Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/20/2003US6566146 Method for double-sided patterning of high temperature superconducting circuits
05/20/2003US6566041 Forming plurality of exposure openings; overcoating with photoresist; patterning
05/20/2003US6566040 Method of manufacturing a semiconductor device and semiconductor device manufactured by the method
05/20/2003US6566036 Chemically amplified resist
05/20/2003US6566031 Positive photoresist composition, substrate with a photosensitive film and process for imaging a resist pattern
05/20/2003US6566021 Applying the amorophous solution of fluoropolymer prepared in a suitable solvent, to the surface of the photomask (containing a transpernt substrate defining transmitting and nontransmitting segments), curing the coating
05/20/2003US6566016 Apparatus and method for compensating critical dimension deviations across photomask
05/20/2003US6565928 Polyimides
05/20/2003US6565920 Providing a substrate having a surface coated with a spin-on material of alkoxysilane silica precursor and wherein surface comprises an edge; spinning substrate; expanding a fluid through a nozzle to form a cryogenic aerosol stream; directing
05/20/2003US6565765 Method for manufacturing a sensor having a membrane
05/20/2003US6565763 Method for manufacturing porous structure and method for forming pattern
05/20/2003US6565759 Etching process
05/20/2003US6565736 Supplying deionized water into an anode cell and a cathode cell of a 3-cell electrolyzer; filling intermediate cell with an electrolytic aqueous solution to perform electrolysis, cells of electrolyzer are divided by ion exchange membranes
05/20/2003US6565729 Using alkaline electrolyte bath; uniform overcoatings
05/20/2003US6565721 Use of heavy halogens for enhanced facet etching
05/20/2003US6565720 Determination dielectric end-point
05/20/2003US6565706 Support-frame bonding apparatus
05/20/2003US6565705 Wafer carrier used for chemical mechanic polishing
05/20/2003US6565687 Ultrasonic bonding method
05/20/2003US6565670 Securing the wafer to a spin chuck; a first cleaning station to submerge the spinning wafer into N-methyl-pyrrolidone solution, using second cleaning statation to spray the solution, using drying station to blow gas onto the surface
05/20/2003US6565669 Vibrating wafer particle cleaner
05/20/2003US6565667 Removal surface impurities using dry ice
05/20/2003US6565666 Removal liquid from semiconductor surface using capillary channels
05/20/2003US6565664 Using mixture comprising an ammonium salt, an amine, and water
05/20/2003US6565662 Vacuum processing apparatus for semiconductor process
05/20/2003US6565656 Coating processing apparatus
05/20/2003US6565655 High vacuum apparatus for fabricating semiconductor device and method for forming epitaxial layer using the same
05/20/2003US6565649 Epitaxial wafer substantially free of grown-in defects
05/20/2003US6565619 Mixture of colloidal silica, acid and water
05/20/2003US6565424 Method and apparatus for planarizing semiconductor device
05/20/2003US6565422 Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus
05/20/2003US6565419 Method of removing particles from stage and cleaning plate
05/20/2003US6565309 Polarity inversion apparatus and polarity inversion method for chip components
05/20/2003US6565304 Wafer boat elevator system and method
05/20/2003US6565008 Module card and a method for manufacturing the same
05/20/2003US6564991 Ball mount apparatus and mount method
05/20/2003US6564989 Wire bonding method and wire bonding apparatus
05/20/2003US6564988 Manufacturing method of head suspension assembly with IC chip
05/20/2003US6564987 Ratio of tape thickness to spacings
05/20/2003US6564979 Method and apparatus for dispensing adhesive on microelectronic substrate supports
05/20/2003US6564946 Containment device for retaining semiconductor wafers
05/20/2003US6564818 Methods of implementing a single shaft, dual cradle vacuum slot valve
05/20/2003US6564812 Used for removing photoresist or other residue from a substrate, such as an integrated circuit
05/20/2003US6564811 Method of reducing residue deposition onto ash chamber base surfaces
05/20/2003US6564744 Plasma CVD method and apparatus
05/20/2003US6564743 Method for forming oxide film of semiconductor device, and oxide film forming apparatus capable of shortening pre-processing time for concentration measurement
05/20/2003US6564474 Apparatus for heat processing of substrate
05/20/2003US6564469 Device for performing surface treatment on semiconductor wafers
05/20/2003US6564458 Method for manufacturing a radiator
05/20/2003US6564454 Method of making and stacking a semiconductor package
05/20/2003US6564453 Bent wire forming method
05/20/2003US6564452 Method for creating printed circuit board substrates having solder mask-free edges
05/20/2003US6564449 Method of making wire connection in semiconductor device
05/20/2003US6564447 Non lead frame clamping for matrix leadless leadframe package molding
05/20/2003US6564421 Multi functional cleaning module of manufacturing apparatus for flat panel display and cleaning apparatus using the same
05/20/2003CA2363409A1 A wire bonder for ball bonding insulated wire and method of using same
05/20/2003CA2199515C Automated molecular biological diagnostic system
05/15/2003WO2003041469A1 Method for the selective surface treatment of planar workpieces
05/15/2003WO2003041460A1 Plasma process apparatus and its processor
05/15/2003WO2003041272A1 Integrated balun and transformer structure
05/15/2003WO2003041186A2 Organic thin film transistor with siloxane polymer interface
05/15/2003WO2003041185A2 Organic thin film transistor with polymeric interface
05/15/2003WO2003041176A2 A scalable flash eeprom memory cell with floating gate spacer wrapped by control gate, and method of manufacturing the same
05/15/2003WO2003041173A1 High-frequency oscillator for an integrated semiconductor circuit and the use thereof
05/15/2003WO2003041172A1 Ferroelectric nonvolatile semiconductor memory
05/15/2003WO2003041171A2 Heterojunction bipolar transistor with integrated mim capacitor
05/15/2003WO2003041169A2 Thermally balanced power transistor
05/15/2003WO2003041168A1 Silicon on insulator device with improved heat removal and method of manufacture
05/15/2003WO2003041167A1 Semiconductor device comprising low dielectric material film and its production method
05/15/2003WO2003041164A1 Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package
05/15/2003WO2003041162A2 Method of forming reliable cu interconnects
05/15/2003WO2003041161A2 High frequency signal isolation in a semiconductor device
05/15/2003WO2003041160A2 Two-step ion implantation method with active wafer cooling for buried oxide formation
05/15/2003WO2003041159A1 Wafer observation position designating apparatus, and wafer display position designating method
05/15/2003WO2003041158A2 Semiconductor package device and method of formation and testing
05/15/2003WO2003041157A2 Large area silicon carbide devices and manufacturing methods therefor
05/15/2003WO2003041156A1 Component separation and indexing unit utilizing vacuum holding and detection
05/15/2003WO2003041154A2 A method of manufacturing a plurality of assemblies
05/15/2003WO2003041153A1 Method of fixing a sealing object to a base object
05/15/2003WO2003041152A1 Silicon-germanium mesa transistor
05/15/2003WO2003041151A1 Method and device for forming oxide film
05/15/2003WO2003041150A2 Two-step etching method for hard mask removal
05/15/2003WO2003041149A1 Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes
05/15/2003WO2003041148A1 Gas for plasma reaction, process for producing the same, and use
05/15/2003WO2003041147A1 Anodic oxidizer, anodic oxidation method
05/15/2003WO2003041146A1 Apparatus and method for reactive atom plasma processing for material deposition
05/15/2003WO2003041145A1 Plating solution, semiconductor device and method for manufacturing the same
05/15/2003WO2003041144A2 Method for producing thin metal-containing layers having a low electrical resistance
05/15/2003WO2003041143A1 Laser beam treatment device and semiconductor device
05/15/2003WO2003041142A1 Method for forming thin film
05/15/2003WO2003041141A1 Apparatus for depositing
05/15/2003WO2003041139A1 Thermal treating apparatus
05/15/2003WO2003041138A2 Sintered polycrystalline gallium nitride
05/15/2003WO2003041137A1 METHOD OF MANUFACTURING AN InGaNAs COMPOUND SEMICONDUCTOR THIN FILM AND THE THIN FILM MANUFACTURED BY THE SAME
05/15/2003WO2003041136A1 Electron beam exposure device
05/15/2003WO2003041135A1 Electron beam exposure device
05/15/2003WO2003041134A1 Illumination optical device, exposure device, and exposure method
05/15/2003WO2003041133A2 Electrothermal self-latching mems switch and method
05/15/2003WO2003041132A2 Gas-assisted rapid thermal processing
05/15/2003WO2003041131A2 Single wafer dryer and drying methods
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