Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/08/2003US20030085609 Fixture for assembling a post-CMP cleaning brush
05/08/2003US20030085582 End-effectors for handling microelectronic workpieces
05/08/2003US20030085474 Providing a semiconductor device; providing a switching device; forming the electrical contact devices; applying attachment element to surfaces; pressing flexible contact elements onto the contact areas, and securely connecting
05/08/2003US20030085473 Miniaturization
05/08/2003US20030085472 Apparatus and method for reducing interposer compression during molding process
05/08/2003US20030085470 Semiconductor device and method of manufacturing the same
05/08/2003US20030085468 Multi-layer interconnection structure in semiconductor device and method for fabricating same
05/08/2003US20030085467 Plating method, plating solution, semiconductor device and process for producing the same
05/08/2003US20030085466 Chip-scale package and carrier for use therewith
05/08/2003US20030085463 Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method fo formation and testing
05/08/2003US20030085461 Multi-chip module, semiconductor chip, and interchip connection test method for multi-chip module
05/08/2003US20030085460 Integrated circuits and methods for their fabrication
05/08/2003US20030085451 Wet etched insulator and electronic circuit component
05/08/2003US20030085448 Stacked LDD high frequency LDMOSFET
05/08/2003US20030085447 Beol decoupling capacitor
05/08/2003US20030085446 Semiconductor device having fuse circuit on cell region and method of fabricating the same
05/08/2003US20030085445 Semiconductor devices
05/08/2003US20030085444 Structure and method for forming a faceted opening and a layer filling therein
05/08/2003US20030085443 Semiconductor devices and methods for manufacturing the same
05/08/2003US20030085442 Substrate connection in an integrated power circuit
05/08/2003US20030085440 Light-receiving element, light-receiving element array and light-receiving module and method for high frequency characteristics
05/08/2003US20030085439 Isolating, resistive, conducting (or) and/or semiconducting patterns and structures for use in electronic circuits which most particularly consist of a single or several stacked layers of thin films
05/08/2003US20030085437 Configuring a semiconductor chip as a single circuit that provides varying functions according to extrinsic conditions; permitting single circuit to be switched between a particular function and a different particular function
05/08/2003US20030085436 Contacting gate stack with a gaseous mixture comprising bistertiarybutylaminosilane (BTBAS), at least one nitrogen-containing compound, and oxygen (O2) to form deposited silicon oxynitride spacer film; controlling the contact conditions
05/08/2003US20030085435 Forming recessed region into a semiconductive material defined as active area for transistor structure; forming a transistor gate dielectric material directly and substantially conformally on semiconductive material; forming transistor
05/08/2003US20030085434 Semiconductor device and method for manufacturing the same
05/08/2003US20030085433 Semiconductor device and method for manufacturing the same
05/08/2003US20030085432 High frequency signal isolation in a semiconductor device
05/08/2003US20030085429 Triggering of an ESD NMOS through the use of an N-type buried layer
05/08/2003US20030085427 Active matrix pixel device
05/08/2003US20030085426 Semiconductor device, method of forming epitaxial film, and laser ablation device
05/08/2003US20030085425 Silicon on insulator device with improved heat removal and method of manufacture
05/08/2003US20030085424 Transistor structure with thick recessed source/drain structures and fabrication process of same
05/08/2003US20030085422 Low voltage trench type power MOSFETs(Metal On Silicon Field Effect Transistors
05/08/2003US20030085421 Semiconductor device and operation method thereof
05/08/2003US20030085420 Random access memory
05/08/2003US20030085419 Novel MIM process for logic-based embedded RAM
05/08/2003US20030085417 Salicided gate for virtual ground arrays
05/08/2003US20030085416 Monolithically integrated pin diode and schottky diode circuit and method of fabricating same
05/08/2003US20030085414 Stabilization in device characteristics of a bipolar transistor that is included in a semiconductor device with a CMOSFET
05/08/2003US20030085413 Magnetic memory cell
05/08/2003US20030085412 Fabrication of a heterojunction bipolar transistor with integrated MIM capacitor
05/08/2003US20030085410 Simplified upper electrode contact structure for PIN diode active pixel sensor
05/08/2003US20030085408 Oxygen-doped silicon carbide etch stop layer
05/08/2003US20030085407 Wafer including an In-containing-compound semiconductor surface layer, and method for profiling its carrier concentration
05/08/2003US20030085406 Providing a substrate having pixels each of which has a switching device region and a pixel region; etching the first insulating layer and the second insulating layer of pixel region to form openings; forming a conductive layer over pixel
05/08/2003US20030085404 Gate wire including a gate line, a gate pad, and a gate electrode are formed on substrate; gate insulating layer, a semiconductor layer, and an ohmic contact layer are deposited, and a photoresist layer is coated; photoresist is exposed
05/08/2003US20030085403 Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same
05/08/2003US20030085401 Crystalline silicon thin film transistor panel for oeld and method of fabricating the same
05/08/2003US20030085399 Solid-state imaging device and method for manufacturing the same
05/08/2003US20030085365 Methods and devices for evaluating imaging characteristics of a charged-particle-beam microlithography system
05/08/2003US20030085364 High performance source for electron beam projection lithography
05/08/2003US20030085363 Methods for detecting incidence orthogonality of a patterned beam in charged-particle-beam (CPB) microlithography, and CPB microlithography systems that perform same
05/08/2003US20030085354 Method of preventing charging, and apparatus for charged particle beam using the same
05/08/2003US20030085335 Spot grid array imaging system
05/08/2003US20030085256 Semiconductor manufacturing apparatus and method, semiconductor device and electronic device
05/08/2003US20030085255 Method of testing bonded connections, and a wire bonder
05/08/2003US20030085216 Apparatus and method for heating and cooling an article
05/08/2003US20030085208 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
05/08/2003US20030085206 Susceptor with built-in plasma generation electrode and manufacturing method therefor
05/08/2003US20030085204 Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
05/08/2003US20030085198 Method of detecting etching process end point in semiconductor fabricating equipment and detector therefor
05/08/2003US20030085197 Etching method and apparatus
05/08/2003US20030085195 Apparatus for etching or stripping substrate of liquid crystal display device and method thereof
05/08/2003US20030085186 Chemical reinforcing holders for glass substrate
05/08/2003US20030085160 Test handler
05/08/2003US20030085133 Comprises copper sulfate, sulfuric acid, chlorine, and surfactant for patterning the electrodepostion of copper
05/08/2003US20030085120 Bonded sapphire polygon shield
05/08/2003US20030085119 Semiconductor wafer plating cathode assembly
05/08/2003US20030085118 Semiconductor wafer plating cell assembly
05/08/2003US20030085115 Comprises openings in shutters which provide uniform radial and circumferential thickness; dielectrics
05/08/2003US20030085000 Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber
05/08/2003US20030084999 Apparatus and method for mitigating chamber resonances in plasma processing
05/08/2003US20030084998 Semiconductor device fabricating method
05/08/2003US20030084997 Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same
05/08/2003US20030084929 Substrate processing system and substrate processing method
05/08/2003US20030084927 Washer and washing method
05/08/2003US20030084926 For collecting impurities on the wafer surface and in a thin film formed on the wafer and analyzing the impurities; applying liquid in drops
05/08/2003US20030084925 Substrate cleaning apparatus and substrate cleaning method
05/08/2003US20030084922 Method for removing the circumferential edge of a dielectric layer
05/08/2003US20030084921 Removing impure particles contained on surface of wafers using jet nozzle; high speed
05/08/2003US20030084919 Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles
05/08/2003US20030084918 Customized combination of plasma ashing and wet-chemical cleaning processes can be performed on single platform to achieve desired processing results; photoresist removal
05/08/2003US20030084852 Temperature control elements, spindle assembly, and wafer processing assembly incorporating same
05/08/2003US20030084849 Apparatus for chemical vapor deposition
05/08/2003US20030084815 Polishing composition and polishing method employing it
05/08/2003US20030084808 Lithography system, exposure apparatus and their control method, and device manufacturing method
05/08/2003US20030084774 Method of fabricating a polishing pad having an optical window
05/08/2003US20030084642 Apparatus and method for off-loading electronic packages
05/08/2003US20030084587 Substrate processing system
05/08/2003US20030084578 Scribing device
05/08/2003US20030084566 Chip scale package with heat spreader and method of manufacture
05/08/2003US20030084563 Semiconductor integrated circuit manufacturing method and bonding machine used for it
05/08/2003DE10161202C1 Reducing the thickness of a silicon substrate which has been made porous comprises making porous the rear side of the substrate lying opposite a front side which has been made porous, then removing the porous material formed
05/08/2003CA2465228A1 Low temperature formation of backside ohmic contacts for vertical devices
05/08/2003CA2464855A1 Induction heating devices and methods for controllably heating an article
05/08/2003CA2462613A1 Contact planarization materials that generate no volatile byproducts or residue during curing
05/08/2003CA2433488A1 Ball grid array with x-ray alignment mark
05/07/2003EP1309234A2 Method and apparatus for elimination of high energy ions from EUV radiating device
05/07/2003EP1309012A2 Integrated Schottky barrier diode and manufacturing method thereof
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