Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/25/2003US6536450 Fluid heating system for processing semiconductor materials
03/25/2003US6536449 Semiconductor wafer residues left after photoresist ashing and/or reactive ion etching processes; halogen containing gas (fluorocarbon) and ammonia and substantially no oxygen
03/25/2003US6536237 Laser annealing system
03/25/2003US6536136 Substrate transfer apparatus and substrate method
03/25/2003US6536131 Wafer handling system
03/25/2003US6536106 Electric field assisted assembly process
03/25/2003US6536105 Method for mounting conductive balls on a substrate
03/25/2003CA2155091C Bonding material and bonding method for electric element
03/20/2003WO2003024171A2 Method of treating photoresists using electrodeless uv lamps
03/20/2003WO2003024169A1 A stacked multi-layer module and methods of side connection thereto and of manufacturing
03/20/2003WO2003024165A1 Heat dissipating element for electronic components
03/20/2003WO2003024091A1 Photodiode cmos imager with column-feedback soft-reset
03/20/2003WO2003023877A2 Surface modifying layers for organic thin film transistors
03/20/2003WO2003023866A1 Thin film semiconductor device and method for fabricating the same
03/20/2003WO2003023865A1 Semiconductor device and its manufacturing method
03/20/2003WO2003023864A1 Production method for semiconductor device
03/20/2003WO2003023863A2 Trench-gate semiconductor devices and their manufacture
03/20/2003WO2003023862A1 Edge termination in a trench-gate mosfet
03/20/2003WO2003023860A1 Contact method for thin silicon carbide epitaxial layer and semiconductor devices formed by those methods
03/20/2003WO2003023859A1 Bi-layer silicon film and method of fabrication
03/20/2003WO2003023858A1 Ferroelectric memory device and its manufacturing method
03/20/2003WO2003023855A2 Semiconductor device with compliant electrical terminals, apparatus including the semiconductor device, and methods for forming same
03/20/2003WO2003023849A1 Microelectronic mechanical system and methods
03/20/2003WO2003023848A2 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
03/20/2003WO2003023847A2 Integrated circuit, portable device and method for manufacturing an integrated circuit
03/20/2003WO2003023845A1 Specimen carrier, and specimen carrying system
03/20/2003WO2003023844A1 Film evaluating method, temperature measuring method, and semiconductor device manufacturing method
03/20/2003WO2003023843A1 Semiconductor device, its manufacturing method, and radio communication device
03/20/2003WO2003023842A1 Method and apparatus for forming low permittivity film and electronic device using the film
03/20/2003WO2003023841A1 Flash step preparatory to dielectric etch
03/20/2003WO2003023840A2 Methods and apparatus for cleaning and/or treating a substrate using co¿2?
03/20/2003WO2003023838A1 n ELECTRODE FOR III GROUP NITRIDE BASED COMPOUND SEMICONDUCTOR ELEMENT
03/20/2003WO2003023837A1 ELECTRODE FOR p-TYPE SiC
03/20/2003WO2003023836A1 Apparatus for repairing defect of substrate
03/20/2003WO2003023834A2 Method of manufacturing optical devices and related improvements
03/20/2003WO2003023833A1 Homogenization of a spatially coherent radiation beam and printing and inspection, respectively, of a pattern on a workpiece
03/20/2003WO2003023831A1 Silicone resins and porous materials produced therefrom
03/20/2003WO2003023830A2 Spray member and method for using the same
03/20/2003WO2003023829A2 Sealing system and pressure chamber assembly including the same
03/20/2003WO2003023828A1 Guard heater and pressure chamber assembly including the same
03/20/2003WO2003023827A1 Pressure chamber assembly including drive means
03/20/2003WO2003023826A2 Methods and apparatus for holding a substrate in a pressure chamber
03/20/2003WO2003023825A2 Substrate processing apparatus
03/20/2003WO2003023821A2 Hermetic seal
03/20/2003WO2003023820A2 Boat for ball attach manufacturing process and method of fabricating reliable flip-chip assembly
03/20/2003WO2003023819A2 Apparatus with compliant electrical terminals, and methods for forming same
03/20/2003WO2003023818A2 Electromechanical memory having cell selection circuitry constructed with nanotube technology
03/20/2003WO2003023817A2 Process for forming semiconductor quantum dots with superior structural and morphological stability
03/20/2003WO2003023794A2 Method for trimming resistors
03/20/2003WO2003023521A1 A zoom system, in particular, a zoom system for an illumination device of a microlithographic projection system
03/20/2003WO2003023518A1 Method for high resolution patterning using low-energy electron beam, process for preparing nano device using the method
03/20/2003WO2003023517A1 Method for high resolution patterning using soft x-ray, process for preparing nano device using the method
03/20/2003WO2003023507A1 Method for removing organic alignment layer coated on substrates and recovering the substrates using plasma
03/20/2003WO2003023488A1 Graphics engine for high precision lithography
03/20/2003WO2003023095A1 Semiconductor wafer and its manufacturing method
03/20/2003WO2003023093A2 Susceptor with epitaxial growth control devices and epitaxial reactor using the same
03/20/2003WO2003022949A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
03/20/2003WO2003022778A2 Low temperature cofired ceramics (ltcc) temperature stability
03/20/2003WO2003022733A2 Nanotube films and articles
03/20/2003WO2003022732A2 Method for the production of a membrane
03/20/2003WO2003022534A1 Wafer position teaching method and teaching jig
03/20/2003WO2003022522A1 Polishing device
03/20/2003WO2003022519A2 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
03/20/2003WO2003008666B1 Electrostatic chuck with dielectric coating
03/20/2003WO2003008352B1 Device and method for scribing fragile material substrate
03/20/2003WO2003008157A8 Centering double side edge grip end effector with integrated mapping sensor
03/20/2003WO2003003462A3 Trench capacitor and corresponding method of production
03/20/2003WO2003003430A3 Film or layer made of semi-conductive material and method for producing said film or layer
03/20/2003WO2003003414A3 Directed gas injection apparatus for semiconductor processing
03/20/2003WO2003002860A3 Directed gas injection apparatus for semiconductor processing
03/20/2003WO2003001589A3 A method of selectively alloying interconnect regions by depostion process
03/20/2003WO2002099534A9 Lighting system with a plurality of individual grids
03/20/2003WO2002093639A3 Arrangement and method for detecting defects on a substrate in a processing tool
03/20/2003WO2002091437A3 Tisin barrier formation with treatment in n2/h2 plasma and in silane
03/20/2003WO2002082550A3 Memory cell array and method for the production thereof
03/20/2003WO2002080235A3 A method for fabrication of a high capacitance interpoly dielectric
03/20/2003WO2002080230A3 Method of plasma etching low-k organosilicate materials
03/20/2003WO2002078903A3 Method and apparatus for avoiding particle accumulation during an electrochemical process
03/20/2003WO2002078083A3 In-street integrated circuit wafer via
03/20/2003WO2002078064A3 Electrochemical etching process
03/20/2003WO2002078045A3 Methods and apparatus for scanned beam uniformity adjustment in ion implanters
03/20/2003WO2002075797A3 Method of forming copper interconnects
03/20/2003WO2002073702A9 Integrated toroidal coil inductors for ic devices
03/20/2003WO2002073669A3 Method of making layered superlattice material with improved microstructure
03/20/2003WO2002071456A3 Magnetic layer processing
03/20/2003WO2002069065A3 Flow controller
03/20/2003WO2002067330A3 Electrode arrangement for charge storage and corresponding production method
03/20/2003WO2002067306A3 Non-arsenic n-type dopant implantation for improved source/drain interfaces with nickel silicides
03/20/2003WO2002067299A3 Method and related apparatus of processing a substrate
03/20/2003WO2002066714A3 Process for preparing single crystal silicon having improved gate oxide integrity
03/20/2003WO2002065541A3 Contacting microchips by means of pressure
03/20/2003WO2002065511A3 Method and apparatus for controlling etch selectivity
03/20/2003WO2002061811A3 Laser cleaning process for semiconductor material
03/20/2003WO2002060811A3 Mems singulation process utilizing protective coating
03/20/2003WO2002059947A3 Carrier head for holding a wafer and allowing processing on a front face thereof to occur
03/20/2003WO2002058140A3 Integrated inductor
03/20/2003WO2002056369A3 Method for the production of trench capacitors for integrated semiconductor memories
03/20/2003WO2002052629A3 Mechanically reinforced highly porous low dielectric constant films
03/20/2003WO2002050345A3 Semiconductor compliant substrate having a graded monocrystalline layer
03/20/2003WO2002047121A3 Funtionalized patterned surfaces
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