H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2002
12/26/2002	US20020194968 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby
12/26/2002	US20020194789 Polishing composition
12/26/2002	US20020194745 Wafer alignment device
12/26/2002	US20020194731 Fabrication method and structure of an integrated circuit package
12/26/2002	US20020194716 Modular semiconductor workpiece processing tool
12/25/2002	CN2528108Y Testing device for semiconductor potted element
12/25/2002	CN1387681A Metal redistribution layer having solderable pads and wire bondable pads
12/25/2002	CN1387680A Low dielectric-constant etch stop layer in dual damascene process
12/25/2002	CN1387679A Manufacture of integrated circuit isolation structure
12/25/2002	CN1387678A Mold
12/25/2002	CN1387677A Method to fabricate MOSFET
12/25/2002	CN1387676A Improved apparatus and method for integrated circuit planarization
12/25/2002	CN1387675A Method for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidifcation
12/25/2002	CN1387674A System and methods using sequential lateral solidifcation for producing single or polycrystalline silicon thin films at low temperatures
12/25/2002	CN1387673A Method and apparatus for supercritical processing of multiple workpieces
12/25/2002	CN1387556A Use of CsOH in dielectric CMP slurry
12/25/2002	CN1387267A Organic semiconductor device having short channel
12/25/2002	CN1387263A Flash memory cell and its preparing process
12/25/2002	CN1387262A Semiconductor IC
12/25/2002	CN1387261A 半导体装置 Semiconductor device
12/25/2002	CN1387260A Embedded flash memory cell written and erased via channel and its preparing process
12/25/2002	CN1387254A IC package structure without anti-welding film and its method
12/25/2002	CN1387253A High-density IC package structure and its method
12/25/2002	CN1387251A Processing method binded by selenide chip for atomic resolution store shuffling device
12/25/2002	CN1387250A Processing method binded by selenide chip for atomic resolution store shuffling device
12/25/2002	CN1387249A Grinding-flatening method for IC
12/25/2002	CN1387248A Semiconductor device isolating method
12/25/2002	CN1387247A System for debugging semiconductor IC
12/25/2002	CN1387246A Voltage metering method, electric test method and device, and method for mfg. semiconductor device and device substrate
12/25/2002	CN1387245A Circuit and method for testing time-dependent dielectric breakdown
12/25/2002	CN1387244A Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device
12/25/2002	CN1387243A Resin packaging system
12/25/2002	CN1387242A Method for forming packaging of flip-chip semiconductor, and semiconductor package and substrate thereby
12/25/2002	CN1387241A Method for forming packaging of flip-chip semiconductor
12/25/2002	CN1387239A Circuit board, semiconductor device mfg. method, and electroplating system
12/25/2002	CN1387238A Method for mfg. semiconductor device
12/25/2002	CN1387237A Depositing and flatening process for thin film
12/25/2002	CN1387236A High pressure treating device and method
12/25/2002	CN1387235A Method and system for washing semiconductor chip
12/25/2002	CN1387234A Method for plasma corrosion of irdium-tantalum-oxide electrode, and method for cleaning after corrosion
12/25/2002	CN1387233A Method and system for mfg. group III-V compound semiconductor, and group III-V compound semiconductor
12/25/2002	CN1387232A Photoetch process with multiple dosages and regional exposure
12/25/2002	CN1387231A Nitride-based compound semiconductor crystal substrate structure and mfg. method thereof
12/25/2002	CN1387195A Magnetic recording element, magnetic memory, magnetic recording method, and method for mfg. magnetic recording element and method for mfg. magnetic memory
12/25/2002	CN1387090A Method for removing anticorrosive additive material
12/25/2002	CN1387088A Device isolating process flow for ARS system
12/25/2002	CN1386987A 流体控制装置 Fluid control apparatus
12/25/2002	CN1386898A Horizontal reacting furnace for mfg. semiconductor compound
12/25/2002	CN1386813A Pressure-sensitive adhered sheet for processing semiconductor chip
12/25/2002	CN1386606A Method and device for cutting nonmetal substrate using laser beam
12/25/2002	CN1097421C Component mounting apparatus
12/25/2002	CN1097317C Laser diode
12/25/2002	CN1097316C Process for preparing thin-film transistor, process for preparing active matrix substrate, and liquid crystal display
12/25/2002	CN1097314C 半导体存储装置 The semiconductor memory device
12/25/2002	CN1097313C Lead frame mfg. method
12/25/2002	CN1097312C Lead frame and mfg. method therefor, and semiconductor device using same
12/25/2002	CN1097311C Semiconductor device fabricating method and semiconductor device
12/25/2002	CN1097310C Method of forming well of semiconductor device
12/25/2002	CN1097309C Method of producing EEPROM-semiconductor structure
12/25/2002	CN1097308C Process for producing semiconductor device having hemispherical grains
12/25/2002	CN1097307C Method for making semiconductor device
12/25/2002	CN1097306C Method for forming field region of semiconductor device
12/25/2002	CN1097305C Selectively filled adhesive film contg. fluxing agent
12/25/2002	CN1097304C Semiconductor device fabrication method
12/25/2002	CN1097303C Method for mfg. semiconductor device
12/25/2002	CN1097302C Method for forming plug in semiconductor device
12/25/2002	CN1097301C Method and apparatus for in situ removal of contaminants from ion beam neutralization and implantation apparatuses
12/25/2002	CN1097300C Method for making semiconductor device, display device and electronic apparatus
12/25/2002	CN1097298C Method of making crystal silicon semiconductor and thin film transistor
12/25/2002	CN1097210C Light sensitive composition contg. arylhydrazo dye
12/25/2002	CN1097163C Getter pump module and system
12/25/2002	CN1097091C Cleaning agent article for cleaning photoresist during mfg. semiconductor
12/25/2002	CN1097003C Wafer shipper and package
12/25/2002	CN1096915C Workpiece inspection and handling
12/24/2002	US6499133 Method of optimizing placement of elements
12/24/2002	US6499121 Distributed interface for parallel testing of multiple devices using a single tester channel
12/24/2002	US6499118 Redundancy analysis method and apparatus for ATE
12/24/2002	US6499007 Parameter editing method and semiconductor exposure system
12/24/2002	US6498997 Method and apparatus for producing a solid actuator and medium storing a program for controlling the same
12/24/2002	US6498898 Uniform heat trace and secondary containment for delivery lines for processing system
12/24/2002	US6498753 Semiconductor storage device and production method thereof
12/24/2002	US6498744 Ferroelectric data processing device
12/24/2002	US6498742 Memory device
12/24/2002	US6498741 Semiconductor memory device
12/24/2002	US6498739 Applications for non-volatile memory cells
12/24/2002	US6498640 Method to measure alignment using latent image grating structures
12/24/2002	US6498528 Reference voltage generation circuit
12/24/2002	US6498508 Semiconductor integrated circuit device and testing method therefor
12/24/2002	US6498472 Method for handling a module IC and a carrier of a module IC handler
12/24/2002	US6498401 Alignment mark set and method of measuring alignment accuracy
12/24/2002	US6498400 Semiconductor devices
12/24/2002	US6498399 Polysiloxane, polysilsesquioxane, polyphenylene ethers, organosilicone polymers and/or fluoropolymers; microelectronics
12/24/2002	US6498398 Semiconductor device having through holes selectively through isolation material covering wirings that are relatively far apart
12/24/2002	US6498396 Semiconductor chip scale package and ball grid array structures
12/24/2002	US6498394 IC packages with diamond substrate thermal conductor
12/24/2002	US6498393 Semiconductor device and method for the fabrication thereof
12/24/2002	US6498392 Semiconductor devices having different package sizes made by using common parts
12/24/2002	US6498387 Wafer level package and the process of the same
12/24/2002	US6498386 Cylindrical semiconductor capacitor
12/24/2002	US6498385 Post-fuse blow corrosion prevention structure for copper fuses

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