Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/01/2003US20030081443 Semiconductor memory device adaptable to various types of packages
05/01/2003US20030081371 Capacitor and method for fabricating the same
05/01/2003US20030081368 Protecting circuit of the semiconductor factory automation
05/01/2003US20030081363 ESD protection device and method of manufacturing the device
05/01/2003US20030081216 Graphical user interface for sample positioning
05/01/2003US20030081213 Alignment apparatus, exposure apparatus using same, and method of manufacturing devices
05/01/2003US20030081210 Optical apparatus
05/01/2003US20030081201 Method and apparatus for inspecting defects
05/01/2003US20030081192 Exposure apparatus and method using light having a wavelength less than 200 nm
05/01/2003US20030081189 Apparatus and method for exposure
05/01/2003US20030081188 That allows easy determination of the alignment marks when the mask is positioned to the workpiece, as well as an increase in the production rate capacity of the stepper without using an exposure device by which a fine pattern is formed
05/01/2003US20030080802 Semiconductor integrated circuit device
05/01/2003US20030080778 Programmable logic device architectures with super-regions having logic regions and a memory region
05/01/2003US20030080770 Method for universal wafer carrier for wafer level die burn-in
05/01/2003US20030080768 Test method of semiconductor device
05/01/2003US20030080765 Probe station thermal chuck with shielding for capacitive current
05/01/2003US20030080761 Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring
05/01/2003US20030080717 Semiconductor device
05/01/2003US20030080441 Flip chip integrated package mount support
05/01/2003US20030080439 Delamination-preventing substrate and semiconductor package with the same
05/01/2003US20030080437 Electronic assembly with filled no-flow underfill and methods of manufacture
05/01/2003US20030080436 Such as personal computer or goggle display; an aperture portion is formed in the dielectric film, the electrode or the semiconductor layer is formed in the aperture portion; achieves smoothing without using special means
05/01/2003US20030080435 Shapes-based migration of aluminum designs to copper damascene
05/01/2003US20030080434 Solid image-pickup device and method for manufacturing the solid image pickup device
05/01/2003US20030080433 Semiconductor device
05/01/2003US20030080432 Semiconductor device having a ground plane and manufacturing method thereof
05/01/2003US20030080431 Electroplating copper through mask openings and onto the seed layer, while mechanically sweeping the surface of the masking layer to form planar conductive material deposits filling the holes in the masking layer; flat nail head structure
05/01/2003US20030080430 Creating cavities that are structured in submicrometer dimensions in a cavity layer of a semiconductor device by polymerization
05/01/2003US20030080429 Semiconductor device
05/01/2003US20030080428 Semiconductor device
05/01/2003US20030080425 Compliant relief wafer level packaging
05/01/2003US20030080424 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same
05/01/2003US20030080422 Semiconductor wafer, method of manufacturing semiconductor wafer having bumps, semiconductor chip having bumps and method of manufacturing the same, semiconductor device, circuit board, and electronic equipment
05/01/2003US20030080421 Semiconductor device, its manufacturing process, and its inspecting method
05/01/2003US20030080420 Bumps formed on the pads, wherein each of the bumps is a single layer disposed on a part of each of the pads exposed from the passivation film, and on the passivation film; bump formed by electroless plating
05/01/2003US20030080419 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same
05/01/2003US20030080416 Sub-milliohm on-chip interconnection
05/01/2003US20030080410 Semiconductor device and method for manufacturing same
05/01/2003US20030080408 Method for fabricating semiconductor components and interconnects with contacts on opposing sides
05/01/2003US20030080405 Semiconductor device and method for producing the same
05/01/2003US20030080404 Semiconductor device and manufacturing method thereof
05/01/2003US20030080403 Apparatus and method for leadless packaging of semiconductor devices
05/01/2003US20030080402 Chip scale package with heat spreader and method of manufacture
05/01/2003US20030080400 Semiconductor system-in-package
05/01/2003US20030080399 Transfer wafer level packaging
05/01/2003US20030080397 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
05/01/2003US20030080395 Sealed nitride layer for integrated circuits
05/01/2003US20030080394 Forming collector region of a conductivity type, at semiconducting surface of a body; forming base layer of single-crystal silicon doped to second conductivity type; forming insulating film; forming layer of emitter polysilicon
05/01/2003US20030080391 Magnetic memory device and manufacturing method thereof
05/01/2003US20030080390 Forming a dielectric layer on semiconductor substrate; etching; forming gate oxide layer; forming a barrier conductor; forming metal layer; removing portion of metal layer to form gate; removing dielectric layer; stripping
05/01/2003US20030080389 Semiconductor device having a dielectric layer with a uniform nitrogen profile
05/01/2003US20030080387 CMOS of semiconductor device and method for manufacturing the same
05/01/2003US20030080385 Silicon on insulator device and layout method of the same
05/01/2003US20030080384 Semiconductor substrate, semiconductor device and method for fabricating the same
05/01/2003US20030080383 Active well schemes for SOI technology
05/01/2003US20030080382 Semiconductor device
05/01/2003US20030080381 Semiconductor component and method of operation
05/01/2003US20030080380 Field effect transistor on insulating layer and manufacturing method
05/01/2003US20030080379 Semiconductor device and method for manufacturing the same
05/01/2003US20030080378 Semiconductor component, trench structure transistor, trench MOSFET, IGBT, and field-plate transistor
05/01/2003US20030080375 Semiconductor device and method of manufacturing the same
05/01/2003US20030080374 Non-volatile semiconductor memory device and manufacturing method thereof
05/01/2003US20030080373 Nonvolatile memory device and fabricating method thereof
05/01/2003US20030080372 Semiconductor memory cell, method for fabricating the memory cell, and semiconductor memory device
05/01/2003US20030080371 Seniconductor array of floating gate memory cells and strap regions
05/01/2003US20030080370 Utilizing dielectric material positioned within memory cells for non-volatile charge storage that affect an operating parameter of the individual memory cells according to a level of charge stored in at least one common region thereof
05/01/2003US20030080369 Method of forming a capacitor
05/01/2003US20030080368 Storage capacitor structure
05/01/2003US20030080367 Trench capacitor and method for manufacturing the same
05/01/2003US20030080366 Electrically writable and erasable non-volatile semiconductor memory devices such as flash memory devices; containing capacitor of a booster which enables reduction in size and voltage
05/01/2003US20030080365 Semiconductor integrated circuit device and standard cell placement design method
05/01/2003US20030080364 Semiconductor device and method of manufacturing the same
05/01/2003US20030080363 Electronic device with electrode and its manufacture
05/01/2003US20030080362 Devices and methods for integrated circuit manufacturing
05/01/2003US20030080361 P-channel metal oxide semiconductor (MOS) field effect transistors; integrated circuits
05/01/2003US20030080360 Wafer treatment method for protecting fuse box of semiconductor chip
05/01/2003US20030080356 Semiconductor memory having storage cells storing multiple bits and a method of manufacturing the same
05/01/2003US20030080355 Semiconductor device
05/01/2003US20030080354 Method for manufacturing semiconductor device, and semiconductor device
05/01/2003US20030080352 Mosfet structure with reduced junction capacitance
05/01/2003US20030080351 Trench DMOS device with improved drain contact
05/01/2003US20030080348 Heterojunction field-effect transistor
05/01/2003US20030080347 Method for manufacturing heterojunction field effect transistor device
05/01/2003US20030080346 Vertical transistor and transistor fabrication method
05/01/2003US20030080345 Single crystal GaN substrate, method of growing same and method of producing same
05/01/2003US20030080337 System and method for manufacturing a thin film transistor
05/01/2003US20030080335 Semiconductor device, and verification method for semiconductor testing apparatus and method using the semiconductor device
05/01/2003US20030080334 Semiconductor device having test element and method of testing using same
05/01/2003US20030080333 Method for cleaning a ceramic member for use in a system for producing semiconductors, a cleaning agent and a combination of cleaning agents
05/01/2003US20030080332 Charge carrier extracting transistor
05/01/2003US20030080331 3-5 Group compound semiconductor and semiconductor device
05/01/2003US20030080329 Ferroelectric capacitor and a semiconductor device
05/01/2003US20030080325 Chemical vapor deposition method of making layered superlattice materials using trimethylbismuth
05/01/2003US20030080316 Semiconductor device
05/01/2003US20030080302 Method and apparatus for elimination of high energy ion from EUV radiating device
05/01/2003US20030080300 Wafer pedestal tilt mechanism and cooling system
05/01/2003US20030080176 Method for the calibration of a wire bonder
05/01/2003US20030080173 Transducer for a bonding apparatus
05/01/2003US20030080112 System of controlling the temperature of a processing chamber
05/01/2003US20030080110 Hot plate
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