Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/15/2003WO2003041130A2 Method for creating adhesion during fabrication of electronic devices
05/15/2003WO2003041127A2 Process for forming metallized contacts to periphery transistors
05/15/2003WO2003041126A2 Electrochemical mechanical processing with advancible sweeper
05/15/2003WO2003041124A2 Method of fabricating a gate stack at low temperature
05/15/2003WO2003041122A2 Preconditioning integrated circuit for integrated circuit testing
05/15/2003WO2003041120A2 Method for making a semiconductor photodetector, in particular in the low-energy uv-x domain, and photodetector obtained by said method
05/15/2003WO2003041117A2 Integrated semiconductor component for conducting high-frequency measurements and the use thereof
05/15/2003WO2003041110A2 Method for molding a polymer surface
05/15/2003WO2003041099A1 Capacitor and production method therefor
05/15/2003WO2003041084A1 Electrodes, method and apparatus for memory structure
05/15/2003WO2003040832A1 Agent for forming coating for narrowing pattern and method for forming fine pattern using the same
05/15/2003WO2003040831A1 Method for forming fine pattern
05/15/2003WO2003040829A2 Maskless printer using photoelectric conversion of a light beam array
05/15/2003WO2003040828A2 Real-time prediction of and correction of proximity resist heating in raster scan particle beam lithography
05/15/2003WO2003040827A1 Fluorinated polymers having ester groups and photoresists for microlithography
05/15/2003WO2003040826A1 Photoresist composition for deep uv radiation containing an additive
05/15/2003WO2003040821A1 Active matrix pixel device
05/15/2003WO2003040796A1 Tilting mirror
05/15/2003WO2003040739A1 Semiconductor device tester
05/15/2003WO2003040734A2 Method and system for compensating thermally induced motion of probe cards
05/15/2003WO2003040709A2 Spot grid array imaging system
05/15/2003WO2003040648A1 Interferometric cyclic error compensation
05/15/2003WO2003040636A1 System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
05/15/2003WO2003040441A1 Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film
05/15/2003WO2003040436A1 Method of eliminating voids in w plugs
05/15/2003WO2003040430A1 Substrate processing apparatus and method
05/15/2003WO2003040338A2 Micro-scale interconnect device with internal heat spreader and method for fabricating same
05/15/2003WO2003040252A2 Chemical mechanical polishing compositions
05/15/2003WO2003039812A1 Method of fabricating a polishing pad having an optical window
05/15/2003WO2003039808A1 Single motor, multi-axis stage
05/15/2003WO2003024869A8 Electronic device comprising a mesoporous silica layer and composition for preparing the mesoporous silica layer
05/15/2003WO2003017326A3 Methods of conducting wafer level burn-in of electronic devices
05/15/2003WO2003010550A3 Integrated testing of serializer/deserializer in fpga
05/15/2003WO2002099807A3 Method and apparatus for boosting bitlines for low vcc read
05/15/2003WO2002084401A3 Photoresist compositions comprising solvents for short wavelength imaging
05/15/2003WO2002065530A3 Use of hydrocarbon addition for the elimination of micromasking during etching of organic low-k dielectrics
05/15/2003WO2002061824A3 Slurry and method for chemical mechanical polishing of copper
05/15/2003WO2002059958A3 Aqueous nonferrous feedstock material for injection molding
05/15/2003WO2002058161A3 Mos device having a trench gate electrode
05/15/2003WO2002047148A3 Electrically isolated via in a multilayer ceramic package
05/15/2003WO2002047115A3 Self teaching robot
05/15/2003WO2002045131A3 Process flow for capacitance enhancement in a dram trench
05/15/2003WO2002023621A3 Method and apparatus for fast automated failure classification for semiconductor wafers
05/15/2003WO2002023599A9 Bi-directional processing chamber and method for bi-directional processing of semiconductor substrates
05/15/2003WO2002023109A9 Lamp array for thermal processing chamber
05/15/2003WO2002019420A3 Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnection structures
05/15/2003WO2001080304A3 Improved test structures and methods for inspecting and utilizing the same
05/15/2003US20030093767 Method for fabrication of patterns and semiconductor devices
05/15/2003US20030093737 Event based test system having improved semiconductor characterization map
05/15/2003US20030093711 Flash EEprom system
05/15/2003US20030093237 Method of detecting an integrated circuit in failure among integrated circuits, apparatus of doing the same, and recording medium storing program for doing the same
05/15/2003US20030093173 Stereolithographic method and apparatus for packaging electronic components
05/15/2003US20030092785 Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom
05/15/2003US20030092441 Method and apparatus for providing services in a private wireless network
05/15/2003US20030092371 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
05/15/2003US20030092365 Apparatuses and methods for cleaning test probes
05/15/2003US20030092360 Method for chemical-mechanical polishing of layers made from metals from the platinum group
05/15/2003US20030092358 Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector
05/15/2003US20030092357 Apparatus and method of conditioning polishing pads of chemical-mechanical polishing system
05/15/2003US20030092327 Method for planarizing circuit board and method for manufacturing semiconductor device
05/15/2003US20030092326 Electronic parts packaging method and electronic parts package
05/15/2003US20030092288 Method and apparatus for removing unwanted substance from semiconductor wafer
05/15/2003US20030092287 Process for forming hafnium oxide films
05/15/2003US20030092286 Semiconductor device producing method
05/15/2003US20030092285 Method for manufacturing semiconductor integrated circuit device
05/15/2003US20030092284 Preventing plasma induced damage resulting from high density plasma deposition
05/15/2003US20030092283 Method for fabricating a semiconductor device and a substrate processing apparatus
05/15/2003US20030092282 Susceptor of apparatus for manufacturing semiconductor device
05/15/2003US20030092281 Method for organic barc and photoresist trimming process
05/15/2003US20030092280 Method for etching tungsten using NF3 and Cl2
05/15/2003US20030092279 Method of forming a dual damascene via by using a metal hard mask layer
05/15/2003US20030092278 Plasma baffle assembly
05/15/2003US20030092277 Method for fabricating semiconductor device
05/15/2003US20030092276 Method for etching a silicided poly using fluorine-based reactive ion etching and sodium hydroxide based solution immersion
05/15/2003US20030092275 Method for implanting and coding a read-only memory with automatic alignment at four corners
05/15/2003US20030092274 Fabrication method for an interconnect on a substrate
05/15/2003US20030092273 Method of manufacturing a semiconductor device employing a fluorine-based etch substantially free of hydrogen
05/15/2003US20030092272 Method of stabilizing oxide etch and chamber performance using seasoning
05/15/2003US20030092271 Shallow trench isolation polishing using mixed abrasive slurries
05/15/2003US20030092270 CMP machine dresser and method for detecting the dislodgement of diamonds from the same
05/15/2003US20030092268 Method for manufacturing 3-D horn antenna using exposure apparatus
05/15/2003US20030092266 Gas inlets for wafer processing chamber
05/15/2003US20030092265 Comprises acrylic acid-maleic acid copolymer and sodium hydroxide; for chemical mechanical polishing of semiconductors
05/15/2003US20030092264 Substrate processing apparatus and method
05/15/2003US20030092263 Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device
05/15/2003US20030092262 Solvated ruthenium precursors for direct liquid injection of ruthenium and ruthenium oxide
05/15/2003US20030092261 Substrate processing method
05/15/2003US20030092260 Method for forming a dual damascene aperture while employing a peripherally localized intermediate etch stop layer
05/15/2003US20030092259 Method to fabricate NIM capacitor using damascene process
05/15/2003US20030092257 Method for fabricating metal interconnects
05/15/2003US20030092256 Method of manufacturing semiconductor device and its device
05/15/2003US20030092255 Low temperature aluminum planarization process
05/15/2003US20030092254 Common ball-limiting metallurgy for I/O sites
05/15/2003US20030092253 Method of manufacturing semiconductor device
05/15/2003US20030092252 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
05/15/2003US20030092251 Method for forming a region of low dielectric constant nanoporous material using a microemulsion technique
05/15/2003US20030092250 Method of making chip-type electronic device provided with two-layered electrode
05/15/2003US20030092249 Lightly-insitu-doped amorphous silicon applied in DRAM gates
05/15/2003US20030092248 Use of linear injectors to deposit uniform selective ozone teos oxide film by pulsing reactants on and off
05/15/2003US20030092247 Process of Fabricating An Anti-Fuse For Avoiding A Key Hole Exposed
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