Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2003
03/27/2003US20030057466 Semiconductor device
03/27/2003US20030057465 Method and structure for modular, highly linear MOS capacitors using nitrogen implantation
03/27/2003US20030057464 Ferroelectric memory device and method of fabricating the same
03/27/2003US20030057463 Semiconductor memory device including a capacitor an upper electrode of which being resistant of exfoliation
03/27/2003US20030057462 Ferroelectric memory device and method of fabricating the same
03/27/2003US20030057461 Magneto-resistive device including soft synthetic ferrimagnet reference layer
03/27/2003US20030057460 High-voltage MOS transistor
03/27/2003US20030057458 Bipolar device having shallow junction raised extrinsic base and method for making the same
03/27/2003US20030057457 Semiconductor device having buried conductive layer and method of manufacturing thereof
03/27/2003US20030057453 Cross-diffusion resistant dual-polycide semiconductor structure and method
03/27/2003US20030057452 Multilayer semiconductor wiring structure with reduced alignment mark area
03/27/2003US20030057451 Aggregate of Semicnductor micro-needles and method of manufacturing the same, and semiconductor apparatus and method of manufacturing the same
03/27/2003US20030057450 Semiconductor device
03/27/2003US20030057449 Semiconductor integrated circuit
03/27/2003US20030057448 Optical component and method manufacturing the same
03/27/2003US20030057446 Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device
03/27/2003US20030057445 Semiconductor device and method for fabricating the same
03/27/2003US20030057442 Production of single-pole components
03/27/2003US20030057441 Four-terminal system for reading the state of a phase qubit
03/27/2003US20030057440 Heterojunction field effect transistor
03/27/2003US20030057439 Dual layer CMOS devices
03/27/2003US20030057438 Structure and method for fabricating semiconductor structures and devices utilizing lateral epitaxial overgrowth
03/27/2003US20030057434 Semiconductor device having improved buffer layers
03/27/2003US20030057432 Ultrathin high-k gate dielectric with favorable interface properties for improved semiconductor device performance
03/27/2003US20030057429 Radio frequency (RF) wireless integrated circuits including a transmit chip having a power amplifier and a receive chip adapted to work with the trasmit chip
03/27/2003US20030057425 Active matrix display device
03/27/2003US20030057424 Thin-film transistor
03/27/2003US20030057423 Three-dimensional device
03/27/2003US20030057419 Semiconductor device comprising a thin film transistor and method of manufacuring the same
03/27/2003US20030057418 Laser irradiation apparatus and method of treating semiconductor thin film
03/27/2003US20030057416 Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same
03/27/2003US20030057414 Wherein device is not subjected to attack by reactive ion etching gases; photolithography; patterning
03/27/2003US20030057412 Armor coated MEMS devices
03/27/2003US20030057381 Apparatus and methods for mask/substrate alignment in charged-particle-beam pattern-transfer
03/27/2003US20030057357 Method of fabricating image sensors using a thin film photodiode above active CMOS circuitry
03/27/2003US20030057346 Active vibration isolator and exposure apparatus with the active vibration isolator, device manufacturing method
03/27/2003US20030057252 Apparatus and method of clamping semiconductor devices using sliding finger supports
03/27/2003US20030057198 Method and apparatus for performing baking treatment to semiconductor wafer
03/27/2003US20030057185 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
03/27/2003US20030057184 Method for pull back SiN to increase rounding effect in a shallow trench isolation process
03/27/2003US20030057182 Window for allowing end point of etching process to be detected and etching device comprising the same
03/27/2003US20030057179 System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
03/27/2003US20030057177 Three dimensional etching process
03/27/2003US20030057130 Method, device and system for semiconductor wafer transfer
03/27/2003US20030057113 Surface package type semiconductor package and method of producing semiconductor memory
03/27/2003US20030057099 System and method for electroplating fine geometries
03/27/2003US20030057098 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated.
03/27/2003US20030057089 Disk carrier
03/27/2003US20030056976 Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board
03/27/2003US20030056967 Method of fabricating and using an image sensor package
03/27/2003US20030056938 Core plate embedded in said main body; and a plurality of thermally conductive fins connected to and emanating from said top surface.
03/27/2003US20030056900 Deposition chamber and method for depositing low dielectric constant films
03/27/2003US20030056899 Semiconductor processing apparatus and manufacturing method of semiconductor device
03/27/2003US20030056898 Annular receptacle for a rotating carrier
03/27/2003US20030056892 Irradiating the surface using an excimer laser and applying a coupling agent to the irradiated surface.
03/27/2003US20030056890 Thin film forming apparatus and thin film forming method
03/27/2003US20030056815 Substrate processing apparatus comprising ring-shaped motor
03/27/2003US20030056814 Sonic immersion process system and methods
03/27/2003US20030056806 Method for cleaning damaged layers and polymer residue from semiconductor device
03/27/2003US20030056728 Method and device for depositing at least one precursor, which is in liquid or dissolved form, on at least one substrate
03/27/2003US20030056725 Thin film forming apparatus and thin film forming method
03/27/2003US20030056722 Coating film forming system
03/27/2003US20030056719 Low temperature epitaxial growth of quaternary wide bandgap semiconductors
03/27/2003US20030056718 Method of manufacturing single crystal substrate
03/27/2003US20030056717 Method of improving a surface of a substrate for bonding
03/27/2003US20030056715 Silicon semiconductor substrate and preparation thereof
03/27/2003US20030056471 Wafer jar loader method, system and apparatus
03/27/2003US20030056391 Supporting fixture of substrate and drying method of substrate surface using the same
03/27/2003US20030056389 System and method for controlling a vapor dryer process
03/27/2003US20030056368 Method for manufacturing a heat sink
03/27/2003US20030056356 Apparatus and method for separating cull in a package assembly process
03/27/2003CA2460862A1 Methods and apparatus for patterning a surface
03/26/2003EP1296379A2 Schottky barrier diode and method for manufacturing it
03/26/2003EP1296378A1 MOS semiconductor device and manufacturing process thereof
03/26/2003EP1296377A2 A method for fabricating a small area of contact between electrodes
03/26/2003EP1296374A1 Process for bonding and electrically connecting microsystems integrated in several distinct substrates
03/26/2003EP1296373A2 Advanced microelectronic heat dissipation package and method for its manufacture
03/26/2003EP1296372A2 Heat dissipating material and manufacturing method thereof
03/26/2003EP1296371A2 Semiconductor device and method of making the same
03/26/2003EP1296370A2 Enclosure for a semiconductor device
03/26/2003EP1296369A1 Method of making gate oxide for trench gate DRAM cells
03/26/2003EP1296368A2 Semiconductor device including porous insulating material and manufacturing method thereof
03/26/2003EP1296367A1 Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
03/26/2003EP1296366A2 Metal gate CMOS and method of manfacturing the same
03/26/2003EP1296365A2 Method of film formation, insulating film, and substrate for semiconductor
03/26/2003EP1296364A1 Method for forming thin film and apparatus for forming thin film
03/26/2003EP1296363A1 Method of manufacturing group-iii nitride compound semiconductor device
03/26/2003EP1296362A2 Single crystal GaN substrate, method of growing same and method of producing same
03/26/2003EP1296361A1 A process of forming an interface free layer of silicon on a substrate of monocrystalline silicon
03/26/2003EP1296360A1 Semiconductor manufacturing and inspecting device
03/26/2003EP1296359A1 Device and method for managing semiconductor producing apparatus
03/26/2003EP1296358A2 Process for producing semiconductor substrates
03/26/2003EP1296332A2 Magnetic memory device
03/26/2003EP1296331A2 Method of performing MRAM read operation
03/26/2003EP1296256A1 Method and system for electrical commerce of semiconductor ip
03/26/2003EP1296191A2 Method of optimising the imaging properties of a plurality of optical elements
03/26/2003EP1296190A1 Positive resist composition
03/26/2003EP1296154A2 Semiconductor integrated circuit
03/26/2003EP1296145A1 Conductive contact
03/26/2003EP1295924A2 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor