Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/20/2003US20030054577 Method for evaluating property of integrated circuit and method for designing the same
03/20/2003US20030054576 Method and apparatus for automatically measuring the concentration of TOC in a fluid used in a semiconductor manufacturing process
03/20/2003US20030054575 Method for adding redundant vias on vlsi chips
03/20/2003US20030054574 Position detection apparatus, alignment apparatus and methods therefor, and exposure apparatus and device manufacturing method
03/20/2003US20030054573 Method for manufacturing semiconductor devices and method and its apparatus for processing detected defect data
03/20/2003US20030054572 Method of manufacturing ferroelectric substance thin film and ferroelectric memory using the ferroelectric substance thin film
03/20/2003US20030054361 Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system
03/20/2003US20030054293 Heat resistance, dimensional stability;printed circuits
03/20/2003US20030054292 Forming photoresist by photolithography
03/20/2003US20030054263 Multilayer; first mask having separation patterns; second mask is high density, overlapping patterns; transferring exposure
03/20/2003US20030054188 Silicon carbide impregnated with copper alloy
03/20/2003US20030054180 Polysilsesquioxane-acetylene copolymer
03/20/2003US20030054162 Adhesive for joining surface of semiconductor
03/20/2003US20030054147 Ceramic substrate and sintered aluminum nitride
03/20/2003US20030054120 Ceramic setter plate and manufacturing method thereof
03/20/2003US20030054117 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
03/20/2003US20030054115 Ultraviolet curing process for porous low-K materials
03/20/2003US20030054102 Reacting a organometallic compound and organosilicon compound dissolving in solvent; vapor deposition
03/20/2003US20030053904 Wafer aligner
03/20/2003US20030053903 Multiple sided robot blade for semiconductor processing equipment
03/20/2003US20030053902 Robot arm edge gripping device for handling substrates using two four-bar linkages
03/20/2003US20030053894 Method for transporting substrates and a semiconductor manufacturing apparatus using the method
03/20/2003US20030053893 Performing sequential processes in a highly clean surface condition while preventing a deterioration of throughput or an increase in cost; substrates simultaneously transferred in one batch process; thin films of oxides, nitrides or metals
03/20/2003US20030053892 Loadport equipped with automatic height adjustment means and method for operating
03/20/2003US20030053789 Tuning a band-gap by intermixing an impurity with one Quantum Well in the at least two areas to different values; copper or a copper alloy impurity; high-speed diffusion; dopes
03/20/2003US20030053675 Pattern inspection method and inspection apparatus
03/20/2003US20030053590 Method of examining a wafer of semiconductor material by means of X-rays
03/20/2003US20030053589 Sample preprocessing system for a fluorescent X-ray analysis and X-ray fluorescence spectrometric system using the same
03/20/2003US20030053588 Radiation-generating devices utilizing multiple plasma-discharge sources and microlithography apparatus and methods utilizing the same
03/20/2003US20030053360 Semiconductor memory device
03/20/2003US20030053357 Nonvolatile semiconductor memory device having ferroelectric capacitors
03/20/2003US20030053351 Ferroelectric memory device and method for manufacturing the same
03/20/2003US20030053347 Method of forming a semiconductor array of floating gate memory cells and strap regions, and a memory array and strap regions made thereby
03/20/2003US20030053346 FeRAM memory and method for manufacturing it
03/20/2003US20030053345 Nonvolatile semiconductor storage device and production method therefor
03/20/2003US20030053336 Read-only nonvolatile memory
03/20/2003US20030053335 Structures and methods for selectively applying a well bias to portions of a programmable device
03/20/2003US20030053334 Selective operation of a multi-state non-volatile memory system in a a binary mode
03/20/2003US20030053331 Magnetoresistive level generator and method
03/20/2003US20030053328 Column repair circuit in ferroelectric memory
03/20/2003US20030053327 Nonvolatile ferroelectric memory and method for driving the same
03/20/2003US20030053301 High-g mounting arrangement for electronic chip carrier
03/20/2003US20030053297 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
03/20/2003US20030053295 Heat dissipation device retention assembly
03/20/2003US20030053283 Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
03/20/2003US20030053282 Unipolar electro-static chuck
03/20/2003US20030053277 Integrated circuit device with bump bridges and method for making the same
03/20/2003US20030053273 Electronic device having a CMOS circuit
03/20/2003US20030053217 Illumination apparatus, exposure apparatus using the same, and device fabricating method
03/20/2003US20030053079 Optical interferometry
03/20/2003US20030053060 Semiconductor wafer bearing alignment mark for use in aligning the wafer with exposure equipment, alignment system for producing alignment signals from the alignement mark, and method of determining the aligned state of a wafer from the alignemnt mark
03/20/2003US20030053059 Position detection apparatus and method, exposure apparatus, and device manufacturing method
03/20/2003US20030053058 Alignment mark, alignment apparatus and method, exposure apparatus, and device manufacturing method
03/20/2003US20030053057 Position detection method and apparatus, and exposure method and apparatus
03/20/2003US20030053056 Mark for visual inspection upon assembling a display
03/20/2003US20030053046 Defect inspecting device for substrate to be processed and method of manufacturing semiconductor device
03/20/2003US20030053042 Method and apparatus for optical endpoint detection during chemical mechanical polishing
03/20/2003US20030053040 Focal point position detecting method in semiconductor exposure apparatus
03/20/2003US20030053039 Device for exposure of a peripheral area of a wafer
03/20/2003US20030053037 Coordinate measuring stage and coordinate measuring instrument
03/20/2003US20030053035 Lithographic apparatus and method
03/20/2003US20030053006 Thin film transistor array panel
03/20/2003US20030052735 Ferroelectric memory device and a method for driving the same
03/20/2003US20030052730 Semiconductor integrated circuit
03/20/2003US20030052724 Clock signal distribution circuit
03/20/2003US20030052721 Bipolar junction transistor compatible with vertical replacement gate transistors
03/20/2003US20030052713 Programmable logic device including multipliers and configurations thereof to reduce resource utilization
03/20/2003US20030052691 Apparatus and method for detection and measurement of environmental parameters
03/20/2003US20030052661 Reference voltage generator
03/20/2003US20030052660 Internal step-down power supply circuit
03/20/2003US20030052619 Organic electroluminescent device
03/20/2003US20030052548 Lithographic apparatus and motor for use in the apparatus
03/20/2003US20030052498 Edge grip with fixed forward posts
03/20/2003US20030052497 Intelligent integrated circuit wafer handling system with fail safe system
03/20/2003US20030052495 Detection and handling of semiconductor wafers and wafer-like objects
03/20/2003US20030052419 Semiconductor device and method of manufacturing the same
03/20/2003US20030052418 Resin sealing apparatus and resin sealing method
03/20/2003US20030052417 Semiconductor device
03/20/2003US20030052416 A hybrid integrated circuit have the welded connection between a lead and a conductor by a thermoplastic epoxy containing conductive metallic particles; resist to oxidation at elevated operating temperature
03/20/2003US20030052414 Integrated circuit chip having a surface polymer-coatings and a plurality of electrical coupling members, polymeric underfill material filling the gap between coupling members, polymer coatings and substrate; flip-chip assembly
03/20/2003US20030052412 Semiconductor device and method for fabricating the same
03/20/2003US20030052411 Semiconductor device and method for manufacturing the same
03/20/2003US20030052410 Comprising multi-semiconductor chips, second semiconductor chips formed in an area surrounded by the first semiconductor chips, integrated circuit and pads are electrically connected, and columnar shape bumps formed over the pads
03/20/2003US20030052409 Semiconductor device and method of manufacturing the same
03/20/2003US20030052408 Semiconductor device including molded wireless exposed drain packaging
03/20/2003US20030052407 Electronic component
03/20/2003US20030052406 Optimized buried-channel FETs based on SiGe heterostructures
03/20/2003US20030052405 Semiconductor device
03/20/2003US20030052396 A thermosetting resin package sealed inside a thermoplastic resin housing, are bonded together with a modified face on package, adhesion by ultraviolet radiation
03/20/2003US20030052395 Semiconductor device and design support method of electronic device using the same
03/20/2003US20030052394 Semiconductor device
03/20/2003US20030052392 Support for microelectronic, microoptoelectronic or micromechanical devices
03/20/2003US20030052390 Sequential mesa avalanche photodiode capable of realizing high sensitization and method of manufacturing the same
03/20/2003US20030052389 Semiconductor device including a capacitance
03/20/2003US20030052388 Varactor having improved Q-factor and method of fabricating the same using SiGe heterojunction bipolar transistor
03/20/2003US20030052387 Bipolar transistor
03/20/2003US20030052386 An interlayer dielectric film covering the resistor layer has first and second embedded plugs providing the interconnection to reduce in temperature rise in resistor elements
03/20/2003US20030052385 Semiconductor devices
03/20/2003US20030052384 Manufacturing method of semiconductor device with filling insulating film into trench
03/20/2003US20030052378 Semiconductor device and method of manufacturing the same
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