Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/15/2003US20030090281 Device testing contactor, method of producing the same, and device testing carrier
05/15/2003US20030090274 Laser-trimming fuse detecting circuit and method for semiconductor integrated circuit
05/15/2003US20030090214 Display apparatus
05/15/2003US20030090070 Chucking apparatus and production method for the same
05/15/2003US20030090040 Use of infrared radiation in molding of protective caps
05/15/2003US20030090008 First housing encapsulating a semiconductor die, a heat sink is positioned near the first housing and a second housing is formed to encapsulate at least part of the heat sink; synchronous-link dynamic random access memory (SLDRAM)
05/15/2003US20030090007 Housing assembly for an electronic device and method of packaging an electronic device
05/15/2003US20030090006 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
05/15/2003US20030090004 Method for manufacturing a low-profile semiconductor device
05/15/2003US20030090003 Ultrasonic horn for a bonding apparatus
05/15/2003US20030090002 Semiconductor device and method of manufacturing the same
05/15/2003US20030089999 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
05/15/2003US20030089993 Semiconductor device including titanium wires and manufacturing method therefor
05/15/2003US20030089992 Plasma enhanced chemical vapor deposition in the presence of an inert gas; low dielectric constant; useful in a damascene structure; passivation layer, resistant to moisture
05/15/2003US20030089991 Light emitting apparatus and method for manufacturing the same
05/15/2003US20030089990 Semiconductor device and method of manufacturing the same
05/15/2003US20030089989 Conductive runner or line having a contact pad with which electrical communication is desired is formed over a substrate outer surface, and a conductive plug is formed laterally proximate the contact pad
05/15/2003US20030089988 Semiconductor device and method of manufacturing the same
05/15/2003US20030089987 Dual damascene structures are formed in a dielectric stack including three dielectric layers; via patterns for these structures have a rectangular shape and are wider than the corresponding overlaying trench patterns
05/15/2003US20030089986 Microelectronic device layer deposited with multiple electrolytes
05/15/2003US20030089984 Multilayer flexible wiring boards
05/15/2003US20030089983 Ball grid array semiconductor package
05/15/2003US20030089978 Memory-module and a method of manufacturing the same
05/15/2003US20030089976 Heat sink with collapse structure and semiconductor package with heat sink
05/15/2003US20030089973 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
05/15/2003US20030089969 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
05/15/2003US20030089967 Silicon wafer and fabricating method therefor
05/15/2003US20030089966 IGBT (Insulated Gate Bipolar Transistor) where the pinch-off of the channel is generated in the position closer to the n-type base layer than to the junction between the p-type base layer and the n-type emitter layer
05/15/2003US20030089965 Bipolar transistor circuit and usage method of bipolar transistor
05/15/2003US20030089963 Semiconductor device with inductive component and method of making
05/15/2003US20030089961 STI leakage reduction
05/15/2003US20030089960 Asymmetric high-voltage metal-oxide-semiconductor device
05/15/2003US20030089959 Schottky barrier diode
05/15/2003US20030089955 Semiconductor intergrated circuit
05/15/2003US20030089954 Semiconductor device and method of manufacturing the same
05/15/2003US20030089953 Method and apparatus for selectively providing a semiconductor device with improved breakdown voltage without requiring an additional mask
05/15/2003US20030089952 Method and apparatus for selectively providing a semiconductor device with improved breakdown voltage without requiring an additional mask
05/15/2003US20030089951 ESD (electrostatic discharge) implantation with a lightly-doped concentration in the ESD regions of ESD-protection devices; complementary metal oxide semiconductors (CMOS); protection from ESD damage
05/15/2003US20030089950 Bonding of silicon and silicon-germanium to insulating substrates
05/15/2003US20030089949 Multilayer stack convex structure that can control the reflection angle by the specific taper angle and can effectively control the light reflection direction; less expensive process, saves one photo-masking step
05/15/2003US20030089948 Substrate contact in SOI and method therefor
05/15/2003US20030089947 Power MOSFET device
05/15/2003US20030089946 Trench MOSFET having low gate charge
05/15/2003US20030089945 Mosfet with reduced threshold voltage and on resistance and process for its manufacture
05/15/2003US20030089944 Electrically erasable programmable read-only memory (EEPROM) devices including multilayer sense and select transistor gates
05/15/2003US20030089943 BEOL decoupling capacitor
05/15/2003US20030089942 Scalable gate and storage dielectric
05/15/2003US20030089941 Method for stabilizing or offsetting voltage in an integrated circuit
05/15/2003US20030089940 Capacitor comprising a layer of conductive material having a first portion and a second portion arranged in a pattern relative to one another to provide maximum capacitance per semiconductor die area; e.g. pattern of interleaved combs
05/15/2003US20030089939 Method for manufacturing semiconductor memory device using hemispherical grain silicon
05/15/2003US20030089938 Semiconductor device and method of manufacturing the same
05/15/2003US20030089937 Semiconductor device and method for fabricating the same
05/15/2003US20030089936 Structure and method for embedding capacitors in Z-connected multi-chip modules
05/15/2003US20030089935 Non-volatile semiconductor memory device with multi-layer gate insulating structure
05/15/2003US20030089934 Ferroelectric capacitor and method of manufacturing the same
05/15/2003US20030089932 Semiconductor device, method of manufacutre thereof, and information processing device
05/15/2003US20030089931 Method for producing wafer notches with rounded corners and a tool therefor
05/15/2003US20030089928 Semiconductor device
05/15/2003US20030089926 Semiconductor device
05/15/2003US20030089925 Semiconductor device
05/15/2003US20030089924 Silicon-based PT/PZT/PT sandwich structure and method for manufacturing the same
05/15/2003US20030089923 Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same
05/15/2003US20030089922 Semiconductor device and method of manufacturing same
05/15/2003US20030089921 Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate having a niobium concentration
05/15/2003US20030089911 Semiconductor device and method of manufacturing the same
05/15/2003US20030089910 Semiconductor element, electric circuit, display device and light-emitting device
05/15/2003US20030089909 Thin film transistors; field effect mobility increased, by performing the introduction of oxygen into the film after performing heat treatment
05/15/2003US20030089907 Thin-film transistor device, its manufacturing process, and image display using the device
05/15/2003US20030089906 Semiconductor device and method for fabricating the same
05/15/2003US20030089903 Dissolved organosilicon compound and porous forming compound which is decomposed or evaporated by heat treatment
05/15/2003US20030089901 Relaxed silicon germanium platform for high speed cmos electronics and high speed analog circuits
05/15/2003US20030089891 CMP cleaning composition with microbial inhibitor
05/15/2003US20030089880 Etching a titanium material and silicon oxide with hydrogen chloride, ammonium fluoride and water
05/15/2003US20030089868 Semiconductor device manufacturing method and semiconductor device
05/15/2003US20030089852 Apparatus and method for observing sample using electron beam
05/15/2003US20030089799 Two-fluid cleaning jet nozzle, cleaning equipment and method of fabricating semiconductor device employing the same
05/15/2003US20030089795 Discharge device and discharge method
05/15/2003US20030089705 Guided heating apparatus and method for using the same
05/15/2003US20030089699 Hot plate unit
05/15/2003US20030089698 Hot wall rapid thermal processor
05/15/2003US20030089697 Thermal processing system and thermal processing method
05/15/2003US20030089692 Silicon wafer protection film trimming method and trimmer
05/15/2003US20030089691 Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
05/15/2003US20030089690 Laser apparatus, laser irradiation method, semiconductor manufacturing method, semiconductor device, and electronic equipment
05/15/2003US20030089687 Susceptor with built-in electrode and manufacturing method therefor
05/15/2003US20030089685 Electronic beam drawing apparatus, method of regulating electronic beam drawing apparatus, and electronic beam drawing method
05/15/2003US20030089680 Method and apparatus for the etching of photomask substrates using pulsed plasma
05/15/2003US20030089678 Thin interface layer to improve copper etch stop
05/15/2003US20030089677 Method for compensating for nonuniform etch profiles
05/15/2003US20030089647 Filtration device
05/15/2003US20030089615 Forming conductive layers on a semiconductor wafer surface without losing space on the surface by clamping; a relative motion, rotational and lateral, established between the contacts and the wafer surface; consistancy
05/15/2003US20030089612 Method and system to provide electrical contacts for electrotreating processes
05/15/2003US20030089608 Substrate processing apparatus
05/15/2003US20030089602 Semiconductor device, method of fabricating the same, and supttering apparatus
05/15/2003US20030089601 Magnet array in conjunction with rotating magnetron for plasma sputtering
05/15/2003US20030089600 Workpiece holder for processing apparatus, and processing apparatus using the same
05/15/2003US20030089598 Method and system to provide electrical contacts for electrotreating processes
05/15/2003US20030089597 Method of depositing a TaN seed layer
05/15/2003US20030089458 Wafer processing member
05/15/2003US20030089457 Apparatus for controlling a thermal conductivity profile for a pedestal in a semiconductor wafer processing chamber
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