Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2002
12/27/2002WO2002103787A1 Substrate for use in joining element
12/27/2002WO2002103786A1 Method for manufacturing semiconductor device
12/27/2002WO2002103785A2 Cmos process
12/27/2002WO2002103784A1 Method for producing miniature amplifier and signal processing unit
12/27/2002WO2002103783A2 Method of forming low resistance vias
12/27/2002WO2002103782A2 Barrier enhancement process for copper interconnects
12/27/2002WO2002103781A1 Wafer supporter
12/27/2002WO2002103780A1 Substrate table, production method therefor and plasma treating device
12/27/2002WO2002103779A1 In situ sensor based control of semiconductor processing procedure
12/27/2002WO2002103778A2 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
12/27/2002WO2002103777A1 Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
12/27/2002WO2002103776A2 Method for relating photolithography overlay target damage and chemical mechanical planarization (cmp) fault detection to cmp tool identification
12/27/2002WO2002103774A1 Intergrated barrier layer structure for copper contact level metallization
12/27/2002WO2002103773A1 Dry-etcching method
12/27/2002WO2002103772A2 Deep insulating trench and method for production thereof
12/27/2002WO2002103771A1 Electrolytic processing device and substrate processing apparatus
12/27/2002WO2002103770A1 Apparatus and method for cleaning the surface of a substrate
12/27/2002WO2002103769A1 P-type semiconductor manufacturing method and semiconductor device
12/27/2002WO2002103768A1 Conductive thin film for semiconductor device, semiconductor device, and methods for producing them
12/27/2002WO2002103767A1 Epitaxial siox barrier/insulation layer______________________
12/27/2002WO2002103765A1 Electron beam exposure apparatus, electron beam exposing method, semiconductor manufacturing method, and electron beam shape measuring method
12/27/2002WO2002103764A1 Electron beam exposure system
12/27/2002WO2002103763A1 Method for manufacturing semiconductor device
12/27/2002WO2002103762A2 Pod door opener
12/27/2002WO2002103761A1 Substrate support with multilevel heat transfer mechanism
12/27/2002WO2002103760A2 Method of selective removal of sige alloys
12/27/2002WO2002103759A1 Apparatus and method of making a slip free wafer boat
12/27/2002WO2002103755A2 Semiconductor die including conductive columns
12/27/2002WO2002103753A2 Nanoelectronic interconnection and addressing
12/27/2002WO2002103752A2 Metal-assisted chemical etch to produce porous group iii-v materials
12/27/2002WO2002103751A2 Electroplating chemistry for the cu filling of submicron features of vlsi/ulsi interconnect
12/27/2002WO2002103703A2 Semiconductor device
12/27/2002WO2002103627A1 Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
12/27/2002WO2002103582A2 Method and system for design selection by interactive visualization
12/27/2002WO2002103518A1 Efficient high performance data operation element for use in a reconfigurable logic environment
12/27/2002WO2002103431A1 Catadioptric system and exposure system provided with the system
12/27/2002WO2002103373A1 Conductive contactor and electric probe unit
12/27/2002WO2002103337A2 Electron beam apparatus and method for using said apparatus
12/27/2002WO2002103226A2 Floating seal pick and place system and unit therefor
12/27/2002WO2002103091A1 SILICON SINGLE CRYSTAL WAFER HAVING VOID DENUDED ZONE ON THE SUFRACE AND DIAMETER OF AVOBE 300 mm AND ITS PRODUCTION METHOD
12/27/2002WO2002103090A2 A method of growing a semiconductor layer
12/27/2002WO2002102952A1 Aqueous buffered fluoride-containing etch residue removers and cleaners
12/27/2002WO2002102920A1 A silica and a silica-based slurry
12/27/2002WO2002102910A1 A silica-based slurry
12/27/2002WO2002102712A1 Ceramic and method for preparation thereof, and dielectric capacitor, semiconductor and element
12/27/2002WO2002102709A1 Ceramics film and production method therefor, and ferroelectric capacitor, semiconductor device, other elements
12/27/2002WO2002102687A1 System for transporting substrates
12/27/2002WO2002102549A1 Feedforward and feedback control for conditioning of chemical mechanical polishing pad
12/27/2002WO2002102548A1 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
12/27/2002WO2002102546A1 Polishing apparatus and polishing pad
12/27/2002WO2002102541A1 Methods and apparatus for transferring electrical components
12/27/2002WO2002102524A1 Electroless process for the preparation of particle enhanced electric contact surfaces
12/27/2002WO2002093620A3 Device for wetting a surface
12/27/2002WO2002093254A8 Lithography system and method for device manufacture
12/27/2002WO2002071493A3 Relaxed silicon germanium platform for high speed cmos electronics and high speed analog
12/27/2002WO2002071153A3 Method for uniformly coating a substrate
12/27/2002WO2002070191A8 Fluxing underfill compositions
12/27/2002WO2002067278A3 Electrolytic capacitors and method for making them
12/27/2002WO2002065482A3 Collector with an unused area for lighting systems having a wavelength of ≤ 193 nm
12/27/2002WO2002058164A3 Gan layer on a substrate with an amorphous layer
12/27/2002WO2002050842A3 Method for reading out or in a status from or to a ferroelectrical transistor of a memory cell and memory matrix
12/27/2002WO2002047120A3 Cooling gas delivery system for a rotatable semiconductor substrate support assembly
12/27/2002WO2002044804A3 Pixellated devices such as active matrix liquid crystal displays
12/27/2002WO2002029385A3 Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques
12/27/2002WO2002025730A8 Self aligned trench and method of forming the same
12/27/2002WO2002022321A3 Multiple blade robot adjustment apparatus and associated method
12/27/2002WO2002017387A3 Conductive material patterning methods
12/27/2002WO2002016477A3 Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
12/27/2002WO2002010995A3 Module for generating circuits for analysing bit strings inside data cells, method for generating this type of circuit and relative circuit
12/27/2002WO2002010785A3 Hierarchical design and test method and system, program product embodying the method and integrated circuit produced thereby
12/27/2002WO2002003763A3 Vacuum plasma processor apparatus and method
12/27/2002WO2002001421B1 Lock-step cursors for feature alignment
12/27/2002WO2001074537A9 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
12/27/2002CA2449475A1 Method and system for design selection by interactive visualization
12/26/2002US20020199161 Method of designing logic circuit, and computer product
12/26/2002US20020199160 Power supply network analyzing method, computer program for executing the method, storage medium and power supply network analyzing apparatus
12/26/2002US20020199159 Naked chip motherboard module
12/26/2002US20020199158 Method and apparatus for designing a clock distributing circuit, and computer readable storage medium storing a design program
12/26/2002US20020199146 Test method and apparatus for semiconductor device and semiconductor device
12/26/2002US20020199145 Semiconductor integrated circuits built therein scan paths
12/26/2002US20020199082 Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
12/26/2002US20020199049 Signal bus arrangement
12/26/2002US20020198773 Method and system for managing innovation by encouraging reusability and subsequent reuse of design components
12/26/2002US20020198682 Method and apparatus for determining end-point in a chamber cleaning process
12/26/2002US20020198623 Method and apparatus for providing distributed material management and flow control in an integrated circuit factory
12/26/2002US20020198617 System and method for controlling priority of lots employed in MES
12/26/2002US20020198610 Apparatus for picking and placing small objects
12/26/2002US20020198353 Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
12/26/2002US20020198333 First set of recurring monomers comprising an epoxide ring reacted with a light attenuating compound so as to open the epoxide ring, a second set of reccuring monomers comprising unreacted epoxide rings, appyling to a substrate, and curing
12/26/2002US20020198277 Mixture of a polyhydroxyamide and/or polybenzoxazole; and a second component that is decomposable and volatilizable at temperatures at which the polyamide and/or polybenzoxazole is stable; making dielectric layer
12/26/2002US20020198269 Antireflective porogens
12/26/2002US20020197947 Super abrasive tool and process for producing the same
12/26/2002US20020197944 Method and apparatus for cleaning polishing surface of polisher
12/26/2002US20020197937 Method to increase removal rate of oxide using fixed-abrasive
12/26/2002US20020197934 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
12/26/2002US20020197895 Electrical contractor, especially wafer level contactor, using fluid pressure
12/26/2002US20020197890 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
12/26/2002US20020197889 Semiconductor device fabrication method
12/26/2002US20020197888 Method of forming a silicon oxide layer
12/26/2002US20020197887 Method of removing a photoresist layer on a semiconductor wafer
1 ... 4830 4831 4832 4833 4834 4835 4836 4837 4838 4839 4840 4841 4842 4843 4844 4845 4846 4847 4848 4849 4850 ... 6590