Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/01/2003US6541178 An sulfonium(-) and iodonium(+)ion-type photoacid generator containing a naphthol structure, and photosensitive polyimide resin using photoacid generator
04/01/2003US6541169 Methods for charged-particle-beam microlithography including correction of deflection aberrations, and device-manufacturing methods comprising same
04/01/2003US6541167 Optical proximity correction
04/01/2003US6541164 Method for etching an anti-reflective coating
04/01/2003US6541117 Silicon epitaxial wafer and a method for producing it
04/01/2003US6541085 Tubular molded product using nylon 12
04/01/2003US6541077 Negative non-chemical amplification resist polymer or a positive chemical amplification resist polymer
04/01/2003US6541067 Tricarbonyl(1,2,3,4- eta )-1,3-cyclohexadiene ruthenium dissolved in a solubilizing solvent, vaporizing and directing toward a semiconductor substrate
04/01/2003US6540961 Flow cell includes inlet and outlet chambers connected to a flow cell chamber; an array containing electrodes is within the flow cell chamber; inlet and outlet chambers have constant cross-sectional flow areas
04/01/2003US6540935 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
04/01/2003US6540930 Use of perfluoroketones as vapor reactor cleaning, etching, and doping gases
04/01/2003US6540899 Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
04/01/2003US6540885 Profile control of oxide trench features for dual damascene applications
04/01/2003US6540869 Semiconductor processing system
04/01/2003US6540861 Member separating apparatus and processing apparatus
04/01/2003US6540842 By removing the removable glass member to access interior of canister and inserting a vacuum device to clean the particles; semiconductor manufacturing
04/01/2003US6540840 Vaporizer for MOCVD and method of vaporizing raw material solutions for MOCVD
04/01/2003US6540838 Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition
04/01/2003US6540837 Quartz wafer processing chamber
04/01/2003US6540827 Slicing of single-crystal films using ion implantation
04/01/2003US6540814 Integrated ion implant scrubber system
04/01/2003US6540803 Fluid media particle isolating system
04/01/2003US6540597 Polishing pad conditioner
04/01/2003US6540594 Carrier head with a flexible membrane for a chemical mechanical polishing system
04/01/2003US6540588 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
04/01/2003US6540587 Infrared end-point detection system
04/01/2003US6540524 Contact structure and production method thereof
04/01/2003US6540509 Heat treatment system and method
04/01/2003US6540469 Substrate processing apparatus
04/01/2003US6540468 Device and method for handling individual wafers
04/01/2003US6540467 Apparatus and method of semiconductor wafer protection
04/01/2003US6540466 Compact apparatus and method for storing and loading semiconductor wafer carriers
04/01/2003US6540465 Substrate processing apparatus
04/01/2003US6540127 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas
04/01/2003US6540065 Transferring apparatus for chips and method of use
04/01/2003US6540014 That hold workpieces such as semiconductor wafers and control the temperature of the workpieces; mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are eliminated
04/01/2003US6539963 Pressurized liquid diffuser
04/01/2003US6539960 Cleaning system for cleaning ink in a semiconductor wafer
04/01/2003US6539959 Cleaning apparatus for plate-like part and method thereof
04/01/2003US6539956 Method and device for drying substrates
04/01/2003US6539855 Method and apparatus for screen printing
04/01/2003US6539625 Chromium adhesion layer for copper vias in low-k technology
04/01/2003US6539624 Method for forming wafer level package
04/01/2003US6539614 Apparatus for producing high efficiency heat sinks
03/2003
03/28/2003CA2357985A1 Method for manufacturing a semiconductor device
03/27/2003WO2003026361A1 Dielectric barrier discharger
03/27/2003WO2003026034A1 Transistor assembly and method for the production thereof
03/27/2003WO2003026019A1 Semiconductor device and production method therefor
03/27/2003WO2003026018A1 Semiconductor device and production method therefor
03/27/2003WO2003026015A1 Semiconductor structure, memory assembly and method for making a semiconductor structure
03/27/2003WO2003026014A1 Semiconductor memory element, production method and operational method
03/27/2003WO2003026005A2 Formation of refractory metal nitrides using chemisorption techniques
03/27/2003WO2003026004A1 Method of plasma treatment
03/27/2003WO2003026003A1 Wafer mapping device and load port with the device
03/27/2003WO2003026002A1 Automatic guided vehicle
03/27/2003WO2003026001A2 Integrated equipment set for forming an interconnect on a substrate
03/27/2003WO2003025999A1 Wafer shape evaluating method, wafer, and wafer selecting method
03/27/2003WO2003025998A2 Method of forming a bond pad and structure thereof
03/27/2003WO2003025997A1 Circuit device mounitng method and press
03/27/2003WO2003025996A1 Cmp apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
03/27/2003WO2003025995A1 Semiconductor device and high-frequency amplifier comprising it
03/27/2003WO2003025994A1 Ultraviolet curing process for porous low-k materials
03/27/2003WO2003025993A1 Plasma curing process for porous low-k materials
03/27/2003WO2003025992A1 Dielectric film
03/27/2003WO2003025991A1 Fabrication of a microchip-based electrospray device
03/27/2003WO2003025990A1 Method for cutting sapphire substrate for semiconductor device
03/27/2003WO2003025989A2 Formation of self-organized stacked islands for self-aligned contacts
03/27/2003WO2003025988A1 Method for the production of iii-v- nitride-conductor-based semiconductor layers
03/27/2003WO2003025986A1 Bonding method
03/27/2003WO2003025985A1 Notched compound semiconductor wafer
03/27/2003WO2003025984A2 Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same
03/27/2003WO2003025982A1 Uniform patterning for deep reactive ion etching
03/27/2003WO2003025981A1 Monolithic three-dimensional structures
03/27/2003WO2003025980A2 Method of examining a wafer of semiconductor material by means of x-rays
03/27/2003WO2003025979A2 Method for automatic optical measurement of an opc structure
03/27/2003WO2003025978A2 Method for separating two joined layers of material
03/27/2003WO2003025977A2 Method for wrapped-gate mosfet
03/27/2003WO2003025971A2 Plasma processing apparatus with coil magnet system
03/27/2003WO2003025949A1 Selective operation of a multi-state non-volatile memory system in a binary mode
03/27/2003WO2003025946A1 Magnetic memory with write inhibit selection and the writing method for same
03/27/2003WO2003025945A2 Compensation of a bias magnetic field in a storage surface of a magnetoresistive storage cell
03/27/2003WO2003025944A1 Semiconductor memory cell and memory array using a breakdown phenomena in an ultra-thin dielectric
03/27/2003WO2003025943A1 Magnetic memory device and its recording control method
03/27/2003WO2003025942A2 Magnetic memory with spin-polarized current writing, using amorphous ferromagnetic alloys, writing method for same
03/27/2003WO2003025804A2 Structures and methods for selectively applying a well bias to portions of a programmable device
03/27/2003WO2003025678A2 Method and device for control of the data flow on application of reticles in a semiconductor component production
03/27/2003WO2003025677A1 Etching method and composition for forming etching protective layer
03/27/2003WO2003025601A1 Method and system for designing a probe card
03/27/2003WO2003025589A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025588A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025519A1 Method and apparatus for determining liquid flow rate
03/27/2003WO2003025445A1 Single-handed cord/cable management device
03/27/2003WO2003025263A1 Nitride semiconductor substrate, its manufacturing method, and semiconductor optical device using the same
03/27/2003WO2003025255A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
03/27/2003WO2003025243A2 Metal nitride deposition by ald using gettering reactant
03/27/2003WO2003025238A1 Textured-grain-powder metallurgy tantalum sputter target
03/27/2003WO2003025085A1 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry
03/27/2003WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes
03/27/2003WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes
03/27/2003WO2003024894A1 Method for producing high purity low dielectric constant ceramic and hybrid ceramic films
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