Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/06/2003US6558008 Method of fabricating a matrix display system
05/06/2003US6557769 Smart card module, smart card with the smart card module, and method for producing the smart card module
05/06/2003US6557591 Purity, electronics, semiconductors
05/06/2003US6557564 Method and apparatus for cleaning a thin disk
05/06/2003US6557251 Digital feature separation
05/06/2003US6557248 Method of fabricating an electrostatic chuck
05/06/2003US6557244 Wafer level board/card assembly apparatus
05/06/2003US6557237 Removable modular cell for electro-chemical plating and method
05/06/2003US6557202 Wafer scrubbing brush core having an internal motor and method of making the same
05/06/2003CA2263352C Single crystal sic and a method of producing the same
05/02/2003EP1306946A1 Iii group nitride compound semiconductor light emitting element
05/02/2003EP1306904A2 Controlled conduction device
05/02/2003EP1306901A2 Systems and methods for electrically isolating portions of wafers
05/02/2003EP1306899A1 Wiring method and element arranging method using the same, and method of producing image display devices
05/02/2003EP1306898A1 Sub-milliohm on-chip interconnection
05/02/2003EP1306897A2 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
05/02/2003EP1306896A1 Method for manufacturing silicon wafer
05/02/2003EP1306895A2 Method of metal oxide thin film cleaning
05/02/2003EP1306894A1 A method of forming a silicon dioxide layer on a curved Si surface
05/02/2003EP1306893A1 Plasma processing apparatus
05/02/2003EP1306892A1 Single crystal cutting method
05/02/2003EP1306891A1 Mirror chamfered wafer, mirror chamfering polishing cloth, and mirror chamfering polishing machine and method
05/02/2003EP1306890A2 Semiconductor substrate and device comprising SiC and method for fabricating the same
05/02/2003EP1306889A2 Electronic device with electrode and its manufacture
05/02/2003EP1306888A2 Semiconductor processing apparatus for continuously forming semiconductor film on flexible substrate
05/02/2003EP1306887A1 Dispensing nozzle for distributing an adhesive and process therefor
05/02/2003EP1306886A1 Apparatus for assessing the silicon dioxide content
05/02/2003EP1306879A2 Ion implanting method and apparatus
05/02/2003EP1306850A2 Tunnel junction memory cell
05/02/2003EP1306726A1 Development defect preventing process and material
05/02/2003EP1306683A2 Test system with progress window
05/02/2003EP1306681A2 Method and system to determine the high frequency rate of active circuit elements
05/02/2003EP1306665A2 Optical apparatus
05/02/2003EP1306464A1 Graded material and method for synthesis thereof and method for processing thereof
05/02/2003EP1306415A2 Composition for the chemical mechanical polishing of metal- and metal-dielectric structures with a high selectivity
05/02/2003EP1306214A2 Print head with shielding element and its manufacturing method
05/02/2003EP1306163A1 Window member for chemical mechanical polishing and polishing pad
05/02/2003EP1306159A1 Calibration method for a wire bonder
05/02/2003EP1305984A1 Method and apparatus for generating x-ray or euv radiation
05/02/2003EP1305838A2 Low-temperature fabrication of thin-film energy-storage devices
05/02/2003EP1305834A1 Field effect transistor, circuit arrangement and method for production of a field effect transistor
05/02/2003EP1305831A2 Semiconductor device and a process for forming the same
05/02/2003EP1305829A1 Solder bar for high power flip chips
05/02/2003EP1305827A1 Semiconductor memory cell arrangement and method for producing the same
05/02/2003EP1305826A2 Compensation circuit
05/02/2003EP1305825A2 Method for producing a multi-bit memory cell
05/02/2003EP1305824A1 Method of making electronic materials
05/02/2003EP1305823A1 Process for growing a magnesium oxide film on a silicon (100) substrate coated with a cubic silicon carbide buffer layer
05/02/2003EP1305822A1 Integrated capacitive device with hydrogen degradable dielectric layer protected by getter layer
05/02/2003EP1305821A1 Mobile holder for a wafer
05/02/2003EP1305820A1 Method for heating a semiconductor wafer in a process chamber, and process chamber
05/02/2003EP1305818A2 Quartz glass jig for processing apparatus using plasma
05/02/2003EP1305817A1 Methods to predict and correct resist heating during lithography
05/02/2003EP1305815A1 Film thickness measurement using electron-beam induced x-ray microanalysis
05/02/2003EP1305813A1 Plasma focus light source with active and buffer gas control
05/02/2003EP1305805A1 Electrically-eraseable programmable read-only memory having reduced-page-size program and erase
05/02/2003EP1305803A2 Integrated circuit with a temperature sensor
05/02/2003EP1305795A2 All metal giant magnetoresistive memory
05/02/2003EP1305744A1 Method and system for hierarchical metal-end, enclosure and exposure checking
05/02/2003EP1305743A2 Method for the surface optimisation of components in integrated circuits
05/02/2003EP1305742A2 Module for generating circuits for analysing bit strings inside data cells, method for generating this type of circuit and relative circuit
05/02/2003EP1305673A1 Prioritizing the application of resolution enhancement techniques
05/02/2003EP1305647A2 Method and apparatus for testing high performance circuits
05/02/2003EP1305453A1 Ring-shaped high-density plasma source and method
05/02/2003EP1305214A1 Device and method for the placement of components on transport belts
05/02/2003EP1305169A1 System and method for adjusting the properties of a device by gcib processing
05/02/2003EP1305168A1 Method for providing a recess pattern in a foil
05/02/2003EP1305139A2 Fluid dispensing fixed abrasive polishing pad
05/02/2003EP1088328B1 Method and device for correcting proximity effects
05/02/2003EP1010012A4 Apparatus for measuring minority carrier lifetimes in semiconductor materials
05/02/2003EP0965142B1 Angled blade method of cutting i/o columns
05/02/2003EP0879479B1 Separable connecting bridge (fuse) and connectable line interruption (anti-fuse) and process for producing and activating a fuse and an anti-fuse
05/02/2003EP0861487B1 Time optimal trajectory for cluster tool robots
05/02/2003EP0789788B1 In situ getter pump system and method
05/02/2003EP0780891B1 Method of manufacturing semiconductor device
05/02/2003EP0738004B1 Method for manufacturing of a semiconductor substrate
05/01/2003WO2003037049A1 Circuit formation by laser ablation of ink
05/01/2003WO2003036771A1 Nitride semiconductor laser element, and production method therefor
05/01/2003WO2003036767A2 Parallel, individually addressable probes for nanolithography
05/01/2003WO2003036734A2 Magnetoresistance effect element, magetic memory element, magnetic memory device, and their manufacturing method
05/01/2003WO2003036729A1 Delta doped silicon carbide metal-semiconductor field effect transistors and methods of fabricating them
05/01/2003WO2003036728A1 Contact portion of semiconductor device and method for manufacturing the same, and thin film transistor array panel for display device including the contact portion and method for manufacturing the same
05/01/2003WO2003036726A1 Information storage device and manufacturing method thereof
05/01/2003WO2003036725A1 Magnetic memory device
05/01/2003WO2003036724A2 Semiconductor structure with reduced capacitive coupling between components
05/01/2003WO2003036723A2 Semiconductor structure provided with a component capacitively uncoupled from the substrate
05/01/2003WO2003036719A2 Micro- or nano-electronic component comprising a power source and means for protecting the power source
05/01/2003WO2003036718A2 Pattern for improved visual inspection of semiconductor devices
05/01/2003WO2003036715A2 Adhesive wafers for die attach application
05/01/2003WO2003036714A1 Longitudinal misfet manufacturing method, longitudinal misfet, semiconductor storage device manufacturing method, and semiconductor storage device
05/01/2003WO2003036713A1 Digital signal transmission circuit and method of designing it
05/01/2003WO2003036712A1 Method and apparatus for dicing a semiconductor wafer
05/01/2003WO2003036711A2 Fill pattern generation for spin-on glass and related self-planarization deposition
05/01/2003WO2003036710A1 Bonding wire
05/01/2003WO2003036709A2 A method of forming a silicon dioxide layer on a curved silicon surface
05/01/2003WO2003036708A1 Microwave plasma substrate processing device
05/01/2003WO2003036706A1 Method and apparatus for etching silicon wafer and method for analysis of impurities
05/01/2003WO2003036705A1 Polishing compound, method for production thereof and polishing method
05/01/2003WO2003036704A1 Method and apparatus for the etching of photomask substrates using pulsed plasma
05/01/2003WO2003036703A1 Process and apparatus for etching of thin, damage sensitive layers using high frequency pulsed plasma