H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2002
12/19/2002	US20020192916 Bipolar transistor with ultra small polysilicon emitter and method of fabricating the transistor
12/19/2002	US20020192915 Method for fabricating semiconductor device
12/19/2002	US20020192914 CMOS device fabrication utilizing selective laser anneal to form raised source/drain areas
12/19/2002	US20020192912 Asymmetric gates for high density DRAM
12/19/2002	US20020192911 Damascene double gated transistors and related manufacturing methods
12/19/2002	US20020192910 Simultaneous formation of charge storage and bitline to wordline isolation
12/19/2002	US20020192909 Nucleation for improved flash erase characteristics
12/19/2002	US20020192908 Split gate field effect transistor (fet) device with annular floating gate electrode and method for fabrication thereof
12/19/2002	US20020192907 Method of manufacturing semiconductor capacitor
12/19/2002	US20020192906 Method for forming a capacitor of a semiconductor device
12/19/2002	US20020192905 Method of manufacturing semiconductor integrated circuit devices having a memory device with a reduced bit line stray capacity and such semiconductor integrated circuit devices
12/19/2002	US20020192904 Low leakage MIM capacitor
12/19/2002	US20020192903 Semiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitry
12/19/2002	US20020192902 Semiconductor memory device and manufacturing method thereof
12/19/2002	US20020192901 Semiconductor memory device and manufacturing method thereof
12/19/2002	US20020192900 Methods of patterning a multi-layer film stack and forming a lower electrode of a capacitor
12/19/2002	US20020192899 Fabrication method for semiconductor integrated devices
12/19/2002	US20020192898 Field emission device
12/19/2002	US20020192897 Method for in-situ removal of side walls in MOM capacitor formation
12/19/2002	US20020192896 Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device
12/19/2002	US20020192894 Method for forming a super self-aligned hetero-junction bipolar transistor
12/19/2002	US20020192893 Semiconductor device and method of fabricating the same
12/19/2002	US20020192890 Mosfet device and fabrication method thereof
12/19/2002	US20020192889 Method for using thin spacers and oxidation in gate oxides
12/19/2002	US20020192888 Surface engineering to prevent epi growth on gate poly during selective epi processing
12/19/2002	US20020192887 Non-volatile semiconductor memory and method of making same, and semiconductor device and method of making device
12/19/2002	US20020192886 Semiconductor device and manufacturing method thereof
12/19/2002	US20020192885 Fabrication process for thin film transistors in a display or electronic device
12/19/2002	US20020192884 Method for forming thin film transistor with reduced metal impurities
12/19/2002	US20020192882 Method of fabricating thin film transistor
12/19/2002	US20020192881 High-dielectric constant insulators for feol capacitors
12/19/2002	US20020192878 Programmable connector/isolator and double polysilicon layer CMOS process with buried contact using the same
12/19/2002	US20020192877 Method of fabricating read only memory
12/19/2002	US20020192876 Transfer molding of integrated circuit packages
12/19/2002	US20020192875 Method for fabricating a circuit device
12/19/2002	US20020192872 Method of manufacturing semiconductor device
12/19/2002	US20020192869 Semiconductor package and fabrication method of the same
12/19/2002	US20020192868 Semiconductor device having LDD-type source/drain regions and fabrication method thereof
12/19/2002	US20020192867 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
12/19/2002	US20020192866 Semiconductor device and semiconductor chip for use therein
12/19/2002	US20020192865 Process for mounting electronic device and semiconductor device
12/19/2002	US20020192864 Method of manufacturing integrated circuits
12/19/2002	US20020192863 Multimedia chip package
12/19/2002	US20020192862 BGA package and method of fabrication
12/19/2002	US20020192861 Method and apparatus for filling a gap between spaced layers of a semiconductor
12/19/2002	US20020192860 Semiconductor device and method for fabricating the same
12/19/2002	US20020192858 Method for fabricating a circuit device
12/19/2002	US20020192857 Method for fabricating a circuit device
12/19/2002	US20020192856 Method for connecting a chip to an antenna in a contactless smart card radio frequency identification device
12/19/2002	US20020192855 Semiconductor device and method for manufacturing the same
12/19/2002	US20020192853 Thin-film resistor with high temperature coefficient for use as passive semiconductor component for integrated circuits, and method for producing the same
12/19/2002	US20020192852 Micromechanical and microoptomechanical structures with backside metalization
12/19/2002	US20020192851 Method for treating surface of organic insulating film and method of fabricating thin film transistor substrate using the same
12/19/2002	US20020192845 Optical marker layer for etch endpoint determination
12/19/2002	US20020192844 Post epitaxial thermal oxidation
12/19/2002	US20020192693 Apparatus for polymer synthesis
12/19/2002	US20020192598 Defining multiple position-measurement marks on the reticle; using a reticle-inspection device detecting respective positional coordinates of marks on the reticle; mounting reticle in the microlithography apparatus and detecting
12/19/2002	US20020192595 Multi-layered resist structure and manufacturing method of semiconductor device
12/19/2002	US20020192593 Used as chemically amplified resist, exhibits high sensitivity, resolution, radiation transmittance, and surface smoothness, and is free from the problem of partial insolublization during overexposure
12/19/2002	US20020192592 Negative-working resist composition for electron beams or X-rays
12/19/2002	US20020192579 Gas purge method and exposure apparatus
12/19/2002	US20020192578 Using same inspection wavelength as an exposure wavelength for use in exposure apparatus and using detection optical system of inspection apparatus having a numerical aperture larger than a numerical aperture of projection optical system
12/19/2002	US20020192577 Forming first separated features on a surface, forming second separated features on surface interleaved between first separated features, and illuminating first and second separated features and detecting an interference pattern
12/19/2002	US20020192573 Exposure mask, method for manufacturing the mask, and exposure method
12/19/2002	US20020192570 Optical proximity correction method utilizing ruled ladder bars as sub-resolution assist features
12/19/2002	US20020192509 Mixed composition interface layer and method of forming
12/19/2002	US20020192475 Placing tetraethoxysilane precursor and oxygen in plasma state, decomposing tetraethoxysilane gas into active species, reacting with oxygen ions or radicals in the plasma, depositing active species on substrate
12/19/2002	US20020192464 Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same
12/19/2002	US20020192396 Method of titanium/titanium nitride integration
12/19/2002	US20020192394 Thin polycrystalline silicon film forming method and thin film forming apparatus
12/19/2002	US20020192391 Method and apparatus for treating surface of substrate plate
12/19/2002	US20020192377 Gas distribution system
12/19/2002	US20020192374 Method of forming CVD titanium film
12/19/2002	US20020192369 Vapor deposition method and apparatus
12/19/2002	US20020192363 Electroless process for the preparation of particle enhanced electric contact surfaces
12/19/2002	US20020192358 Substrate processing apparatus and substrate processing method
12/19/2002	US20020192320 Method and apparatus for filling a gap between spaced layers of a semiconductor
12/19/2002	US20020192060 Automated cassette opening
12/19/2002	US20020192059 Methods and apparatus for transferring electrical components
12/19/2002	US20020192057 System for transporting substrates
12/19/2002	US20020192056 Method and apparatus for transferring a semiconductor substrate
12/19/2002	US20020192055 Wafer transfer control apparatus and method for transferring wafer
12/19/2002	US20020191835 Capacitive alignment structure and method for chip stacking
12/19/2002	US20020191668 Using refractory metal silicidation phase transition temperature points to control and/or calibrate rtp low temperature operation
12/19/2002	US20020191654 Laser lithography light source with beam delivery
12/19/2002	US20020191486 Chemical supply system and chemical mixing apparatus
12/19/2002	US20020191468 Fuse circuit using anti-fuse and method for searching for failed address in semiconductor memory
12/19/2002	US20020191461 Reduced area sense amplifier isolation layout in a dynamic RAM architecture
12/19/2002	US20020191458 Semiconductor integrated circuit device, production and operation method thereof
12/19/2002	US20020191455 Memory cell arrangement and method for its fabricating it
12/19/2002	US20020191453 Nonvolatile semiconductor memory device
12/19/2002	US20020191447 Semiconductor integrated circuit
12/19/2002	US20020191445 Semiconductor device
12/19/2002	US20020191443 Nonvolatile semiconductor memory device and programming method thereof
12/19/2002	US20020191441 Nonvolatile semiconductor memory device
12/19/2002	US20020191438 Semiconductor device with improved latch arrangement
12/19/2002	US20020191436 Semiconductor memory device
12/19/2002	US20020191432 Read-only MOS memory
12/19/2002	US20020191382 Surface-mount device and method for manufacturing the surface-mount device
12/19/2002	US20020191380 Method and device for interconnecting, electronic components in three dimensions

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