Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/14/2003CN1417860A Semicoductor integrated circuit
05/14/2003CN1417859A Semiconductor device
05/14/2003CN1417858A Metal lug with high pin and its making method and apparatus
05/14/2003CN1417857A Radiation fin array cooler
05/14/2003CN1417853A CMOS device and its manufactrue
05/14/2003CN1417852A Semiconductor device and its manufacture
05/14/2003CN1417851A Method of eliminating copper erosion of double-layered embedding structure
05/14/2003CN1417850A Shallow-channel insulation making process
05/14/2003CN1417849A Manufactrue of ferroelectric capacitor
05/14/2003CN1417848A Making method and apparatus of metal lug with high pin
05/14/2003CN1417847A Laser radiation method, laser radiation equipment and manufacture of semiconductor device
05/14/2003CN1417846A Manufacture of tunnel oxide layer
05/14/2003CN1417845A Manufacture of semiconductor integrated circuit device
05/14/2003CN1417844A SiGe/Si Chemical vapor deposition growth process
05/14/2003CN1417843A Pottern forming method
05/14/2003CN1417842A Semicoductor device and its manufacture, circuit board and electronic equipment
05/14/2003CN1417841A Semiconductor device and its manufacture
05/14/2003CN1417803A Magnetic memory with SOI base board and its making process
05/14/2003CN1417774A Magnetoresistance sensor and its making process
05/14/2003CN1417646A Method of checking exposure device, correcting focus position and manfacturing semiconductor device
05/14/2003CN1417644A Object-exposing equipment and method
05/14/2003CN1417643A Method of reducing size of pattern interval of opening
05/14/2003CN1417610A Projection optical system, explosure device and making process of equipment
05/14/2003CN1417589A Probe card for LCD detection
05/14/2003CN1417383A Etchant and substrate with etched copper wire array
05/14/2003CN1417374A Film forming equipment and method
05/14/2003CN1417373A Sputtering equipment and film forming method
05/14/2003CN1417131A Elimination method of eliminatld article
05/14/2003CN1417130A Elimination method of eliminated article
05/14/2003CN1417098A Reel box for wire and reel handling method with the reel box
05/14/2003CN1417008A Workpiece regulating method for cutting machine
05/14/2003CN1416935A Filter
05/14/2003CN1108637C Method for forming field oxidate layer of semiconductor device
05/14/2003CN1108636C Method and device for checking IC device shell pin
05/14/2003CN1108635C Process for manufacturing semiconductor device
05/14/2003CN1108634C Method of wire bonding IC to ultraflexible substrate
05/14/2003CN1108633C Semiconductor device in which interlevel insulating film is protected, and method of manufacturing
05/14/2003CN1108632C Wafer processing apparatus, wafer processing method, and wafer in insulator fabrication method
05/14/2003CN1108631C Method for cleaning surface of gallium arsenide
05/14/2003CN1108630C Method for manufacturing semiconductor device having metal silicide film
05/14/2003CN1108613C Method for manufacturing non-volatile memory cell
05/14/2003CN1108541C Corrosion inhibitor stripping liquid control device
05/14/2003CN1108539C 有源矩阵液晶显示器 An active matrix liquid crystal display
05/14/2003CN1108267C Transport system with integrated transport carrier and directors
05/14/2003CN1108225C 光学系统 Optical system
05/13/2003US6564366 Method for channel routing, and apparatus
05/13/2003US6564362 Method of designing a layout of an LSI chip, and a computer product
05/13/2003US6564353 Method and apparatus for designing a clock distributing circuit, and computer readable storage medium storing a design program
05/13/2003US6564115 Combined system, method and apparatus for wire bonding and testing
05/13/2003US6564114 Intensity data, computer
05/13/2003US6563905 Ball grid array X-ray orientation mark
05/13/2003US6563843 Laser irradiation device
05/13/2003US6563736 Flash memory structure having double celled elements and method for fabricating the same
05/13/2003US6563731 EEPROM memory cell array embedded on core CMOS
05/13/2003US6563728 Semiconductor memory device and method for operation thereof
05/13/2003US6563686 Pedestal assembly with enhanced thermal conductivity
05/13/2003US6563652 Lens barrel and projection aligner
05/13/2003US6563594 Mark position detecting system and method for detecting mark position
05/13/2003US6563591 Optical method for the determination of grain orientation in films
05/13/2003US6563586 Wafer metrology apparatus and method
05/13/2003US6563578 In-situ thickness measurement for use in semiconductor processing
05/13/2003US6563568 Multiple image reticle for forming layers
05/13/2003US6563566 System and method for printing semiconductor patterns using an optimized illumination and reticle
05/13/2003US6563564 Method of operating an optical imaging system, lithographic projection apparatus, device manufacturing method, and device manufactured thereby
05/13/2003US6563558 Liquid crystal display with light shielding film
05/13/2003US6563541 Solid state image device with a vertical charge transfer portion
05/13/2003US6563362 Voltage translator circuit
05/13/2003US6563343 Circuitry for a low internal voltage
05/13/2003US6563341 Tri-state buffer circuit
05/13/2003US6563335 Semiconductor device and test method therefor
05/13/2003US6563334 Insulating film method and apparatus therefor
05/13/2003US6563331 Test and burn-in apparatus, in-line system using the test and burn-in apparatus, and test method using the in-line system
05/13/2003US6563330 Probe card and method of testing wafer having a plurality of semiconductor devices
05/13/2003US6563323 Method for testing a semiconductor integrated circuit
05/13/2003US6563308 Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium
05/13/2003US6563225 Aluminum particles and aluminum-zinc-magnesium-germanium alloy; electronics
05/13/2003US6563224 Three dimensional structure integrated circuit
05/13/2003US6563222 Copper interconnects doped with palladium, zirconium, tin, magnesium, or scandium; semiconductor chips
05/13/2003US6563220 Method for forming conductors in semiconductor devices
05/13/2003US6563219 Passivation integrity improvements
05/13/2003US6563218 Semiconductor device of multi-wiring structure and method of manufacturing the same
05/13/2003US6563216 Semiconductor device having a bump electrode
05/13/2003US6563209 Lead frame for semiconductor device
05/13/2003US6563207 Resin encapsulation; mechanism holds and applies tension to mold release sheet
05/13/2003US6563206 Semiconductor device and semiconductor device structure
05/13/2003US6563204 Plastic sheet with array of protective domes; semiconductor wafers
05/13/2003US6563202 Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus
05/13/2003US6563200 Interface device and interface system
05/13/2003US6563199 Lead frame for semiconductor devices, a semiconductor device made using the lead frame
05/13/2003US6563196 Semiconductor wafer, semiconductor device and manufacturing method therefor
05/13/2003US6563195 Attached to silicone rubber layer; peeling; semiconductors
05/13/2003US6563194 BJT with surface resistor connection
05/13/2003US6563193 High voltage; high resistance layer; emitter region; U-shaped opening in collector region
05/13/2003US6563191 Interdigitated capacitor with dielectric overlay
05/13/2003US6563190 Capacitor array preventing crosstalk between adjacent capacitors in semiconductor device
05/13/2003US6563188 Dielectric film covers metal wire and has opening
05/13/2003US6563187 CMOS image sensor integrated together with memory device
05/13/2003US6563183 Integrated circuit fabricated on semiconductor; field effect transistor positioned above channel region
05/13/2003US6563182 Semiconductor device and manufacturing method thereof
05/13/2003US6563181 High frequency signal isolation in a semiconductor device