Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2002
11/12/2002US6479367 Method for forming isolation layer in semiconductor device
11/12/2002US6479366 Method of manufacturing a semiconductor device with air gaps formed between metal leads
11/12/2002US6479364 Method for forming a capacitor for semiconductor devices with diffusion barrier layer on both sides of dielectric layer
11/12/2002US6479362 Semiconductor device with high-temperature-stable gate electrode for sub-micron applications and fabrication thereof
11/12/2002US6479361 Isolation structure and fabricating method therefor
11/12/2002US6479360 Semiconductor device and manufacturing method
11/12/2002US6479359 Low-resistance gate transistor and method for fabricating the same
11/12/2002US6479358 Raised source/drain process by selective SiGe epitaxy
11/12/2002US6479357 Method for fabricating semiconductor device with copper gate electrode
11/12/2002US6479356 Method of manufacturing a semiconductive device with an enhanced junction breakdown strength
11/12/2002US6479355 Method for forming landing pad
11/12/2002US6479354 Semiconductor device with selective epitaxial growth layer and isolation method in a semiconductor device
11/12/2002US6479353 Reference layer structure in a magnetic storage cell
11/12/2002US6479352 Method of fabricating high voltage power MOSFET having low on-resistance
11/12/2002US6479351 Method of fabricating a self-aligned non-volatile memory cell
11/12/2002US6479350 Reduced masking step CMOS transistor formation using removable amorphous silicon sidewall spacers
11/12/2002US6479349 Laser transceiver system controller
11/12/2002US6479348 Method of making memory wordline hard mask extension
11/12/2002US6479347 Simplified DSCP process for manufacturing FLOTOX EEPROM non-autoaligned semiconductor memory cells
11/12/2002US6479346 Semiconductor memory device and fabrication method thereof
11/12/2002US6479345 Method for manufacturing capacitor in semiconductor device and the capacitor
11/12/2002US6479344 Method of fabricating DRAM capacitor
11/12/2002US6479343 DRAM cell capacitor and manufacturing method thereof
11/12/2002US6479342 Semiconductor devices and manufacturing methods thereof
11/12/2002US6479341 Capacitor over metal DRAM structure
11/12/2002US6479340 The plasma treatment lessens if not eliminates the ability of the first conductive layer to incorporate oxygen from the dielectric
11/12/2002US6479339 Use of a thin nitride spacer in a split gate embedded analog process
11/12/2002US6479338 CMOS device and method of manufacturing the same
11/12/2002US6479337 Semiconductor device including a charge-dispersing region and fabricating method thereof
11/12/2002US6479336 Method for fabricating semiconductor device
11/12/2002US6479334 Thin film transistor and semiconductor device and method for forming the same
11/12/2002US6479333 Method of manufacturing a semiconductor device
11/12/2002US6479332 Methods of forming integrated circuitry
11/12/2002US6479331 Forming a semiconductor film comprising silicon over a substrate comprising a glass; crystallizing film by heat treatment; patterning; doping n-type impurities; masking doping p-type impurities; thermal annealing
11/12/2002US6479330 Semiconductor device and method for manufacturing the same
11/12/2002US6479329 Method for producing semiconductor device
11/12/2002US6479328 Method of fabricating SOI wafer
11/12/2002US6479327 Semiconductor device and method for manufacturing the same
11/12/2002US6479324 Method and manufacturing piezoelectric device
11/12/2002US6479323 Method for attaching a lead frame to a heat spreader/heat slug structure
11/12/2002US6479322 Semiconductor device with two stacked chips in one resin body and method of producing
11/12/2002US6479321 One-step semiconductor stack packaging method
11/12/2002US6479318 Method of manufacturing a substrate with directionally anisotropic warping
11/12/2002US6479317 Method for integrating anti-reflection layer and salicide block
11/12/2002US6479315 Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step
11/12/2002US6479313 Method of manufacturing GaN-based p-type compound semiconductors and light emitting diodes
11/12/2002US6479311 Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning
11/12/2002US6479309 Method and apparatus for determining process layer conformality
11/12/2002US6479308 Semiconductor fuse covering
11/12/2002US6479307 Method of monitoring loss of silicon nitride
11/12/2002US6479306 Method for manufacturing semiconductor device
11/12/2002US6479305 Semiconductor device manufacturing method
11/12/2002US6479304 Iridium composite barrier structure and method for same
11/12/2002US6479219 Polymers having silicon-containing acetal or ketal functional groups
11/12/2002US6479212 Photosensitive resin, resist composition using the photosensitive resin, pattern formation method using the resist composition, device produced by the pattern formation method, and exposure method
11/12/2002US6479210 Comprising an organic material containing substituent(s) capable of being released in the presence of acid, and acid generators of at least one onium salt and sulfone and/or sulfonate compounds; resolution, sensitivity
11/12/2002US6479201 Optical exposure apparatus of scanning exposure system and its exposing method
11/12/2002US6479173 A crystalline alkaline earth metal nitride-based interface between a silicon substrate and oxides or other nitrides
11/12/2002US6479167 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
11/12/2002US6479166 Comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress adjacent to one another without an intermediate film or layer
11/12/2002US6479110 A dielectric material having two or more phases comprising: a first phase consisting of silicon, carbon, oxygen and hydrogen, and atleast one second phase consisting of carbon and hydrogen and multiplicity of nanometer-sized pores
11/12/2002US6479095 Composite material for heat sinks for semiconductor devices and method for producing the same
11/12/2002US6478978 Etching methods, methods of removing portions of material, and methods of forming silicon nitride spacers
11/12/2002US6478977 Polishing method and apparatus
11/12/2002US6478976 Apparatus and method for contacting a conductive layer
11/12/2002US6478975 Inductor and fabricating method thereof
11/12/2002US6478936 Anode assembly for plating and planarizing a conductive layer
11/12/2002US6478935 Semiconductor device plating apparatus
11/12/2002US6478924 Plasma chamber support having dual electrodes
11/12/2002US6478923 Vacuum operation apparatus
11/12/2002US6478918 Semiconductor wafer processing tapes
11/12/2002US6478909 Method for surface mounting electrical components to a substrate
11/12/2002US6478906 Method for bonding a flexible substrate to a chip
11/12/2002US6478895 Nickel-titanium sputter target alloy
11/12/2002US6478883 Silicon single crystal wafer, epitaxial silicon wafer, and methods for producing them
11/12/2002US6478877 Gas collector for epitaxial reactors
11/12/2002US6478873 Method of optimizing process of selective epitaxial growth
11/12/2002US6478872 Method of delivering gas into reaction chamber and shower head used to deliver gas
11/12/2002US6478871 Single step process for epitaxial lateral overgrowth of nitride based materials
11/12/2002US6478836 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
11/12/2002US6478834 Slurry for chemical mechanical polishing
11/12/2002US6478665 Multi-wafer polishing tool
11/12/2002US6478660 Apparatus of and method for polishing the outer circumferential portions of a circular plate-shaped work
11/12/2002US6478659 Chemical mechanical polishing method for slurry free fixed abrasive pads
11/12/2002US6478627 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
11/12/2002US6478578 Apparatus for baking wafers
11/12/2002US6478562 Resin molding machine
11/12/2002US6478547 Method and apparatus for dispensing fluids
11/12/2002US6478532 Wafer orienting and reading mechanism
11/12/2002US6478263 Semiconductor device and its manufacturing method
11/12/2002US6478212 Bond pad structure and method for reduced downward force wirebonding
11/12/2002US6478211 Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
11/12/2002US6478035 Cleaning device, cleaning system, treating device and cleaning method
11/12/2002US6477980 Flexibly suspended gas distribution manifold for plasma chamber
11/12/2002US6477908 Pedestal with vibration sensor, and exposure apparatus having the same
11/12/2002US6477825 Flattening and machining method and apparatus
11/12/2002US6477787 Method and apparatus for heating and cooling substrates
11/12/2002US6477786 Apparatus for drying batches of disks
11/12/2002US6477768 Method and contact point for establishing an electrical connection
11/12/2002CA2214306C Mos systems and methods of use