Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/15/2003US20030092246 Comprises ceramic holding block and aqueous adhesive composition comprising polyoxyethylene glycol release agent and polyvinyl acetate
05/15/2003US20030092245 Wafer scale molding of protective caps
05/15/2003US20030092244 Method and apparatus for producing bonded dielectric separation wafer
05/15/2003US20030092243 Method for anodically bonding glass and semiconducting material together
05/15/2003US20030092241 Method of forming trench isolation regions
05/15/2003US20030092240 Method for forming a region of low dielectric constant nanoporous material
05/15/2003US20030092239 Method of fabricating a stacked poly-poly and MOS capacitor using a sige integration scheme
05/15/2003US20030092238 Method of forming insulating film and method of producing semiconductor device
05/15/2003US20030092237 Process for manufacturing non-volatile memory cells integrated on a semiconductor substrate
05/15/2003US20030092235 Semiconductor integrated circuit and method for manufacturing the same
05/15/2003US20030092234 Split-gate flash memory and method of manufacturing the same
05/15/2003US20030092233 Method for manufacturing semiconductor integrated circuit device
05/15/2003US20030092232 Method for reducing the contact resistance in organic field-effect transistors by applying a reactive intermediate layer which dopes the organic semiconductor layer region-selectively in the contact region
05/15/2003US20030092231 Etching system having device measuring critical dimension test features along profile of wafer at preset locations, etching chamber with chuck supporting wafer, heating elements adjacent locations, controller adjusting temperature, reduces variation
05/15/2003US20030092230 Method for producing group III nitride compound semiconductor and group III nitride compound semiconductor device
05/15/2003US20030092229 Use of protective caps as masks at a wafer scale
05/15/2003US20030092228 Methods for fabricating metal silicide structures using an etch stopping capping layer
05/15/2003US20030092227 Method of forming a quantum dot and a gate electrode using the same
05/15/2003US20030092226 Photoelectric conversion element and method of manufacturing the same
05/15/2003US20030092225 Method for manufacturing a semiconductor thin film
05/15/2003US20030092224 Semiconductor doping method and liquid crystal display device fabricating method using the same
05/15/2003US20030092223 Method for adjusting ultra-thin SOI MOS transistor threshold voltages
05/15/2003US20030092222 Circuit isolation utilizing MeV implantation
05/15/2003US20030092221 Super low profile package with high efficiency of heat dissipation
05/15/2003US20030092220 Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed
05/15/2003US20030092219 Semiconductor device and method of fabricating the same
05/15/2003US20030092217 Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly
05/15/2003US20030092216 Method of manufacturing a semiconductor package with a lead frame having a support structure
05/15/2003US20030092215 Copper-based chip attach for chip-scale semiconductor packages
05/15/2003US20030092213 Semiconductor device and method for its fabrication
05/15/2003US20030092212 Method for micro-fabricating a pixelless infrared imaging device
05/15/2003US20030092210 Method for producing semiconductor light emitting device and semiconductor light emitting device produced by such method
05/15/2003US20030092207 Activation effect on carbon nanotubes
05/15/2003US20030092206 Method of manufacturing semiconductor apparatus
05/15/2003US20030092203 Method for manufacturing ferroelectric thin film device, ink jet recording head, and ink jet printer
05/15/2003US20030092202 High-frequency integrated inductive winding
05/15/2003US20030091942 Thinner for rinsing photoresist and method of treating photoresist layer
05/15/2003US20030091940 Transferring a bright line pattern to a photosensitive material through a photomask
05/15/2003US20030091939 Exposure device and method of fabricating liquid crystal display panel using the same
05/15/2003US20030091938 Method of depositing an amorphous carbon layer
05/15/2003US20030091937 Method of forming a patterned metal layer
05/15/2003US20030091936 Applying a resist film to a substrate, producing a resist structure with webs having sidewall structures chemically amplified in a dry etching resistance and removing unamplified sections
05/15/2003US20030091930 Pattern formation material and pattern formation method
05/15/2003US20030091929 (meth)acrylic acid adamantane or norbornane ester derivatives
05/15/2003US20030091928 10-90 mol % of an alkyl vinyl ether monomer and 10-90 mol % of acrylate, methacrylate, fumarate and 4-hydroxystyrene derivatives
05/15/2003US20030091927 Photoresist monomers, polymers and photoresist compositions for preventing acid diffusion
05/15/2003US20030091914 Reducing the misalignment failure rate of producing wafer
05/15/2003US20030091909 Phase shift mask and fabrication method therefor
05/15/2003US20030091870 Method of forming a liner for tungsten plugs
05/15/2003US20030091838 Composition for film formation, method of film formation, and silica-based film
05/15/2003US20030091753 Upward distribution of reactive gases; walls coated with a protective film having layers of different dielectric constant; antideposit agents; nitride layer formed of low hydrogen content, high density; oxidation resistance; quality
05/15/2003US20030091748 Coating the surface of an electronic device with an inorganic or organic dielectric resin having silicon atom-bonded hydrogen atoms and an unsaturated compound; hydrosilation and crosslinking by heating or high-energy radiation; strength
05/15/2003US20030091745 Condensation-based enhancement of particle removal by suction
05/15/2003US20030091740 Thin films; vapor deposition
05/15/2003US20030091739 Nitriding; suppress diffusion
05/15/2003US20030091732 Aqueous surfactant solution for developing coating film layer
05/15/2003US20030091728 Circulation; controlling temperature ; supplying ammonia and water vapor; forming dielectric
05/15/2003US20030091727 Overcoating substrate; dispenser has frame, supports with motor; for printed circuits, integrated circuits
05/15/2003US20030091674 Molding assembly for wafer scale molding of protective caps
05/15/2003US20030091673 Packaging substrate with electrostatic discharge protection
05/15/2003US20030091482 High frequency plasma source
05/15/2003US20030091410 Reduced footprint tool for automated processing of microelectronic substrates
05/15/2003US20030091409 Integrated system for tool front-end workpiece handling
05/15/2003US20030091224 Apparatus and methods for collecting global data during a reticle inspection
05/15/2003US20030091082 Semiconductor laser element
05/15/2003US20030091075 Semiconductor laser device, optical pickup using the same, and apparatus and method for manufacturing the same
05/15/2003US20030090948 Semiconductor device having memory cells coupled to read and write data lines
05/15/2003US20030090941 Flash EEprom system
05/15/2003US20030090935 Thin film magnetic memory device for programming required information with an element similar to a memory cell and information programming method
05/15/2003US20030090934 Magnetic random access memory
05/15/2003US20030090933 Thin-film magnetic memory device executing data writing with data write magnetic fields in two direction
05/15/2003US20030090932 Asymmetric mram cell and bit design for improving bit yield
05/15/2003US20030090930 A conductive line for programming a magnetoresistive random access memory device; enhancing the magnetic field for programming semiconductor random access memory
05/15/2003US20030090929 Semiconductor storage apparatus
05/15/2003US20030090928 Semiconductor memory device
05/15/2003US20030090924 Semiconductor memory device
05/15/2003US20030090923 ROM embedded DRAM with dielectric removal/short
05/15/2003US20030090884 Wafer-level chip scale package having stud bump and method for fabricating the same
05/15/2003US20030090883 Component built-in module and method for producing the same
05/15/2003US20030090882 Passive devices and modules for transceiver
05/15/2003US20030090877 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same
05/15/2003US20030090853 Fluid dielectric variable capacitor
05/15/2003US20030090676 In-situ film thickness measurement using spectral interference at grazing incidence
05/15/2003US20030090675 Interferometric methods and apparatus for determining object position while taking into account rotational displacements and warping of interferometer mirrors on the object
05/15/2003US20030090671 Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
05/15/2003US20030090669 Thin-film inspection method and device
05/15/2003US20030090662 Alignment method, alignment apparatus, exposure apparatus using the same, and device manufactured by using the same
05/15/2003US20030090661 Focusing method, position-measuring method, exposure method, method for producing device, and exposure apparatus
05/15/2003US20030090651 Three-dimensional micropattern profile measuring system and method
05/15/2003US20030090645 Vibration damping apparatus, control method therefor, exposure apparatus having the vibration damping apparatus, maintenance method therefor, semiconductor device fabrication method, and semiconductor fabrication factory
05/15/2003US20030090643 Light source, light source generation control method, exposure apparatus and maintenance method therefor, and semiconductor device manufacturing method and semiconductor production facility
05/15/2003US20030090642 Alignment system and projection exposure apparatus
05/15/2003US20030090641 Lithographic apparatus and device manufacturing method
05/15/2003US20030090640 Exposure method and apparatus
05/15/2003US20030090612 Liquid crystal display device
05/15/2003US20030090604 Thin film transistor array panel for a liquid crystal display and methods for manufacturing the same
05/15/2003US20030090550 Method for manufacturing ferroelectric thin film device, ink jet recording head, and ink jet printer
05/15/2003US20030090313 Switch circuit and method of switching radio frequency signals
05/15/2003US20030090311 High voltage switch suitable for non-volatile memories
05/15/2003US20030090288 Method of testing semiconductor integrated circuits and testing board for use therein