Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2002
11/11/2002CA2670718A1 System and method for using bent pipes in high-purity fluid handling systems
11/11/2002CA2384397A1 System and method for using bent pipes in high-purity fluid handling systems
11/07/2002WO2002089540A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo
11/07/2002WO2002089538A2 Finned heat sink assemblies
11/07/2002WO2002089531A1 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
11/07/2002WO2002089530A1 Ceramic heater with heater element and method for use thereof
11/07/2002WO2002089223A1 Production method for light emitting element absract:
11/07/2002WO2002089220A1 Iii group nitride compound semiconductor luminescent element
11/07/2002WO2002089214A1 Eeprom cell with asymmetric thin window
11/07/2002WO2002089213A1 Integrated circuit and method for manufacture thereof
11/07/2002WO2002089210A1 Organic electroluminescent device and a method of manufacturing thereof
11/07/2002WO2002089205A2 Relay connector for an electronic component and a method for producing the same
11/07/2002WO2002089204A1 Semiconductor device
11/07/2002WO2002089202A2 Method for the production of an integrated circuit
11/07/2002WO2002089201A1 Improved salicide block for silicon-on-insulator (soi) applications
11/07/2002WO2002089200A2 Method of manufacturing interconnections in a semiconductor device
11/07/2002WO2002089199A2 A method of filling a via or recess in a semiconductor substrate
11/07/2002WO2002089198A1 Method for controlling a process device for sequential processing of semiconductor wafers
11/07/2002WO2002089197A1 Method for bonding wafers to produce stacked integrated circuits
11/07/2002WO2002089196A2 Trench-gate semiconductor devices and their manufacture
11/07/2002WO2002089195A2 Method of manufacturing a trench-gate semiconductor device
11/07/2002WO2002089194A1 Metallic film forming method and semiconductor device manufacturing method
11/07/2002WO2002089193A1 Method of wet etching a silicon and nitrogen containing material
11/07/2002WO2002089192A1 Method of wet etching an inorganic antireflection layer
11/07/2002WO2002089191A2 Improvement of titanium disilicide resistance in narrow active regions of semiconductor devices
11/07/2002WO2002089190A2 Method for minimizing tungsten oxide evaporation during selective sidewall oxidation of tungsten-silicon gates
11/07/2002WO2002089189A1 Remote maintenance system and remote maintenance method for semiconductor manufacturing apparatus
11/07/2002WO2002089188A2 Semiconductor structures utilizing binary metal oxide layers
11/07/2002WO2002089187A2 An improved method for forming minimally spaced mram structures
11/07/2002WO2002089186A2 Deposition and skipe annealing of tungsten silicide films
11/07/2002WO2002089185A2 Triple chamber load lock
11/07/2002WO2002089184A2 Method for manufacturing a semiconductor device and support plate therefor
11/07/2002WO2002089183A2 Holding device for wafers
11/07/2002WO2002089182A2 Recessed gat dram transistor and method
11/07/2002WO2002089181A2 Modification to fill layers for inlaying semiconductor patterns
11/07/2002WO2002089180A2 Method of enhanced oxidation of mos transistor gate corners
11/07/2002WO2002089178A2 Embedded metal nanocrystals
11/07/2002WO2002089177A2 A contact structure of a wiring line and method manufacturing the same, and thin film transistor array substrate including the contact structure and method manufacturing the same
11/07/2002WO2002089176A2 Method for separating electronic components from a composite
11/07/2002WO2002089152A1 Conductive materials with electrical stability for use in electronics devices
11/07/2002WO2002089149A1 Euvl multilayer structures
11/07/2002WO2002089051A1 Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
11/07/2002WO2002088858A1 Method for adjusting processing parameters of at least one plate-like object in a processing tool
11/07/2002WO2002088845A1 Resin composition, process for producing resin composition, and method of forming resin film
11/07/2002WO2002088765A1 Magnetoresistive element and magnetoresistive magnetic head, magnetic recording apparatus and magnetoresistive memory device using the same
11/07/2002WO2002088683A1 Method and apparatus for characterization of ultrathin silicon oxide films using mirror-enhanced polarized reflectance fourier transform infrared spectroscopy
11/07/2002WO2002088677A1 Measurement system cluster
11/07/2002WO2002088431A1 Anode assembly and process for supplying electrolyte to a planar substrate surface
11/07/2002WO2002088419A1 Method for production of a metallic or metal-containing layer
11/07/2002WO2002088417A1 Assemblies comprising molybdenum and aluminum; and methods of utilizing interlayers in forming target/backing plate assemblies
11/07/2002WO2002088413A2 Sputter targets comprising ti and zr
11/07/2002WO2002088408A1 Nickel-titanium sputter target alloy
11/07/2002WO2002088270A1 Adhesive and electric device
11/07/2002WO2002088267A1 Method of forming thick silica-based film
11/07/2002WO2002088243A2 Method for producing thin homogeneous layers with the help of screen printing technology, device for carrying out said method and the use thereof
11/07/2002WO2002088077A2 Resist compositions with polymers having pendant groups containing plural acid labile moieties
11/07/2002WO2002088036A1 Method for producing titania-doped fused silica extreme ultraviolet lithography substrates glass
11/07/2002WO2002088035A1 Method for producing extreme ultraviolet lithography substrates
11/07/2002WO2002087825A1 Integrated endpoint detection system with optical and eddy current monitoring
11/07/2002WO2002087817A1 Dissipative ceramic bonding tool tip
11/07/2002WO2002075818A3 Inductive storage capacitor
11/07/2002WO2002067328A3 Organic light emitting diode display having shield electrodes
11/07/2002WO2002058218A3 Three terminal noninverting transistor switch
11/07/2002WO2002054447A3 System and method for prototyping and fabricating complex microwave circuits
11/07/2002WO2002052641A3 Contact and via structure and method of fabrication
11/07/2002WO2002047160A3 Method for producing high-speed vertical npn bipolar transistors and complementary mos transistors on a chip
11/07/2002WO2002037564A3 Film material comprising metal spikes and method for the production thereof
11/07/2002WO2002035600A3 Method for producing a dmos transistor
11/07/2002WO2002031883A3 Protection diode for improved ruggedness of a radio frequency power transistor and self-defining method to manufacture such protection diode
11/07/2002WO2002031595A3 Dissolution inhibitors in photoresist compositions for microlithography
11/07/2002WO2002017381A3 Method for preventing damage to wafers in a sequential multiple steps polishing process
11/07/2002WO2002015231A3 A method for patterning layers of semiconductor devices
11/07/2002WO2002013241A3 Method of etching titanium nitride
11/07/2002WO2001099099A3 Magnetic multilayer structure with improved magnetic field range
11/07/2002WO2001093314A9 Ball grid array with pre-slotted substrate
11/07/2002WO2001071777A3 Method of fabricating flux concentrating layer for use with magnetoresistive random access memories
11/07/2002WO2001041207A9 Packaging of integrated circuits and vertical integration
11/07/2002WO2001029902A3 Device and method for tempering several process goods
11/07/2002WO2001029901A3 Device and method for tempering at least one process good
11/07/2002WO2001008159A3 Method of forming memory capacitor contact openings
11/07/2002US20020166107 Method and apparatus for generating masks utilized in conjunction with dipole illumination techniques
11/07/2002US20020166106 System and method for asymmetric routing lines
11/07/2002US20020166101 Crosstalk mitigation method and system
11/07/2002US20020166098 Block based design methodology
11/07/2002US20020165678 Data collection methods and apparatus
11/07/2002US20020165079 Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses
11/07/2002US20020164938 Carrier head with a compressible film
11/07/2002US20020164932 Polishing apparatus
11/07/2002US20020164930 Apparatus for polishing periphery of device wafer and polishing method
11/07/2002US20020164929 Method of polishing and cleaning substrates
11/07/2002US20020164928 Method and apparatus for conditioning a polishing pad
11/07/2002US20020164927 Chemical-mechanical polishing methods
11/07/2002US20020164925 Integrated endpoint detection system with optical and eddy current monitoring
11/07/2002US20020164893 Interconnect for microelectronic structures with enhanced spring characteristics
11/07/2002US20020164891 Porous low dielectric film
11/07/2002US20020164890 Method of forming silicon containing thin films by atomic layer deposition utilizing s12cl6 and nh3
11/07/2002US20020164889 Vapor deposition hexamethyldisilazane etching barriers
11/07/2002US20020164888 Etchant for patterning indium tin oxide and method of fabricating liquid crystal display device using the same
11/07/2002US20020164887 Etching method and etching apparatus, method for manufacturing semiconductor device, and semiconductor device
11/07/2002US20020164886 Method for processing coating film and method for manufacturing semiconductor element with use of the same method
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