Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/31/2002DE10210006A1 Charged particle generator, produces electric field between discharging electrode and free end of charged particle generating electrode
10/31/2002DE10163345A1 Ein Kondensator für Halbleiterelemente und ein Verfahren zur Herstellung A capacitor for semiconductor elements and a process for preparing
10/31/2002DE10162948A1 Halbleiterbauelement eines LGA-Typs und Verfahren zum Anbringen des Halbleiterbauelements A semiconductor device of a LGA type, and method of mounting of the semiconductor component
10/31/2002DE10160118A1 Halbleiterelement Semiconductor element
10/31/2002DE10145960A1 Verfahren zur Herstellung einer Halbleitervorrichtung mit einem mehrschichtigen WSi¶x¶-Film mit einer Struktur mit geringer Korngröße und eine Halbleitervorrichtung mit einer Polysiliciumschicht mit einem darauf ausgebildeten mehrschichtigen WSi¶x¶-Film A method of manufacturing a semiconductor device having a multi-layer film having a WSi¶x¶ structure with small grain size and a semiconductor device having a polysilicon layer having formed thereon a multilayered film WSi¶x¶
10/31/2002DE10139432A1 Forming complex structure for manufacturing of integrated circuits e.g. DRAM, by forming orthogonal patterns in separate steps
10/31/2002DE10137956A1 Electronic component comprises a semiconductor chip on an island embedded in a flat plastic housing having an exposed surface of the island in the center of its lower side and metallic external edge contacts arranged on its edge sides
10/31/2002DE10121239A1 Etching depth controlling method in DRAM fabricating process, involves etching two reflecting regions subsequently until etching depth of both regions are made equal
10/31/2002DE10121132A1 Verfahren zum Erzeugen einer metallischen oder metallhaltigen Schicht unter Verwendung eines Präkursors auf einer silizium- oder germaniumhaltigen Schicht, insbesondere eines elektronischen Bauelements A method of producing a metallic or metal-containing layer using a precursor on a silicon-or germanium-containing layer, in particular an electronic component
10/31/2002DE10121115A1 Haltevorrichtung für Wafer Holding device for wafers
10/31/2002DE10121010A1 Halter für Halbleiterwafer in einer Bürstenreinigungsanlage Holder for semiconductor wafer in a brush cleaning system
10/31/2002DE10120929A1 Herstellungsverfahren für eine integrierte Schaltung Manufacturing process for an integrated circuit
10/31/2002DE10120928C1 Production of contact joint between semiconductor chip and substrate comprises applying hardenable conducting adhesive on contact surfaces of substrate and chip, joining, and hardening adhesive to form contact joint
10/31/2002DE10120877A1 Anordnung mit einem Halbleiterbauelement Assembly comprising a semiconductor device
10/31/2002DE10120701A1 Verfahren zur Steuerung eines Prozeßgerätes zur sequentiellen Verarbeitung von Halbleiterwafern A method for controlling a process device for the sequential processing of semiconductor wafers
10/31/2002DE10120656A1 Semiconductor element comprises a semiconductor body having electrodes in which regions of one conducting type and regions of a further opposing conducting type are arranged in a drift zone
10/31/2002DE10120523A1 Verfahren zur Minimierung der Wolframoxidausdampfung bei der selektiven Seitenwandoxidation von Wolfram-Silizium-Gates A method for minimizing the Wolframoxidausdampfung in the selective oxidation side wall of tungsten-silicon gate
10/31/2002DE10120516A1 Halbleiterspeicherzelle und Verfahren zu ihrer Herstellung A semiconductor memory cell and process for its preparation
10/31/2002DE10120074A1 Measuring system for wafer inspection during processing has one handling module transferring wafers to measuring modules
10/31/2002DE10120052A1 Semiconductor circuit comprises components arranged on a substrate, and a trench isolation for electrical isolating two of the electrical components
10/31/2002DE10119873A1 Verfahren zur Herstellung von Metall/Halbleiter-Kontakten A process for the production of metal / semiconductor contacts
10/31/2002DE10117580C1 Screening device for vertical transport device for semiconductor wafers has partition wall provided with door panel moved between closed and open positions lying in common plane
10/31/2002DE10103294C1 Träger mit einer Metallfläche und mindestens ein darauf angeordneter Chip, insbesondere Leistungshalbleiter Support with a metal surface and at least one chip arranged thereon, in particular power semiconductor
10/31/2002DE10103114A1 Herstellen elektrischer Verbindungen in Substratöffnungen von Schaltungseinheiten mittels gerichteter Abscheidung leitfähiger Schichten Making electrical connections in substrate openings of circuit units by means of directional deposition of conductive layers
10/31/2002CA2444793A1 Method for treating the surface of a semiconductor material
10/31/2002CA2444681A1 Nanoelectronic devices and circuits
10/31/2002CA2412603A1 Method and system for providing a single-scan, continuous motion sequential lateral solidification
10/30/2002EP1253817A2 Apparatus for picking and placing small objects
10/30/2002EP1253718A1 Driving circuit and display device using the same
10/30/2002EP1253660A1 Electrochemical solid-state device comprising lanthanide calcium manganite
10/30/2002EP1253652A2 Semiconductor memory device including memory cell portion and peripheral circuit portion
10/30/2002EP1253651A2 Semiconductor memory device using magneto resistive effect element
10/30/2002EP1253647A2 Dielectric for a semiconductor device
10/30/2002EP1253646A1 Insulating barrier
10/30/2002EP1253645A2 Lateral transistor having graded base region, semiconductor intergrated circuit and fabrication method thereof
10/30/2002EP1253643A2 Display device and method of manufacturing the same
10/30/2002EP1253642A2 A semiconductor device and a method of manufacturing the same
10/30/2002EP1253641A2 Semiconductor device provided with fuse and method of disconnecting fuse
10/30/2002EP1253637A2 Semiconductor device including heat sinks and manufacturing method therefor
10/30/2002EP1253635A1 Method for sealing a memory device
10/30/2002EP1253634A2 Semiconductor device
10/30/2002EP1253633A2 Wafer holding device
10/30/2002EP1253632A2 Novel transistor with ultra shallow tip and method of fabrication
10/30/2002EP1253631A1 Wafer holder, wafer support member, wafer holding device, and heat treating furnace
10/30/2002EP1253630A1 Chemical vapor deposition of silicon oxide films
10/30/2002EP1253629A2 Method to remove copper contamination by using downstream oxygen and chelating agent plasma
10/30/2002EP1253628A1 Method of producing semiconductor device and processing conditions setting device
10/30/2002EP1253627A2 Semiconductordevice having a ferroelectric capacitor and fabrication process thereof
10/30/2002EP1253626A2 Fine pattern drawing method
10/30/2002EP1253620A2 Ion beam scanning method and apparatus
10/30/2002EP1253619A2 Charged particle beam exposure apparatus and device manufacturing method using same
10/30/2002EP1253601A2 Methods and devices for holding a mirror for use in X-ray optical systems
10/30/2002EP1253536A1 Product development management system, product development management method, product reliability decision system and product reliability decision method
10/30/2002EP1253505A2 Clock distribution circuit
10/30/2002EP1253497A1 Method for adjusting processing parameters of plate-like objects in a processing tool
10/30/2002EP1253471A2 Method and system for improving focus accuracy in a lithography system
10/30/2002EP1253470A2 Radiation-sensitive resin composition
10/30/2002EP1253432A2 Power reduction in module-based scan testing
10/30/2002EP1253175A2 Composition for film formation, method of film formation, and silica-based film
10/30/2002EP1253117A1 Glass substrate for photomasks and preparation method
10/30/2002EP1252974A2 Abrasive plate holder
10/30/2002EP1252973A1 Polishing pad for a semiconductor wafer which has light transmitting properties
10/30/2002EP1252966A1 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
10/30/2002EP1252660A2 Bipolar transistor
10/30/2002EP1252659A1 Strained-silicon metal oxide semiconductor field effect transistors
10/30/2002EP1252658A1 Silicon nanoparticle field effect transistor and transistor memory device
10/30/2002EP1252657A1 Mos field effect transistor arrangement
10/30/2002EP1252656A1 Protection device for schottky diodes
10/30/2002EP1252654A2 A method for transferring and stacking of semiconductor devices
10/30/2002EP1252653A2 Analysis of cd-sem signal to detect scummed/closed contact holes and lines
10/30/2002EP1252652A1 Method for monitoring a manufacturing process
10/30/2002EP1252651A2 Chemical-mechanical polishing method
10/30/2002EP1252650A1 Substrate processing apparatus
10/30/2002EP1252649A2 Device for positioning a wafer
10/30/2002EP1252553A1 Refractive index regulation for maintaining optical imaging performance
10/30/2002EP1252552A1 Reticle stocking and sorting management system
10/30/2002EP1252497A2 Method for investigating or structuring a surface layer
10/30/2002EP1252364A1 Apparatus and method for epitaxially processing a substrate
10/30/2002EP1252362A2 Method and device for depositing a precursor on a substrate, said precursor being present in the liquid form
10/30/2002EP1252361A1 Method of cleaning and conditioning plasma reaction chamber
10/30/2002EP1252359A1 Improved reactor with heated and textured electrodes and surfaces
10/30/2002EP1252358A1 System and method for depositing inorganic/organic dielectric films
10/30/2002EP1252248A1 Polishing compositions for noble metals
10/30/2002EP1252247A1 Polishing compositions for semiconductor substrates
10/30/2002EP1252079A1 Wafer transport system
10/30/2002EP1252026A1 Thermal mass transfer donor element with light-to-heat conversion layer
10/30/2002EP1251998A1 Endpoint monitoring with polishing rate change
10/30/2002EP1251996A1 Grinding pin for grinding machines comprising resin bonded sections of rough grit and fine grit
10/30/2002EP1251974A2 Methods and apparatus for forming submicron patterns on films
10/30/2002EP1251920A1 Method and apparatus for metal removal by ion exchange
10/30/2002EP1204987A4 Chemical vapor deposition of silicon oxide films using alkylsiloxane oligomers with ozone
10/30/2002EP0944909B1 Electroceramic component and method for its manufacture
10/30/2002CN2519408Y Diode cohoront machine high pressure bimaterial test mechanism
10/30/2002CN2519407Y Encapsulated integrated circuit device
10/30/2002CN1377568A Multi-zone resistance heater
10/30/2002CN1377512A Dual water attachment process
10/30/2002CN1377511A Method for producing integrated circuit having at least one metalilized surface
10/30/2002CN1377510A Wafer atmospheric transport module having controlled mini-environment
10/30/2002CN1377509A High transmission, low energy beamline architecture for ion implanter
10/30/2002CN1377477A 形成图形的方法 The method of forming a pattern
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