Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2003
01/07/2003US6503356 Chip element holder and method of handling chip elements
01/07/2003US6503343 Controlled plating on reactive metals
01/07/2003US6503336 Techniques for modifying a circuit board using a flow through nozzle
01/07/2003US6503335 Centrifuge and method for centrifuging a semiconductor wafer
01/07/2003US6503333 Method for cleaning semiconductor wafers with ozone-containing solvent
01/07/2003US6503321 To form a damage layer at an implantation depth below a top surface of said crystal structure, and chemically etching the damage layer to detach a single crystal film from the crystal structure; optoelectronic devices
01/07/2003US6503314 A ferroelectric and dielectric source solution for use in chemical vapor deposition processes includes a ferroelectric/dielectric chemical vapor deposition precursor; and a solvent for carrying the ferroelectric dielectric
01/07/2003US6503134 Carrier head for a chemical mechanical polishing apparatus
01/07/2003US6503130 Adsorption means applying a vacuum to a part of a protective film adhered in an electrical circuit patterned side of a wafer, and separating the part of the protective film from the patterned side of the wafer; and peeling pressing
01/07/2003US6503129 Activated slurry CMP system and methods for implementing the same
01/07/2003US6503127 Apparatus and methods for substantial planarization of solder bumps
01/07/2003US6503079 Substrate processing apparatus and method for manufacturing semiconductor device
01/07/2003US6502881 Gripper for picking apparatus of a module IC handler
01/07/2003US6502869 Pod door to port door retention system
01/07/2003US6502738 Wire bonding apparatus
01/07/2003US6502591 Surface tension effect dryer with porous vessel walls
01/07/2003US6502530 Design of gas injection for the electrode in a capacitively coupled RF plasma reactor
01/07/2003US6502529 Chamber having improved gas energizer and method
01/07/2003US6502273 Cleaning sponge roller
01/07/2003US6502271 Method and apparatus for cleaning workpieces with uniform relative velocity
01/07/2003CA2233096C Substrate and production method thereof
01/06/2003CA2392460A1 Resonator for ultrasonic wire bonding
01/05/2003CA2391223A1 Circuit board, method for manufacturing same, and high-output module
01/05/2003CA2391218A1 Cicuit board, method for manufacturing same, and high-output module
01/03/2003WO2003001858A1 Method and device for installation
01/03/2003WO2003001671A2 Improved enhancement of p-type metal-oxide-semiconductor field-effect transistors
01/03/2003WO2003001607A1 Mosfets with strained semiconductor layers
01/03/2003WO2003001606A1 Thin film transistor array panel and method for fabricating the same
01/03/2003WO2003001605A1 Semiconductor device and its manufacturing method
01/03/2003WO2003001604A2 Double gated transistor and method of fabrication
01/03/2003WO2003001603A2 Bipolar transistor with raised extrinsic base fabricated in an integrated bicmos circuit
01/03/2003WO2003001601A2 Spacer etch mask for sonos memory
01/03/2003WO2003001600A2 Memory cell, memory cell configuration and method for producing the same
01/03/2003WO2003001599A1 Semiconductor device and its driving method
01/03/2003WO2003001596A1 Electronic device and method for manufacturing the same
01/03/2003WO2003001593A2 Sti process for dram
01/03/2003WO2003001592A1 Method for manufacturing semiconductor device
01/03/2003WO2003001590A2 System and method to form a composite film stack utilizing sequential deposition techniques
01/03/2003WO2003001589A2 A method of selectively alloying interconnect regions by depostion process
01/03/2003WO2003001588A2 Method for producing an electronic component, especially a memory chip
01/03/2003WO2003001587A2 Method of transferring a substantially disc-shaped workpiece
01/03/2003WO2003001586A1 Mounting method and device
01/03/2003WO2003001585A1 Extension of fatigue life for c4 solder ball in a chip to substrate connection
01/03/2003WO2003001584A1 A non-self-aligned sige heterojunction bipolar transistor
01/03/2003WO2003001583A2 Process for producing silicon on insulator structure having intrinsic gettering by ion implantation
01/03/2003WO2003001582A2 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
01/03/2003WO2003001581A2 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
01/03/2003WO2003001580A1 Thermal oxidation process control by controlling oxidation agent partial pressure
01/03/2003WO2003001579A1 Substrate treating device and substrate treating method
01/03/2003WO2003001577A1 Dry-etching method
01/03/2003WO2003001576A2 Assisted rinsing in a single wafer cleaning process
01/03/2003WO2003001575A2 Preparation of graded semiconductor films by the layer-by-layer assembly of nanoparticles
01/03/2003WO2003001574A2 Double-sided semiconductor structures utilizing a compliant substrate
01/03/2003WO2003001572A2 Positioning device
01/03/2003WO2003001570A2 Silicon nanoparticle electronic switches
01/03/2003WO2003001565A2 Method for improved die release of a semiconductor device from a wafer
01/03/2003WO2003001564A2 Semiconductor structure with a superlattice portion
01/03/2003WO2003001558A1 Plasma treating apparatus
01/03/2003WO2003001557A1 Electrode member for plasma treating apparatus, plasma treating apparatus and plasma treating method
01/03/2003WO2003001532A2 Current source and drain arrangement for magnetoresistive memories (mrams)
01/03/2003WO2003001294A1 Resist compositions with polymers having 2-cyano acrylic monomer
01/03/2003WO2003001186A1 Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
01/03/2003WO2003001185A1 Systems and methods for inspection of transparent mask substrates
01/03/2003WO2003001136A1 Cooling plate and method of producing the same
01/03/2003WO2003000964A1 METHOD FOR PREPARING GaN BASED COMPOUND SEMICONDUCTOR CRYSTAL
01/03/2003WO2003000962A1 Silicon single crystal substrate, epitaxial wafer, and method for manufacturing them
01/03/2003WO2003000950A1 Topologically tailored sputtering targets
01/03/2003WO2003000816A1 Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same
01/03/2003WO2003000619A1 Ceramic component and production method therefor
01/03/2003WO2003000472A1 System for conveying and transferring semiconductor or liquid crystal wafer one by one
01/03/2003WO2003000462A1 Arrangement and method for conditioning a polishing pad
01/03/2003WO2003000456A2 Method for carrying out local laser-induced etching of solid materials
01/03/2003WO2003000454A1 Controlled attenuation capillary with planar surface
01/03/2003WO2002059939A3 Method for fabricating a semiconductor device
01/03/2003WO2002056388A3 Sensor semiconductor package, provided with an insert, and method for making same
01/03/2003WO2002045128A3 Zirconium-doped bst materials and mocvd process for forming same
01/03/2003WO2002043125A3 Ald method to improve surface coverage
01/03/2003WO2002041076A3 Photolithographic mask
01/03/2003WO2002025749A3 Magnetic layer system and a component comprising such a layer system
01/03/2003WO2002022919A3 Forming a single crystal semiconductor film on a non-crystalline surface
01/03/2003WO2002021593A3 Method of forming titanium nitride (tin) films using metal-organic chemical vapor deposition (mocvd)
01/03/2003WO2002021576A3 Organic nanoelectric conductors
01/03/2003WO2002018266A8 Single molecule array on silicon substrate for quantum computer
01/03/2003WO2002013254A3 Electroplating multi-trace circuit board substrates using single tie bar
01/03/2003WO2002005327A3 Semiconductor substrate processing tool and fabrications facilities integration plate
01/03/2003WO2001097285A3 Electronic component consisting of a housing and a substrate
01/03/2003WO2001069459A3 Standard block architecture for integrated circuit design
01/03/2003CA2433033A1 Topologically tailored sputtering targets
01/02/2003US20030005405 Method for improving substrate alignment
01/02/2003US20030005399 Layout design system, layout design method and layout design program of semiconductor integrated circuit, and method of manufacturing the same
01/02/2003US20030005395 Method and apparatus for determining optimum size of LSI chip
01/02/2003US20030005394 I.C. cell and library identification
01/02/2003US20030005392 Method of designing a logic circuit
01/02/2003US20030005209 Semiconductor integrated circuit
01/02/2003US20030004586 Virtualized generic equipment model data and control router for factory automation
01/02/2003US20030004289 Radiation transparent, sensitivity, chemical resistance
01/02/2003US20030004283 Protective coatings
01/02/2003US20030004218 Porous materials
01/02/2003US20030004085 Comprises a component for rendering a water-insoluble compound containing a metal atom or its ion separated from a surface to be polished water-soluble
01/02/2003US20030003853 Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit