Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/18/2003US6534370 Method for fabricating a semiconductor device having an elevated source/drain scheme
03/18/2003US6534369 Field effect transistor and method of fabrication
03/18/2003US6534367 Trench-gate semiconductor devices and their manufacture
03/18/2003US6534365 Method of fabricating TDMOS device using self-align technique
03/18/2003US6534364 Tunnel diode layout for an EEPROM cell for protecting the tunnel diode region
03/18/2003US6534363 High voltage oxidation method for highly reliable flash memory devices
03/18/2003US6534362 Method for fabricating a memory cell configuration
03/18/2003US6534361 Method of manufacturing a semiconductor device including metal contact and capacitor
03/18/2003US6534360 Process for depositing layers on a semiconductor wafer
03/18/2003US6534359 Method of fabricating memory cell
03/18/2003US6534358 Method of fabricating semiconductor device having ferroelectric capacitor
03/18/2003US6534357 Methods for forming conductive structures and structures regarding same
03/18/2003US6534356 Method of reducing dark current for an image sensor device via use of a polysilicon pad
03/18/2003US6534355 Method of manufacturing a flash memory having a select transistor
03/18/2003US6534354 Method of manufacturing MOS transistor with fluorine implantation at a low energy
03/18/2003US6534353 Method of fabricating a thin-film transistor
03/18/2003US6534352 Method for fabricating a MOSFET device
03/18/2003US6534351 Gate-controlled, graded-extension device for deep sub-micron ultra-high-performance devices
03/18/2003US6534350 Method for fabricating a low temperature polysilicon thin film transistor incorporating channel passivation step
03/18/2003US6534349 Method of manufacturing a semiconductor device having a two-layered electrode structure
03/18/2003US6534348 Ultrascaled MIS transistors fabricated using silicon-on-lattice-matched insulator approach
03/18/2003US6534347 Edge termination for silicon power devices
03/18/2003US6534345 Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method
03/18/2003US6534344 Integrated circuit chip and method for fabricating the same
03/18/2003US6534341 Methods of wafer level fabrication and assembly of chip scale packages
03/18/2003US6534338 Method for molding semiconductor package having a ceramic substrate
03/18/2003US6534337 Lead frame type plastic ball grid array package with pre-assembled ball type contacts
03/18/2003US6534334 Method of manufacturing a non-single-crystal thin film solar cell
03/18/2003US6534332 Method of growing GaN films with a low density of structural defects using an interlayer
03/18/2003US6534328 Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same
03/18/2003US6534327 Method for reworking metal layers on integrated circuit bond pads
03/18/2003US6534326 Method of minimizing leakage current and improving breakdown voltage of polycrystalline memory thin films
03/18/2003US6534245 With cured photosensitive deielectric
03/18/2003US6534239 Resist compositions with polymers having pendant groups containing plural acid labile moieties
03/18/2003US6534225 Removed by employing methods which provide a gradual sloped region in the transparent or semi-transparent substrate which is formed in an area of the substrate opposite to that of the opaque image which is formed thereon.
03/18/2003US6534193 Liquid epoxy resin composition and semiconductor device
03/18/2003US6534190 Heat sink material in a semiconductor device comprising silicon carbide in aluminum or aluminum alloy matrix and a coating layer
03/18/2003US6534186 Chip carriers with enhanced wire bondability
03/18/2003US6534133 Methodology for in-situ doping of aluminum coatings
03/18/2003US6534125 Process for adhering an oxide of silicon to a diamond surface having non-diamond carbon thereon
03/18/2003US6534117 Electroless plating method and electroless plating solution
03/18/2003US6534116 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
03/18/2003US6534007 Optoelectronic detector; completion of plasma cleaning chemical vapor deposition chamber
03/18/2003US6533953 Etching methods, methods of removing portions of material, and methods of forming silicon nitride spacers
03/18/2003US6533948 Method of manufacturing semiconductor device having ferro-dielectric material film
03/18/2003US6533910 Carbonitride coated component of semiconductor processing equipment and method of manufacturing thereof
03/18/2003US6533906 Method of manufacturing an oxide epitaxially strained lattice film
03/18/2003US6533902 Ultraviolet processing apparatus and ultraviolet processing method
03/18/2003US6533894 RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
03/18/2003US6533892 Device for etching the backside of wafer
03/18/2003US6533888 Apparatus and method for fabricating buried and flat metal features
03/18/2003US6533874 GaN-based devices using thick (Ga, Al, In)N base layers
03/18/2003US6533872 Method and arrangement for drying substrates after treatment in a liquid
03/18/2003US6533868 Deposition apparatus
03/18/2003US6533864 Solution processing apparatus and method
03/18/2003US6533832 For semiconductors; mixture of abrasive and alkanolamine
03/18/2003US6533647 Method for controlling a selected temperature of a planarizing surface of a polish pad.
03/18/2003US6533645 Substrate polishing article
03/18/2003US6533534 Manufacturing flat active display screens by increased rate of plasma enhanced chemical vapor deposition method and thereby lowering for coating treatment exposure to ion impact
03/18/2003US6533531 Device for handling wafers in microelectronic manufacturing
03/18/2003US6533530 Wafer transferring robot
03/18/2003US6533521 Integrated substrate handler having pre-aligner and storage pod access mechanism
03/18/2003US6533163 Solder ball pitcher
03/18/2003US6533160 Device for providing balls or preforms for making flip-chip connections
03/18/2003US6533158 Wire bonding apparatus having wire clamp
03/18/2003US6533123 Semiconductor wafer retaining structure
03/18/2003US6533101 Integrated transport carrier and conveyor system
03/18/2003US6533000 Substrate transportation container
03/18/2003US6532976 Semiconductor wafer cleaning apparatus
03/18/2003US6532975 Substrate processing apparatus and substrate processing method
03/18/2003US6532974 Process tank with pressurized mist generation
03/18/2003US6532866 Method and apparatus for orienting substrates
03/18/2003US6532796 Method of substrate temperature control and method of assessing substrate temperature controllability
03/18/2003US6532772 Formation of planar dielectric layers using liquid interfaces
03/18/2003US6532715 Semiconductor substrate processing tool and fabrications facilities integration plate
03/18/2003US6532642 Converting grooved graphite plate into silicon carbide to form a slotted silicon carbide plate
03/18/2003CA2403496A1 Sequential mesa avalanche photodiode capable of realizing high sensitization and method of manufacturing the same
03/17/2003WO2002023604A1 Semiconductor base material and method of manufacturing the material
03/17/2003CA2422624A1 Semiconductor base material and method of manufacturing the material
03/13/2003WO2003022021A1 Liquid crystal polymers for flexible circuits
03/13/2003WO2003021842A2 Hybrid circuit having nanotube electromechanical memory
03/13/2003WO2003021732A1 Laser lithography light source with beam delivery
03/13/2003WO2003021727A2 Line selected f2 two chamber laser system
03/13/2003WO2003021690A2 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate
03/13/2003WO2003021689A1 Antiparallel magnetoresistive memory cells
03/13/2003WO2003021685A1 Semiconductor device and production method thereof
03/13/2003WO2003021684A1 Method for producing a semiconductor device having an edge structure
03/13/2003WO2003021683A1 Semiconductor device and its manufacturing method
03/13/2003WO2003021681A1 Laser mark printing method of soi wafer, soi wafer and method for fabricating the same
03/13/2003WO2003021676A2 Connecting the emitter contacts of a semiconductor device
03/13/2003WO2003021671A1 Semiconductor radiating substrate and production method therefor and package
03/13/2003WO2003021668A1 Wiring board, semiconductor device and method for producing them
03/13/2003WO2003021667A2 Package with integrated inductor and/or capacitor
03/13/2003WO2003021666A1 Nonvolatile storage device and semiconductor integrated circuit
03/13/2003WO2003021665A1 Container for precision substrate
03/13/2003WO2003021664A1 Semiconductor device, structural body and electronic device
03/13/2003WO2003021663A1 Electrode sandwich separation
03/13/2003WO2003021662A1 Improved high k-dielectrics using nickel silicide
03/13/2003WO2003021661A2 Process for making a mim capacitor
03/13/2003WO2003021660A1 Production method for anneal wafer and anneal wafer
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