Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/06/2002US6429101 Method of forming thermally stable polycrystal to single crystal electrical contact structure
08/06/2002US6429100 Method of manufacturing a semiconductor device
08/06/2002US6429099 Implementing contacts for bodies of semiconductor-on-insulator transistors
08/06/2002US6429098 Relaxed substrate with high germanium content having low emergent dislocation density; very low surface roughness wafers
08/06/2002US6429097 Forming thin film devices while controlling capture of argon atoms; plasma from two gases including helium and second inert gas
08/06/2002US6429096 Method of making thinned, stackable semiconductor device
08/06/2002US6429095 Semiconductor article and method of manufacturing the same
08/06/2002US6429094 Treatment process for molecular bonding and unbonding of two structures
08/06/2002US6429093 Sidewall process for forming a low resistance source line
08/06/2002US6429092 Collar formation by selective oxide deposition
08/06/2002US6429091 Patterned buried insulator
08/06/2002US6429090 Preventing charge accumulation without reducing contrast; maintaining low thermal expansion; plate, heavy metal mark of such as tantalum, tungsten or platinum and electro-conductive layer of such as titanium, chromium or aluminum
08/06/2002US6429089 Preventing chemical reduction of capacitive film; forming capacitor of such as tantalum oxide; intermediate insulation layer with contact hole plugged with electrical conductor; covering with silicon nitride film impermeable to hydrogen
08/06/2002US6429088 Method of fabricating improved capacitors with pinhole repair consideration when oxide conductors are used
08/06/2002US6429087 Methods of forming capacitors
08/06/2002US6429086 Method of depositing tungsten nitride using a source gas comprising silicon
08/06/2002US6429085 Self-aligned non-selective thin-epi-base silicon germaniun (SiGe) heterojunction bipolar transistor BiCMOS process using silicon dioxide etchback
08/06/2002US6429084 MOS transistors with raised sources and drains
08/06/2002US6429083 Removable spacer technology using ion implantation to augment etch rate differences of spacer materials
08/06/2002US6429082 Method of manufacturing a high voltage using a latid process for forming a LDD
08/06/2002US6429081 Parasitic surface transfer transistor cell (PASTT cell) for bi-level and multi-level NAND flash memory
08/06/2002US6429080 Multi-level dram trench store utilizing two capacitors and two plates
08/06/2002US6429079 Semiconductor device and manufacturing method thereof
08/06/2002US6429078 Method of manufacturing insulating-gate semiconductor device
08/06/2002US6429077 Method of forming a lateral diffused metal-oxide semiconductor transistor
08/06/2002US6429076 Flash EPROM memory cell having increased capacitive coupling and method of manufacture thereof
08/06/2002US6429075 Method of self-aligning a floating gate to a control gate and to an isolation in an electrically erasable and programmable memory cell, and a cell made thereby
08/06/2002US6429074 Semiconductor memory device and method for fabricating the same
08/06/2002US6429073 Methods for manufacturing semiconductor devices having a non-volatile memory transistor
08/06/2002US6429072 Method of forming a floating gate memory cell structure
08/06/2002US6429071 Method of increasing capacitance of memory cells incorporating hemispherical grained silicon
08/06/2002US6429070 DRAM cell constructions, and methods of forming DRAM cells
08/06/2002US6429069 SOI DRAM with buried capacitor under the digit lines utilizing a self aligning penetrating storage node contact formation
08/06/2002US6429068 Structure and method of fabricating embedded vertical DRAM arrays with silicided bitline and polysilicon interconnect
08/06/2002US6429067 Dual mask process for semiconductor devices
08/06/2002US6429066 Method for producing a polysilicon circuit element
08/06/2002US6429064 Reduced contact area of sidewall conductor
08/06/2002US6429063 NROM cell with generally decoupled primary and secondary injection
08/06/2002US6429062 Integrated-circuit manufacturing using high interstitial-recombination-rate blocking layer for source/drain extension implant
08/06/2002US6429061 Complimentary metal oxide semiconductor (cmos); producing higher perfomance device; forming a relaxed silicon germanium layer with isolation and well implant regions
08/06/2002US6429060 Method for fabricating semiconductor device
08/06/2002US6429059 Semiconductor device and method for producing it
08/06/2002US6429058 Method of forming fully self-aligned TFT improved process window
08/06/2002US6429057 Method for manufacturing thin film transistor array panel for liquid crystal display
08/06/2002US6429056 Dynamic threshold voltage devices with low gate to substrate resistance
08/06/2002US6429055 Method for making SOI MOSFETS
08/06/2002US6429054 Method of fabricating semiconductor-on-insulator (SOI) device with hyperabrupt source/drain junctions
08/06/2002US6429053 Semiconductor device method of fabricating same, and, electrooptical device
08/06/2002US6429052 Method of making high performance transistor with a reduced width gate electrode and device comprising same
08/06/2002US6429050 Fine pitch lead frame and method
08/06/2002US6429049 Laser method for forming vias
08/06/2002US6429048 Metal foil laminated IC package
08/06/2002US6429046 Flip chip device and method of manufacture
08/06/2002US6429045 Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damage
08/06/2002US6429043 Semiconductor circuitry device and method for manufacturing the same
08/06/2002US6429041 Methods of fabricating silicon carbide inversion channel devices without the need to utilize P-type implantation
08/06/2002US6429040 Polymer having a conjugated framework with functional moieties capable of solvating ions or promoting ionic charge transport; solution processable thin film
08/06/2002US6429036 Backside illumination of CMOS image sensor
08/06/2002US6429035 Method of growing silicon crystal in liquid phase and method of producing solar cell
08/06/2002US6429032 Nitride semiconductor and a method thereof, a nitride semiconductor device and a method thereof
08/06/2002US6429031 Method for forming wiring pattern of a semiconductor integrated circuit
08/06/2002US6429028 For removing integrated circuits in die form from encapsulating plastic; die can be reassembled and wires rebonded to form hermetic package
08/06/2002US6428942 Multilayer circuit structure build up method
08/06/2002US6428940 Method for pattern generation with improved image quality
08/06/2002US6428939 Enhanced bright peak clear phase shifting mask and method of use
08/06/2002US6428937 Methods for fabricating reticle blanks for use in making charged-particle-beam microlithography reticles, and reticle blanks and reticles formed using such methods
08/06/2002US6428908 Substrate of narrow and flexible strip conductor with aperture extending to tower face; deformed bond head larger than through hole
08/06/2002US6428894 Tunable and removable plasma deposited antireflective coatings
08/06/2002US6428859 Activation energy from impinging high energy ion flux; kinetic energy rather than thermal energy drives the reaction of gases; plasma power modulation or wafer bias; low temperature; higher density, superior purity and adhesion
08/06/2002US6428852 Process for coating a solid surface with a liquid composition
08/06/2002US6428741 Aluminum nitride sintered body and method of preparing the same
08/06/2002US6428732 Insert-molding method for obtaining a resin-molded product
08/06/2002US6428731 Mould part, mould and method for encapsulating electronic components mounted on a carrier
08/06/2002US6428729 Composite substrate carrier
08/06/2002US6428721 Polishing composition and polishing method employing it
08/06/2002US6428716 Subjecting material under plasma etching conditions to composition comprising specified hydrofluorocarbon etchant and different material which enhances or modifies etching characteristics of etchant; reduced global warming potential
08/06/2002US6428709 Supplying fluid including removables to first filter, depositing removables on filter surface to form second filter, filtering removables by supplying fluid to filter, applying external force to constituents of second filter to refresh it
08/06/2002US6428661 Plating apparatus
08/06/2002US6428650 Cover for an optical device and method for making same
08/06/2002US6428620 Substrate processing method and apparatus and SOI substrate
08/06/2002US6428619 Silicon wafer, and heat treatment method of the same and the heat-treated silicon wafer
08/06/2002US6428586 Transporting a backing layer to successive manufacturing stations, supplying a fluid phase polymer onto transported backing layer, shaping fluid phase polymer into surface layer having measured thickness, and curing polymer to solidify
08/06/2002US6428405 Abrasive pad and polishing method
08/06/2002US6428400 Drainage structure in polishing plant
08/06/2002US6428399 Polishing apparatus for polishing a hard material-coated wafer
08/06/2002US6428398 Method for wafer polishing and method for polishing-pad dressing
08/06/2002US6428397 Wafer edge polishing method and apparatus
08/06/2002US6428395 Method of polishing at least one surface of a silicon-based part
08/06/2002US6428393 Method of providing semiconductor wafers each having a plurality of bumps exposed from its resin coating
08/06/2002US6428392 Abrasive
08/06/2002US6428389 Polishing apparatus
08/06/2002US6428388 Finishing element with finishing aids
08/06/2002US6428387 Method for chemical mechanical polishing using a high selective slurry
08/06/2002US6428300 Ultra mold for encapsulating very thin packages
08/06/2002US6428262 Compact load lock system for ion beam processing of foups
08/06/2002US6428202 Method for inspecting connection state of electronic part and a substrate, and apparatus for the same
08/06/2002US6427991 Non-contact workpiece holder using vortex chuck with central gas flow
08/06/2002US6427903 Solder ball placement apparatus
08/06/2002US6427898 Solder bump forming method and apparatus
08/06/2002US6427897 Feed unit for moving parts