Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/25/2003US6538328 Structure including metal film formed on entire surface of front face, film including external gold layer resistant to reactive agent and forming protective layer against etching of at least one zone by potassium hydroxide reactive agent
03/25/2003US6538327 Method of copper interconnect formation using atomic layer copper deposition and a device thereby formed
03/25/2003US6538326 Semiconductor device and manufacturing method thereof
03/25/2003US6538324 Multi-layered wiring layer and method of fabricating the same
03/25/2003US6538323 Semiconductor device having an electrode structure comprising a conductive fine particle film
03/25/2003US6538321 Heat sink with collapse structure and semiconductor package with heat sink
03/25/2003US6538320 Heat spreader comprising plurality of sidewalls extending from upper portion, and flange extending from sidewalls having plurality of holes adapted to allow adhesive to flow through to establish riveted connection to integrated circuit
03/25/2003US6538317 Substrate for resin-encapsulated semiconductor device, resin-encapsulated semiconductor device and process for fabricating the same
03/25/2003US6538315 Semiconductor device and method of manufacturing same
03/25/2003US6538311 Two-stage transfer molding method to encapsulate MMC module
03/25/2003US6538310 LSI package with internal wire patterns to connect and mount bare chip to substrate
03/25/2003US6538309 Semiconductor device and circuit board for mounting semiconductor element
03/25/2003US6538305 BGA type semiconductor device having a solder-flow damping/stopping pattern
03/25/2003US6538303 Lead frame and semiconductor device using the same
03/25/2003US6538301 Semiconductor device and method with improved flat surface
03/25/2003US6538300 Precision high-frequency capacitor formed on semiconductor substrate
03/25/2003US6538299 Silicon-on-insulator (SOI) trench photodiode
03/25/2003US6538295 Salicide device with borderless contact
03/25/2003US6538294 Trenched semiconductor device with high breakdown voltage
03/25/2003US6538293 Semiconductor integrated circuit device and method of manufacturing the same
03/25/2003US6538292 Twin bit cell flash memory device
03/25/2003US6538291 Input protection circuit
03/25/2003US6538290 Static protection device
03/25/2003US6538287 Method and structure for stacked DRAM capacitors and FETs for embedded DRAM circuits
03/25/2003US6538286 Isolation structure and method for semiconductor device
03/25/2003US6538285 Silicon wafer
03/25/2003US6538283 Silicon-on-insulator (SOI) semiconductor structure with additional trench including a conductive layer
03/25/2003US6538282 Semiconductor device and method for manufacturing semiconductor device
03/25/2003US6538280 Trenched semiconductor device and method of fabricating the same
03/25/2003US6538278 CMOS integrated circuit having PMOS and NMOS devices with different gate dielectric layers
03/25/2003US6538277 Split-gate flash cell
03/25/2003US6538276 Split gate flash memory device with shrunken cell and source line array dimensions
03/25/2003US6538275 Nonvolatile semiconductor memory device and method for fabricating the same
03/25/2003US6538274 Reduction of damage in semiconductor container capacitors
03/25/2003US6538273 Ferroelectric transistor and method for fabricating it
03/25/2003US6538272 Semiconductor storage device and method of producing same
03/25/2003US6538271 Semiconductor device and method of manufacturing the same
03/25/2003US6538270 Staggered bitline strapping of a non-volatile memory cell
03/25/2003US6538269 Gate array and manufacturing method of semiconductor integrated circuit using gate array
03/25/2003US6538268 Semiconductor device and method of producing the same
03/25/2003US6538266 Protection device with a silicon-controlled rectifier
03/25/2003US6538260 Position measuring method, and semiconductor device manufacturing method and apparatus using the same
03/25/2003US6538257 Method of generating extremely short-wave radiation, and extremely short-wave radiation source unit
03/25/2003US6538248 Charged particle beam scanning type automatic inspecting apparatus
03/25/2003US6538247 Method of detecting arrangement of beam spots
03/25/2003US6538237 Apparatus for fixing position of furnace tube in semiconductor processing furnace comprising two clamp halves, each in half-circular shape, for engaging flange on tube to base, and means for mounting two clamp halves to base
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/25/2003US6538212 Circuit board for semiconductor device and manufacturing method thereof
03/25/2003US6538210 Circuit component built-in module, radio device having the same, and method for producing the same
03/25/2003US6538209 Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resin
03/25/2003US6538147 Organocopper precursors for chemical vapor deposition
03/25/2003US6538099 Nylon 12 composition
03/25/2003US6538090 Organic anti-reflective polymer and method for manufacturing thereof
03/25/2003US6537929 CVD plasma assisted low dielectric constant films
03/25/2003US6537928 Apparatus and method for forming low dielectric constant film
03/25/2003US6537927 Apparatus and method for heat-treating semiconductor substrate
03/25/2003US6537926 Process for improving the thickness uniformity of a thin oxide layer in semiconductor wafer fabrication
03/25/2003US6537925 Method for forming Ta2O5 dielectric layer using plasma enhanced atomic layer deposition
03/25/2003US6537924 Method of chemically growing a thin film in a gas phase on a silicon semiconductor substrate
03/25/2003US6537923 Process for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines
03/25/2003US6537922 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby
03/25/2003US6537921 Vertical metal oxide silicon field effect semiconductor diodes
03/25/2003US6537920 Formation of vertical transistors using block copolymer lithography
03/25/2003US6537919 Exposing said surface to a gaseous plasma, containing only argon, for a period of time, thereby reducing said thickness and removing said micro-scratches; depositing a layer of a second material to a thickness whereby layer is restored
03/25/2003US6537918 Method for etching silicon oxynitride and dielectric antireflection coatings
03/25/2003US6537917 Method for fabricating electrically insulating layers
03/25/2003US6537916 Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process
03/25/2003US6537915 Methods of treating surfaces of substrates
03/25/2003US6537914 Integrated circuit device isolation methods using high selectivity chemical-mechanical polishing
03/25/2003US6537913 Method of making a semiconductor device with aluminum capped copper interconnect pads
03/25/2003US6537912 Method of forming an encapsulated conductive pillar
03/25/2003US6537911 Chemical vapor deposition method
03/25/2003US6537910 Forming metal silicide resistant to subsequent thermal processing
03/25/2003US6537909 Method of preventing silicide spiking
03/25/2003US6537908 Method for dual-damascence patterning of low-k interconnects using spin-on distributed hardmask
03/25/2003US6537907 Self sidewall aluminum fluoride, (SSWAF), protection
03/25/2003US6537906 Methods for fabricating semiconductor devices
03/25/2003US6537905 Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug
03/25/2003US6537904 Method for manufacturing a semiconductor device having a fluorine containing carbon inter-layer dielectric film
03/25/2003US6537903 Processing methods for providing metal-comprising materials within high aspect ratio openings
03/25/2003US6537902 Method of forming a via hole in a semiconductor device
03/25/2003US6537901 Method of manufacturing a transistor in a semiconductor device
03/25/2003US6537900 Method for patterning a metal or metal silicide layer and a capacitor structure fabricated by the method
03/25/2003US6537899 Semiconductor device and a method of fabricating the same
03/25/2003US6537898 Method of crystallizing a silicon film with a metal catalyst
03/25/2003US6537896 Process for treating porous low k dielectric material in damascene structure to form a non-porous dielectric diffusion barrier on etched via and trench surfaces in the porous low k dielectric material
03/25/2003US6537895 Method of forming shallow trench isolation in a silicon wafer
03/25/2003US6537894 Process for fabricating a substrate of the silicon-on-insulator or silicon-on-nothing type and resulting device
03/25/2003US6537893 Substrate isolated transistor
03/25/2003US6537892 Glass frit wafer bonding process and packages formed thereby
03/25/2003US6537891 Silicon on insulator DRAM process utilizing both fully and partially depleted devices
03/25/2003US6537890 Poly-silicon thin film transistor having back bias effects and fabrication method thereof
03/25/2003US6537888 Method for fabricating a semiconductor device reducing junction leakage current and narrow width effect
03/25/2003US6537887 Integrated circuit fabrication
03/25/2003US6537886 Ultra-shallow semiconductor junction formation
03/25/2003US6537885 Transistor and method of manufacturing a transistor having a shallow junction formation using a two step EPI layer
03/25/2003US6537884 Semiconductor device and method of manufacturing the same including an offset-gate structure
03/25/2003US6537883 Method for reducing plasma damage to a gate oxide of a metal-oxide semiconductor wafer
03/25/2003US6537882 Method of fabricating a semiconductor device in which no side walls are formed adjacent the gates of the MOSFETs of the memory cell
03/25/2003US6537881 Process for fabricating a non-volatile memory device
1 ... 4741 4742 4743 4744 4745 4746 4747 4748 4749 4750 4751 4752 4753 4754 4755 4756 4757 4758 4759 4760 4761 ... 6590