059979A1 Semiconductor device
08/01/2002WO2002059976A1 Method of manufacturing a semiconductor memory device
08/01/2002WO2002059975A1 Charge-coupled device
08/01/2002WO2002059973A2 Serial mram device
08/01/2002WO2002059972A1 Semiconductor device and its manufacturing method
08/01/2002WO2002059968A2 Integrated circuits protected against reverse engineering using an apparent metal contact line terminating on field oxide and method
08/01/2002WO2002059966A1 Planarizers for spin etch planarization of electronic components and methods of use thereof
08/01/2002WO2002059963A1 Method of manufacturing a display device
08/01/2002WO2002059962A2 Viscous protective overlayers for planarization of integrated circuits
08/01/2002WO2002059961A1 Single semiconductor wafer transfer system and transfer unit
08/01/2002WO2002059960A1 Apparatus and method of inspecting semiconductor wafer
08/01/2002WO2002059959A1 Support substrate for integrated circuit chip adapted to be placed in a mould
08/01/2002WO2002059958A2 Aqueous nonferrous feedstock material for injection molding
08/01/2002WO2002059957A1 Manufacture of trench-gate semiconductor devices
08/01/2002WO2002059956A1 Method of producing electronic device material
08/01/2002WO2002059955A1 Method and device for heat treatment
08/01/2002WO2002059953A1 Conductor treating single-wafer type treating device and method for semi-conductor treating
08/01/2002WO2002059951A1 Semiconductor arrangement and method for etching a layer of said semiconductor arrangement using an etching mask containing silicon
08/01/2002WO2002059950A2 Reduction of damage in semiconductor container capacitors
08/01/2002WO2002059947A2 Carrier head for holding a wafer and allowing processing on a front face thereof to occur
08/01/2002WO2002059946A2 Method of producing soi materials
08/01/2002WO2002059945A2 Oxidized film structure and method of making epitaxial metal oxide structure
08/01/2002WO2002059944A2 Optimized liners for dual damascene metal wiring
08/01/2002WO2002059943A2 Chemical mechanical polishing of copper-oxide damascene structures
08/01/2002WO2002059941A2 A self-aligned cross-point mram device with aluminum metallization layers
08/01/2002WO2002059939A2 Method for fabricating a semiconductor device
08/01/2002WO2002059937A2 Process for etching buried cavities within silicon wafers
08/01/2002WO2002059936A2 Resistive heaters and uses thereof
08/01/2002WO2002059934A2 Plasma generation apparatus and method
08/01/2002WO2002059933A2 Vertically translatable chuck assembly and method for a plasma reactor system
08/01/2002WO2002059926A2 Fabrication of high resistivity structures using focused ion beams
08/01/2002WO2002059922A2 Ferroelectric capacitor, method for the production and use thereof
08/01/2002WO2002059905A2 Narrow-band spectral filter and the use thereof
08/01/2002WO2002059900A1 Ferroelectric nonvolatile semi-conductor memory, and its driving method
08/01/2002WO2002059899A2 Mram bit line word line architecture
08/01/2002WO2002059898A2 Mram arrangement
08/01/2002WO2002059740A1 An efficient method for modeling and simulation of the impact of local and global variation on integrated circuits
08/01/2002WO2002059738A1 Control system for transfer and buffering
08/01/2002WO2002059696A1 Method of alignment
08/01/2002WO2002059695A1 Stepper exposure dose control based upon across wafer variations in device characteristics
08/01/2002WO2002059690A1 Active matrix liquid crystal displays and methods of manufacturing such
08/01/2002WO2002059398A2 Plating apparatus and method
08/01/2002WO2002059393A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
08/01/2002WO2002059392A1 Method for growing carbon nanotubes above a base that is to be electrically contacted and a component
08/01/2002WO2002059231A2 Azeotrope-like composition of 1,2-dichloro-3,3,3-trifluoropropene and hydrogen fluoride
08/01/2002WO2002058885A1 Pressure vessel systems and methods for dispensing liquid chemical compositions
08/01/2002WO2002058876A1 Method for producing a connection, device and a power semiconductor component
08/01/2002WO2002045183A3 Substrate with semiconductor layer, electronic component, electronic circuit, printable composition and method for production thereof
08/01/2002WO2002045090A3 Circuit for non-destructive, self-normalizing reading-out of mram memory cells
08/01/2002WO2002043111A3 Method for forming and filling isolation trenches
08/01/2002WO2002039481A3 Device for detecting three-dimensional electromagnetic radiation and method for making same
08/01/2002WO2002037905A3 Mechanism for prevention of neutron radiation in ion implanter beamline
08/01/2002WO2002037557A3 Method for producing an integrated circuit, at least partially transforming an oxide layer into a conductive layer
08/01/2002WO2002033748A3 Method and apparatus for introducing an equivalent rc circuit in a mos device using resistive wells
08/01/2002WO2002033729A3 Plasma reactor with reduced reaction chamber
08/01/2002WO2002025719A3 Reduced capacitance scaled hbt using a separate base post layer
08/01/2002WO2002021590A3 Electrostatic chuck with porous regions
08/01/2002WO2002016463A3 Polymers with high internal free volume
08/01/2002WO2002015293A3 Organic field-effect transistor (ofet), a production method therefor, an integrated circuit constructed from the same and their uses
08/01/2002WO2002013234A3 Stabilized surface between a fluorosilicate glass dielectric and a liner/barrier layer
08/01/2002WO2001091451A3 Amorphous aluminum nitride emitter
08/01/2002WO2001054217A9 Fuel cell and power chip technology
08/01/2002WO2001041963A9 Systems and methods for application of atmospheric plasma surface treatment to various electronic component packaging and assembly methods
08/01/2002WO2001040085A9 Small footprint carrier front end loader
08/01/2002WO2001029847A9 Infiltrated nanoporous materials and methods of producing same
08/01/2002WO2001011666A9 Method of etching a wafer layer using multiple layers of the same photoresistant material and structure formed thereby
08/01/2002WO2001003858A9 Method and system for in situ cleaning of semiconductor manufacturing equipment using combination chemistries
08/01/2002WO2001003126A9 High density non-volatile memory device
08/01/2002WO2000075677A9 Segmented contactor
08/01/2002US20020104066 Method of performing timing-driven layout
08/01/2002US20020104064 Electronic circuit device and its design method
08/01/2002US20020104062 Validating integrated circuits
08/01/2002US20020104060 Semiconductor circuit connection data base and method of designing semiconductor circuit using the data base
08/01/2002US20020104049 Semiconductor test system and method for effectively testing a semiconductor device having many pins
08/01/2002US20020103657 Suspended particle container for an atomizer
08/01/2002US20020103571 System and method for determining robot alignment
08/01/2002US20020103564 Methods and systems for determining a composition and a thickness of a specimen
08/01/2002US20020103563 Method of manufacturing a semiconductor device and manufacturing system
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