Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2003
01/02/2003US20030001134 Cleaning gasses and etching gases
01/02/2003US20030001118 Overhead-traveling carrying apparatus
01/02/2003US20030001116 Locator pin integrated with sensor for detecting semiconductor substrate carrier
01/02/2003US20030001114 Projection exposure method and apparatus
01/02/2003US20030001111 Apparatus for monitoring ion-implantation input parameter in semiconductor fabricating devices and monitoring method thereof
01/02/2003US20030001109 Focused ion beam equipment and focused ion beam processing method using same
01/02/2003US20030001107 Lithographic apparatus, device manufacturing method, and device manufactured thereby
01/02/2003US20030001103 Wafer chuck, exposure system, and method of manufacturing semiconductor device
01/02/2003US20030001083 Self contained sensing apparatus and system
01/02/2003US20030000998 Chip mounting method
01/02/2003US20030000995 Recognition device, bonding device, and method of manufacturing a circuit device
01/02/2003US20030000994 Transducer and a bonding apparatus using the same
01/02/2003US20030000993 Recognition device, bonding device, and method of manufacturing a circuit device
01/02/2003US20030000938 Ceramic heater, and ceramic heater resistor paste
01/02/2003US20030000937 Ceramic heater
01/02/2003US20030000936 Heating chamber and method of heating a wafer
01/02/2003US20030000923 Self-aligned contact process implementing bias compensation etch endpoint detection and methods for implementing the same
01/02/2003US20030000922 Using scatterometry to develop real time etch image
01/02/2003US20030000921 Mask repair with electron beam-induced chemical etching
01/02/2003US20030000920 Etching method using photoresist etch barrier
01/02/2003US20030000917 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
01/02/2003US20030000915 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
01/02/2003US20030000913 Highly selective process for etching oxide over nitride using hexafluorobutadiene
01/02/2003US20030000898 Shelf module adapted to store substrate carriers
01/02/2003US20030000844 Method for achieving copper fill of high aspect ratio interconnect features
01/02/2003US20030000841 For deposition of a metal layer onto a wafer or other substrate
01/02/2003US20030000840 Electroplating apparatus and method
01/02/2003US20030000827 System for chemical vapor deposition at ambient temperature using electron cyclotron resonance and method for depositing metal composite film using the same
01/02/2003US20030000775 Lift pin actuating mechanism for semiconductor processing chamber
01/02/2003US20030000736 Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate
01/02/2003US20030000724 Thermomechanical process for producing a planar resist structure
01/02/2003US20030000648 Process chamber used in manufacture of semiconductor device, capable of reducing contamination by particulates
01/02/2003US20030000647 Substrate processing chamber
01/02/2003US20030000646 Plasma reactor
01/02/2003US20030000645 Apparatus and method for reducing leakage in a capacitor stack
01/02/2003US20030000644 Using scatterometry for etch end points for dual damascene process
01/02/2003US20030000638 Method of bonding a stack of layers by electromagnetic induction heating
01/02/2003US20030000635 Method of transferring a substiantially disc-shaped workpiece, and device for carrying out this method
01/02/2003US20030000554 Method of reducing water spotting and oxide growth on a semiconductor structure
01/02/2003US20030000550 Substrate cleaning apparatus with brush force control and method
01/02/2003US20030000548 Semiconductor wafers are cleaned by immersing in cleaning solution of ultra- pure water containing ozone in a first cleaning tank; immersing them cleaning solution of ultra-pure water containing hydrogen, applying ultrasonic waves
01/02/2003US20030000476 Substrate processing apparatus, conveying unit thereof, and semiconductor device fabricating Method
01/02/2003US20030000475 Apparatus to sputter silicon films
01/02/2003US20030000474 Devices fabricated using apparatus to sputter silicon films
01/02/2003US20030000473 Method of delivering gas into reaction chamber and shower head used to deliver gas
01/02/2003US20030000472 Vacuum plate having a symmetrical air-load block
01/02/2003US20030000471 Method and apparatus for manufacturing semiconductor devices
01/02/2003US20030000470 Method and device for forming required gas atmosphere
01/02/2003US20030000469 Chemical enhancer treatment chamber and a Cu, thin film deposition apparatus of a semiconductor device using the same
01/02/2003US20030000468 Method and apparatus for accessing a multiple chamber semiconductor wafer processing system
01/02/2003US20030000462 Dispensing system and method
01/02/2003US20030000459 Process chamber used in manufacture of semiconductor device, capable of reducing contamination by particulates
01/02/2003US20030000457 Pulling room
01/02/2003US20030000455 System and method for regulating lateral growth in laser irradiated silicon films
01/02/2003US20030000453 Optical element and manufacturing method thereof
01/02/2003US20030000422 For forming a uniform film free from uneven coating (striation)
01/02/2003US20030000344 Edged ceramic member and a method of manufacturing same
01/02/2003US20030000302 Method and apparatus for testing of sheet material
01/02/2003US20030000301 Method and apparatus for testing of sheet material
01/02/2003US20030000102 Wafer drying apparatus and method
01/02/2003US20030000079 Method for manufacturing multilayer ceramic substrates
01/02/2003US20030000075 Apparatus and method for carrying substrate
01/02/2003US20030000034 Apparatus and method for substrate preparation implementing a surface tension reducing process
01/02/2003EP1272020A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body
01/02/2003EP1272006A1 Ceramic heater
01/02/2003EP1271784A2 PLD architecture for flexible placement of IP function blocks
01/02/2003EP1271721A2 Optical semiconductor device
01/02/2003EP1271663A2 A III nitride film and III nitride multilayer
01/02/2003EP1271662A1 Iii nitride compound semiconductor device
01/02/2003EP1271661A2 Photovoltaic device
01/02/2003EP1271658A1 Ferroelectric film capacitor structure with selective doping
01/02/2003EP1271657A1 Integrated semiconducteur DRAM memory device and method for fabricating the same
01/02/2003EP1271656A2 Thin film Semiconductor device and method of manufacturing the same
01/02/2003EP1271654A1 Semiconductor device and method of manufacturing the same
01/02/2003EP1271653A1 Insulated-gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device
01/02/2003EP1271652A2 A semiconductor memory and its production process
01/02/2003EP1271651A2 SRAM device
01/02/2003EP1271647A2 Compound semiconductor device
01/02/2003EP1271644A1 Wiring board, semiconductor device, and method of manufacturing wiring board
01/02/2003EP1271643A1 A method of forming a bitline and a bitline contact and a dynamic memory cell
01/02/2003EP1271642A2 Method for evaluating dependence of properties of semiconductor substrate on plane orientation and semiconductor device using the same
01/02/2003EP1271641A1 Method and apparatus for mounting chip
01/02/2003EP1271640A2 Mold for manufacturing semiconductor device
01/02/2003EP1271639A2 Method of making a DMOS transistor
01/02/2003EP1271638A2 Method of making a DMOS transistor
01/02/2003EP1271637A2 Method of making a DMOS transistor
01/02/2003EP1271636A1 Thermal oxidation process control by controlling oxidation agent partial pressure
01/02/2003EP1271635A1 Process of thermal oxidation of an implanted semiconductor substrate
01/02/2003EP1271634A2 Methods for forming low-K dielectric films
01/02/2003EP1271633A2 Method of functionalization and passivation of the surface of silicon wafers by electrodeposition of thin organic layers
01/02/2003EP1271632A1 Method of forming insulating film and method of producing semiconductor device
01/02/2003EP1271631A1 A method for producing semiconductor devices using chemical mechanical polishing
01/02/2003EP1271630A2 Nitride compound based semiconductor device and manufacturing method of same
01/02/2003EP1271629A2 Process for selectively treating complementary regions of a semiconductor surface and semiconductor product obtained thereby
01/02/2003EP1271628A2 Method of doping a semiconductor
01/02/2003EP1271627A2 Method of forming an epitaxially grown nitride-based compound semiconductor crystal substrate structure and respective substrate structure
01/02/2003EP1271626A2 Thin film device and its fabrication method
01/02/2003EP1271625A2 Method of fabrication compound semiconductor device
01/02/2003EP1271624A2 Capacitor, semiconductor memory device, and method for manufacturing the same
01/02/2003EP1271623A1 Gripper for manipulating thin plates