Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2002
11/07/2002US20020164885 Etching notch in intermetallic layer; reduce width
11/07/2002US20020164884 Method for thin film lift-off processes using lateral extended etching masks and device
11/07/2002US20020164883 Dielectric plates; transmitting microwaves; generating high density plasma
11/07/2002US20020164882 Process for the structuring of a substrate
11/07/2002US20020164881 Method for manufacturing semiconductor device
11/07/2002US20020164880 Apparatus and method for semiconductor wafer etching
11/07/2002US20020164878 Forming integrated circuits wafers; removal photoresist with light
11/07/2002US20020164877 Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning
11/07/2002US20020164876 Method for finishing polysilicon or amorphous substrate structures
11/07/2002US20020164875 Concurrent heating, pressurization
11/07/2002US20020164874 Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern
11/07/2002US20020164873 Process and apparatus for removing residues from the microstructure of an object
11/07/2002US20020164872 Forming connecting structures; overcoating semiconductor with metal connector; silicon carbide barrier; dielectric; multilayer
11/07/2002US20020164871 Multilayer dielectric; oxygen doping; preferential etching
11/07/2002US20020164870 Dual hardmask single damascene integration scheme in an organic low k ILD
11/07/2002US20020164869 Applying, curing multilayer dielectric
11/07/2002US20020164868 Forming oxidation resistance cap
11/07/2002US20020164867 High-frequency line
11/07/2002US20020164866 Multilayer; semiconductor substrate, dielectric and barrier electrode
11/07/2002US20020164865 Semiconductor device and manufacturing method thereof
11/07/2002US20020164864 Method of fabricating semiconductor device
11/07/2002US20020164863 Plasma enhanced liner
11/07/2002US20020164862 Electrostatic discharge protection for sensors
11/07/2002US20020164860 Multilayer; overcoating dielectric substrate; intake and drain zones
11/07/2002US20020164859 Foamed polymer insulation; high density ingrated circuits
11/07/2002US20020164858 Semiconductor device and manufacturing method thereof
11/07/2002US20020164857 Method for forming dual gate of a semiconductor device
11/07/2002US20020164856 Method of making an eeprom cell with asymmetric thin window
11/07/2002US20020164855 Method for forming nitride read only memory
11/07/2002US20020164854 Spacer patterned, high dielectric constant capacitor
11/07/2002US20020164853 Vertical gate transistors in pass transistor programmable logic arrays
11/07/2002US20020164852 Multilayer; aluminum overcoated with dielectric
11/07/2002US20020164850 Multilayer; substrate, ferroelectric dielectric barrier and interfacial oxide
11/07/2002US20020164849 Transferring structure passageways
11/07/2002US20020164848 Insertion of diffusion guard ring
11/07/2002US20020164847 Method of forming a CMOS type semiconductor device
11/07/2002US20020164846 Integrated circuit devices with high and low voltage components and processes for manufacturing these devices
11/07/2002US20020164845 Ion beam irradiation apparatus and method of igniting a plasma for the same
11/07/2002US20020164844 Stacked LDD high frequency LDMOSFET
11/07/2002US20020164843 Method of manufacturing a semiconductor device
11/07/2002US20020164842 Method for manufacturing a semiconductor device
11/07/2002US20020164841 Soi transistor with polysilicon seed
11/07/2002US20020164840 Stress buffer layer
11/07/2002US20020164839 Bonding semiconductor to substrate, then thermal spreading layer; multilayer vertical bonding
11/07/2002US20020164837 Filling gap between chip and substrate with adhesive; applying ultrasonic oscillation
11/07/2002US20020164833 Etch mask patterning; photolithography
11/07/2002US20020164831 Method for measuring the depth of well
11/07/2002US20020164830 Measurement of defects; calibration
11/07/2002US20020164829 Measuring apparatus and film formation method
11/07/2002US20020164828 Sputtering a first ferromagnetic layer, growing a conductive layer on the ferromagnetic layer, oxidizing conductive lyaer to form a tunnel barrier layer of oxide on conductive layer, growing a second ferromagnetic layer on the oxide
11/07/2002US20020164827 Microelectronic piezoelectric structure and method of forming the same
11/07/2002US20020164546 Electronic chip on a wafer, by developing on the wafer a first mask at lower resolution, etching first mask under a first set of conditions to achieve a higher resolution mask, then using it as a hard mask for etching lower layer
11/07/2002US20020164545 Forming a semiconductive antireflection film on the rear of the substrate having a specified band gap energy and reflectance that satisfies an equation relating refractive indexes of the substrate and the film
11/07/2002US20020164544 Sacrificial post formed using photolithography, interlevel dielectric formed on post, and trench etched exposing the post, removing post to form hole, and conducting layer is formed in the hole and the trench
11/07/2002US20020164541 Photoresist comprising fluoroalkylated units of phthalimide and norbornene-based esters such as 2-methoxybutyl-2-adamantanyl 5-norbornene-2-carboxylate; etch resistance, heat resistance and adhesiveness
11/07/2002US20020164537 Electronic device and defect repair method thereof
11/07/2002US20020164535 Thermal mass transfer donor element
11/07/2002US20020164429 Methods for forming a low dielectric constant carbon-containing film, and films produced thereby
11/07/2002US20020164421 Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
11/07/2002US20020164414 Measuring concentration in tank; supplying to substrate; calibration; photolithography
11/07/2002US20020164391 Split-mold and method for manufacturing semiconductor device by using the same
11/07/2002US20020164242 Control system for transfer and buffering
11/07/2002US20020164241 Method for handling and processing microelectronic-device substrate assemblies
11/07/2002US20020164232 Semiconductor wafer processing apparatus
11/07/2002US20020164145 Fiber optic wafer probe
11/07/2002US20020163842 Dram cell configuration and method for fabricating the dram cell configuration
11/07/2002US20020163841 Voltage-level shifter and semiconductor memory using the same
11/07/2002US20020163836 Semiconductor device
11/07/2002US20020163829 Memory switch
11/07/2002US20020163793 EUV-transparent interface structure
11/07/2002US20020163768 Electrostatic discharge protection circuit using diodes
11/07/2002US20020163764 Tunneling magnetoresistive device and method for manufacturing the same
11/07/2002US20020163652 Film thickness measuring method and step measuring method
11/07/2002US20020163649 Film thickness measuring method and apparatus, and thin film device manufacturing method and manufacturing apparatus using same
11/07/2002US20020163637 Method for using an in situ particle sensor for monitoring particle performance in plasma deposition processes
11/07/2002US20020163634 Multiple spot size optical profilometer, ellipsometer, reflectometer and scatterometer
11/07/2002US20020163631 Lifting support assembly for an exposure apparatus
11/07/2002US20020163630 Movable support in a vacuum chamber and its application in lithographic projection apparatuses
11/07/2002US20020163628 Transfer apparatus and transfer method
11/07/2002US20020163603 Liquid crystal display device and method for fabricating the same
11/07/2002US20020163380 Integrated circuit
11/07/2002US20020163379 CMOS reference voltage circuit
11/07/2002US20020163356 PLD architecture for flexible placement of IP function blocks
11/07/2002US20020163349 Probe card and method of producing the same
11/07/2002US20020163342 Device and method for inspection
11/07/2002US20020163300 Organic electroluminescent device and a method of manufacturing thereof
11/07/2002US20020163287 Field emitting display
11/07/2002US20020163257 Stage system with onboard linear motor
11/07/2002US20020163092 Thimble-type steam injection humidifier and quick response steam generator
11/07/2002US20020163086 Semiconductor device and manufacturing method thereof
11/07/2002US20020163084 Electronic component and process for manufacturing the same
11/07/2002US20020163083 Semiconductor device
11/07/2002US20020163082 Method for forming an interconnect structure with air gap compatible with unlanded vias
11/07/2002US20020163081 Semiconductor device and method of manufacturing the same
11/07/2002US20020163080 Semiconductor device and its manufacture
11/07/2002US20020163079 Integrated circuit device and method of producing the same
11/07/2002US20020163072 Method for bonding wafers to produce stacked integrated circuits
11/07/2002US20020163069 Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed
11/07/2002US20020163068 Semiconductor device
11/07/2002US20020163067 Three-dimensionally embodied circuit with electrically connected semiconductor chips
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