Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2002
12/24/2002US6498384 Structure and method of semiconductor via testing
12/24/2002US6498383 Semiconductors, integrated circuits; resistant to erosion by wet etching
12/24/2002US6498382 Semiconductor configuration
12/24/2002US6498381 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
12/24/2002US6498378 Methods of forming field effect transistors and integrated circuitry
12/24/2002US6498376 Semiconductor device and manufacturing method thereof
12/24/2002US6498375 Integrated circuitry
12/24/2002US6498374 MOS semiconductor device having gate insulating film containing nitrogen
12/24/2002US6498372 Conductive coupling of electrical structures to a semiconductor device located under a buried oxide layer
12/24/2002US6498371 Body-tied-to-body SOI CMOS inverter circuit
12/24/2002US6498369 Electro-optical device and electronic equipment
12/24/2002US6498368 Power semiconductor device
12/24/2002US6498367 Discrete integrated circuit rectifier device
12/24/2002US6498366 Semiconductor device that exhibits decreased contact resistance between substrate and drain electrode
12/24/2002US6498365 FET gate oxide layer with graded nitrogen concentration
12/24/2002US6498364 Capacitor for integration with copper damascene processes
12/24/2002US6498363 Gapped-plate capacitor
12/24/2002US6498362 Weak ferroelectric transistor
12/24/2002US6498358 Structure and method for fabricating an electro-optic system having an electrochromic diffraction grating
12/24/2002US6498352 Method of exposing and apparatus therefor
12/24/2002US6498351 Illumination system for shaping extreme ultraviolet radiation used in a lithographic projection apparatus
12/24/2002US6498350 Crash prevention in positioning apparatus for use in lithographic projection apparatus
12/24/2002US6498349 Electrostatically focused addressable field emission array chips (AFEA's) for high-speed massively parallel maskless digital E-beam direct write lithography and scanning electron microscopy
12/24/2002US6498319 Method and an apparatus for manufacturing multi-layer boards using laser light
12/24/2002US6498260 Polyepoxides; electronic packages
12/24/2002US6498132 Surface treatment composition comprises a complexing agent as a metal deposition preventive comprising atleast one aromatic hydrocarbon ring containing hydroxy or o-group directly attached with ring carbon and a second complexing agent
12/24/2002US6498131 Aqueous solution of nonionic surfactants, simple amines, quaternary amine, sticking agent selected from ethylene glycol, propylene glycol, polyethylene oxide, polypropylene oxide
12/24/2002US6498113 Free standing substrates by laser-induced decoherency and regrowth
12/24/2002US6498112 Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films
12/24/2002US6498111 Fabrication of semiconductor materials and devices with controlled electrical conductivity
12/24/2002US6498110 Ruthenium silicide wet etch
12/24/2002US6498109 System and method for plasma etching
12/24/2002US6498108 Method for removing surface contamination on semiconductor substrates
12/24/2002US6498107 Interface control for film deposition by gas-cluster ion-beam processing
12/24/2002US6498106 Prevention of defects formed in photoresist during wet etching
12/24/2002US6498105 Method of forming fine patterns of a semiconductor device
12/24/2002US6498103 Method for manufacturing solid-state imaging device
12/24/2002US6498102 Method for planarizing a semiconductor device using ceria-based slurry
12/24/2002US6498100 Method of manufacturing semiconductor devices
12/24/2002US6498099 Leadless plastic chip carrier with etch back pad singulation
12/24/2002US6498098 Method of forming embedded wiring in a groove in an insulating layer
12/24/2002US6498097 Apparatus and method of forming preferred orientation-controlled platinum film using oxygen
12/24/2002US6498096 Borderless contact to diffusion with respect to gate conductor and methods for fabricating
12/24/2002US6498095 Cvd method for producing an interconnection film by depositing a lower layer to fill a recess performing a cleaning step to remove dissociated reactant gas, and consequently depositing an upper layer that has a smaller impurity concentration than the lower layer
12/24/2002US6498094 Method for providing a contact hole formed in an insulating film
12/24/2002US6498093 Formation without vacuum break of sacrificial layer that dissolves in acidic activation solution within interconnect
12/24/2002US6498092 Method of making a semiconductor device having dual damascene line structure using a patterned etching stopper
12/24/2002US6498091 Method of using a barrier sputter reactor to remove an underlying barrier layer
12/24/2002US6498090 Semiconductor devices and methods for manufacturing the same
12/24/2002US6498089 Semiconductor integrated circuit device with moisture-proof ring and its manufacture method
12/24/2002US6498088 Stacked local interconnect structure and method of fabricating same
12/24/2002US6498087 Method of increasing the conductivity of a transparent conductive layer
12/24/2002US6498086 Use of membrane properties to reduce residual stress in an interlayer region
12/24/2002US6498085 Semiconductor device and method of fabricating the same
12/24/2002US6498084 Method of forming high density EEPROM cell
12/24/2002US6498083 Process for manufacturing non-volatile memory cells integrated on a semiconductor substrate
12/24/2002US6498082 Method of forming a polysilicon layer
12/24/2002US6498081 Method of manufacturing self-aligned contact hole
12/24/2002US6498080 Transistor fabrication method
12/24/2002US6498079 Method for selective source diffusion
12/24/2002US6498077 Semiconductor device and method of manufacturing same
12/24/2002US6498076 Method for manufacturing a semiconductor laser
12/24/2002US6498075 Dicing method
12/24/2002US6498074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
12/24/2002US6498073 Back illuminated imager with enhanced UV to near IR sensitivity
12/24/2002US6498072 Process for producing semiconductor device
12/24/2002US6498071 Manufacture of trench-gate semiconductor devices
12/24/2002US6498070 Air gap semiconductor structure and method of manufacture
12/24/2002US6498069 Semiconductor device and method of integrating trench structures
12/24/2002US6498067 Integrated approach for controlling top dielectric loss during spacer etching
12/24/2002US6498066 Ultra-late programming ROM and method of manufacture
12/24/2002US6498064 Flash memory with conformal floating gate and the method of making the same
12/24/2002US6498063 Even nucleation between silicon and oxide surfaces for thin silicon nitride film growth
12/24/2002US6498062 DRAM access transistor
12/24/2002US6498061 Negative ion implant mask formation for self-aligned, sublithographic resolution patterning for single-sided vertical device formation
12/24/2002US6498060 Semiconductor device and method for making same
12/24/2002US6498059 Method for fabricating thin film transistor
12/24/2002US6498058 SOI pass-gate disturb solution
12/24/2002US6498057 Method for implementing SOI transistor source connections using buried dual rail distribution
12/24/2002US6498055 Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system
12/24/2002US6498054 Method of underfilling a flip-chip semiconductor device
12/24/2002US6498052 Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit
12/24/2002US6498051 Method of packaging semiconductor device using anisotropic conductive adhesive
12/24/2002US6498050 Bipolar transistor, semiconductor light emitting device and semiconductor device
12/24/2002US6498049 Display devices
12/24/2002US6498048 Method of manufacturing crystal of iii-v compounds of the nitride system, crystal substrate of iii-v compounds of the nitride system, crystal film of iii-v compounds of the nitride system, and method of manufacturing device
12/24/2002US6498047 Apparatus and method for measuring wafer clamping tension
12/24/2002US6498044 Capacitor having perovskite series dielectric film containing copper and manufacturing method thereof
12/24/2002US6498030 Greater capacitor area between the control gate and the floating gate, and a higher coupling ratio for the control gate at the same integration as a conventional flash memory is provided.
12/24/2002US6497993 Forming apertures in dielectric layers on semiconductor substrates by photoresist removal
12/24/2002US6497992 Process for manufacturing semiconductor integrated circuit device
12/24/2002US6497987 Photosensitive lithocholate derivative and chemically amplified photoresist composition containing the same
12/24/2002US6497982 Method for suppressing optical proximity effect bias within a wafer
12/24/2002US6497963 Silicon oxycarbides and films having low dielectric constants and heat resistance, used as joints in integrated circuit chips
12/24/2002US6497932 Transport device for electronic components with an anticontamination coating
12/24/2002US6497837 Method using a saw tooth mold
12/24/2002US6497827 Method for etching dielectric films
12/24/2002US6497824 One mask solution for the integration of the thin film resistor
12/24/2002US6497805 Method for shorting pin grid array pins for plating
12/24/2002US6497802 Self ionized plasma sputtering