Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/20/2003WO2002045137A3 Reduced edge contact wafer handling system and method of retrofitting and using same
03/20/2003WO2002023630A3 Micromachined silicon block vias for transferring electrical signals to the backside of a silicon wafer
03/20/2003WO2002017359B1 High carrier concentration p-type transparent conducting oxide films
03/20/2003WO2002012587A3 Processing apparatus and cleaning method
03/20/2003WO2001063363A3 Photoacid generators and photoresists comprising same
03/20/2003US20030056191 Method of designing active region pattern with shift dummy pattern
03/20/2003US20030056189 Fabrication methods of semiconductor integrated circuit device and photomask
03/20/2003US20030056186 Method of and apparatus for designing layout of analog cells, and computer product
03/20/2003US20030056185 Semiconductor integrated circuit design method
03/20/2003US20030056163 Method of evaluating core based system-on-a-chip
03/20/2003US20030056078 Ferroelectric memory circuit and method for its fabrication
03/20/2003US20030055855 Method and system for efficient and accurate filtering and interpolation
03/20/2003US20030055741 Server for exchanging design information, method for exchanging design information, program for exchanging design information, buying method of special design product and selling method of special design product
03/20/2003US20030055736 Method and system for designing a probe card
03/20/2003US20030055618 Process variable identification method, process variable identification apparatus, and evaluation sample
03/20/2003US20030055613 Semi-physical modeling of HEMT DC-to high frequency electrothermal characteristics
03/20/2003US20030055592 System and method for analyzing error information from a semiconductor fabrication process
03/20/2003US20030055533 Method of using a specimen sensing end effector to determine angular orientation of a specimen
03/20/2003US20030055524 System and method for estimating error in a manufacturing process
03/20/2003US20030055523 User configurable multivariate time series reduction tool control method
03/20/2003US20030055522 Scheduling method and program for a substrate processing apparatus
03/20/2003US20030055520 LSI manufacturing support server, LSI manufacturing support method, and LSI manufacturing support program
03/20/2003US20030055134 Composition for preparing substances having nano-pores
03/20/2003US20030054739 Method for apparatus for polishing outer peripheral chamfered part of wafer
03/20/2003US20030054730 Systems for reducing photo-assisted corrosion in wafers during cleaning processes
03/20/2003US20030054729 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/20/2003US20030054671 Method for forming insulation film and method for manufacturing semiconductor device
03/20/2003US20030054670 Composite microelectronic dielectric layer with inhibited crack susceptibility
03/20/2003US20030054669 Amorphous metal oxide gate dielectric structure and method thereof
03/20/2003US20030054668 Reduced-pressure drying unit and coating film forming method
03/20/2003US20030054667 Method of improving moisture resistance of low dielectric constant films
03/20/2003US20030054666 Silicone polymer insulation film on semiconductor substrate
03/20/2003US20030054665 Method of reducing boron outgassing at trench power IC's oxidation process for sacrificial oxide layer
03/20/2003US20030054664 Method for selectively oxidizing a silicon wafer
03/20/2003US20030054663 Synthesis of layers, coatings or films using collection layer
03/20/2003US20030054662 Synthesis of layers, coatings or films using surfactants
03/20/2003US20030054661 Synthesis of layers, coatings or films using electrostatic fields
03/20/2003US20030054659 Method for fabricating a circuit device
03/20/2003US20030054658 Dry silylation plasma etch process
03/20/2003US20030054657 Semiconductor manufacturing apparatus
03/20/2003US20030054656 Method for manufacturing semiconductor device including two-step ashing process of N2 plasma gas and N2/H2 plasma gas
03/20/2003US20030054654 Pre STI-CMP planarization scheme
03/20/2003US20030054653 Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same
03/20/2003US20030054651 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
03/20/2003US20030054650 Process for material-removing machining of both sides of semiconductor wafers
03/20/2003US20030054649 Method for reducing dishing in chemical mechanical polishing
03/20/2003US20030054648 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
03/20/2003US20030054647 Plasma processing method
03/20/2003US20030054643 Wafer machining adhesive tape, and its manufacturing method and using method
03/20/2003US20030054642 Production method of semiconductor device and production system of semiconductor device
03/20/2003US20030054641 Control of thermal donor formation in high resistivity CZ silicon
03/20/2003US20030054638 Isolation of the cis and trans isomers of tris(2,4-octadion-ato)ruthenium using liquid chromatography with adsorption by alumina; solvent elution; purity; electrodes; smooth surface; consistant morphology; high density; capacitors etc,
03/20/2003US20030054637 Method for forming silicide
03/20/2003US20030054636 Method for manufacturing a semiconductor device and method for processing substrate
03/20/2003US20030054635 Fabrication of a metalized blind via
03/20/2003US20030054634 Method for fabricating semiconductor device
03/20/2003US20030054633 Method of electroless plating copper on nitride barrier
03/20/2003US20030054632 Method of forming a metal seed layer for subsequent plating
03/20/2003US20030054631 Protective layers prior to alternating layer deposition
03/20/2003US20030054630 Method for fabricating an integrated semiconductor circuit
03/20/2003US20030054629 Semiconductor device and manufacturing method thereof
03/20/2003US20030054628 Method of forming a low resistance multi-layered TiN film with superior barrier property using poison mode cycling
03/20/2003US20030054627 Methods of making microelectronic assemblies using bonding stage and bonding stage therefor
03/20/2003US20030054626 Method of forming a bond pad and structure thereof
03/20/2003US20030054625 Metallization process sequence
03/20/2003US20030054624 Quantum dot of single electron memory device and method for fabricating thereof
03/20/2003US20030054623 Use of atomic oxygen process for improved barrier layer
03/20/2003US20030054622 Semiconductor device manufacturing method and semiconductor device
03/20/2003US20030054621 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry
03/20/2003US20030054619 Method and apparatus for automatic wiring design between block circuits of integrated circuit
03/20/2003US20030054617 Method for forming an isolation region in a semiconductor device
03/20/2003US20030054616 Electronic devices and methods of manufacture
03/20/2003US20030054614 Sidewall strap for complementary semiconductor structures and method of making same
03/20/2003US20030054613 Semiconductor device and method of manufacturing thereof
03/20/2003US20030054612 Methods for making semiconductor structures having high-speed areas and high-density areas
03/20/2003US20030054611 Method of fabricating a split-gate semiconductor device
03/20/2003US20030054610 Method of manufacturing semiconductor device
03/20/2003US20030054609 Methods of writing/erasing of nonvolatile semiconductor storage device
03/20/2003US20030054608 Method for forming shallow trench isolation in semiconductor device
03/20/2003US20030054607 Capacitor under bitline (CUB) memory cell structure with reduced parasitic capacitance
03/20/2003US20030054606 Low temperature vapor deposition; integrated circuits, semiconductors
03/20/2003US20030054605 Method for manufacturing capacitor of semiconductor memory device controlling thermal budget
03/20/2003US20030054603 Method of improving static refresh
03/20/2003US20030054602 Semiconductor Processing methods of forming contact openings, methods of forming memory circuitry, methods of forming electrical connections, and methods of forming dynamic random access memory (DRAM) circuitry
03/20/2003US20030054601 Lateral heterojunction bipolar transistor and method of fabricating the same
03/20/2003US20030054600 Semiconductor memory device and method of fabricating the same
03/20/2003US20030054599 Bipolar transistor, semiconductor device and method of manufacturing same
03/20/2003US20030054598 Method of fabricating a high-voltage transistor
03/20/2003US20030054597 Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate
03/20/2003US20030054596 Method of forming a uniform ultra-thin gate oxide layer
03/20/2003US20030054595 Semiconductor device and method for manufacturing the same
03/20/2003US20030054594 Method of manufacturing a semiconductor integrated circuit
03/20/2003US20030054593 Thin film semiconductor device containing polycrystalline Si-Ge alloy and method for producing thereof
03/20/2003US20030054592 Method and apparatus for fabricating electronic device
03/20/2003US20030054591 Semiconductor device, and method of manufacturing the semiconductor device
03/20/2003US20030054586 Method of manufacturing high-mobility organic thin films using organic vapor phase deposition
03/20/2003US20030054583 Method for producing an image sensor assembly
03/20/2003US20030054581 Method of mounting light emitting element
03/20/2003US20030054580 Semiconductor device and a manufacturing method of the same
03/20/2003US20030054578 Monolithic three-dimensional structures
1 ... 4744 4745 4746 4747 4748 4749 4750 4751 4752 4753 4754 4755 4756 4757 4758 4759 4760 4761 4762 4763 4764 ... 6590