Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/13/2003US6562682 Method for forming gate
05/13/2003US6562681 Nonvolatile memories with floating gate spacers, and methods of fabrication
05/13/2003US6562680 Semiconductor device and method of manufacturing the same
05/13/2003US6562679 Method for forming a storage node of a capacitor
05/13/2003US6562678 Chemical vapor deposition process for fabricating layered superlattice materials
05/13/2003US6562677 Capacitance element and method of manufacturing the same
05/13/2003US6562676 Method of forming differential spacers for individual optimization of n-channel and p-channel transistors
05/13/2003US6562675 Adjustment of threshold voltages of selected NMOS and PMOS transistors using fewer masking steps
05/13/2003US6562673 Method of fabricating a self-aligned split gate flash memory cell
05/13/2003US6562671 Semiconductor display device and manufacturing method thereof
05/13/2003US6562670 Poly-silicon thin film transistor and method for fabricating thereof
05/13/2003US6562669 Semiconductor device and method of manufacturing the same
05/13/2003US6562668 Method of fabricating thin film transistor using buffer layer and the thin film transistor
05/13/2003US6562667 TFT for LCD device and fabrication method thereof
05/13/2003US6562666 Integrated circuits with reduced substrate capacitance
05/13/2003US6562665 Fabrication of a field effect transistor with a recess in a semiconductor pillar in SOI technology
05/13/2003US6562664 Method for installing protective components in integrated circuits that are constructed from standard cells
05/13/2003US6562663 Microelectronic assembly with die support and method
05/13/2003US6562662 Electronic package with bonded structure and method of making
05/13/2003US6562660 Method of manufacturing the circuit device and circuit device
05/13/2003US6562658 Method of making semiconductor device having first and second sealing resins
05/13/2003US6562657 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
05/13/2003US6562656 Cavity down flip chip BGA
05/13/2003US6562655 Heat spreader with spring IC package fabrication method
05/13/2003US6562651 Method of manufacturing a semiconductor device having contact pads
05/13/2003US6562648 Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials
05/13/2003US6562647 Chip scale surface mount package for semiconductor device and process of fabricating the same
05/13/2003US6562646 Method for manufacturing light-emitting device using a group III nitride compound semiconductor
05/13/2003US6562644 Semiconductor substrate, method of manufacturing the semiconductor substrate, semiconductor device and pattern forming method
05/13/2003US6562640 Method of manufacturing micro-display
05/13/2003US6562638 Integrated scheme for predicting yield of semiconductor (MOS) devices from designed layout
05/13/2003US6562637 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
05/13/2003US6562635 Method of controlling metal etch processes, and system for accomplishing same
05/13/2003US6562634 Diode connected to a magnetic tunnel junction and self aligned with a metallic conductor and method of forming the same
05/13/2003US6562633 Assembling arrays of small particles using an atomic force microscope to define ferroelectric domains
05/13/2003US6562548 Overcoating substrate with oxide; doping; heat treatment
05/13/2003US6562547 Method for producing structure in chips
05/13/2003US6562544 Method and apparatus for improving accuracy in photolithographic processing of substrates
05/13/2003US6562525 Photo mask to be used for photolithography, method of inspecting pattern defect, and method of manufacturing semiconductor device through use of the mask
05/13/2003US6562524 Photomask and method of fabricating the same
05/13/2003US6562491 Preparation of composite high-K dielectrics
05/13/2003US6562482 Liquid potting composition
05/13/2003US6562417 Depositing method and a surface modifying method for nano-particles in a gas stream
05/13/2003US6562416 Method of forming low resistance vias
05/13/2003US6562400 Method and apparatus for forming deposition film, and method for treating substrate
05/13/2003US6562398 Molecular coatings
05/13/2003US6562290 Process for the production of composite components by powder injection molding, and composite powders suitable for this purpose
05/13/2003US6562277 Method and apparatus for attaching a workpiece to a workpiece support
05/13/2003US6562254 Etching method
05/13/2003US6562253 Method of producing an optical element having a multiple-level step-like structure through lithography
05/13/2003US6562222 Copper sulfate, sulfuric acid, chlorine, silane coupling agent; semiconductors
05/13/2003US6562219 Forming a first copper film by means of a chemical vapor depotion on an insulating diffusion barrier film; heating the first copper film to a requiered temperature, subsequently forming second copper film on the first by plating
05/13/2003US6562217 That efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid; electronic circuits
05/13/2003US6562204 Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
05/13/2003US6562200 Pressure in the film-forming space is maintained at a pressure lower than the pressure in the sputtering space and a pressure sufficient for sputtered particles to move in the film forming space with their mean free path
05/13/2003US6562199 For reading a magnetic field intensity of a magnetic recording medium or the like as a signal; vacuum cooling chamber; lamination
05/13/2003US6562190 System, apparatus, and method for processing wafer using single frequency RF power in plasma processing chamber
05/13/2003US6562188 Resist mask for measuring the accuracy of overlaid layers
05/13/2003US6562187 Methods and apparatus for determining an etch endpoint in a plasma processing system
05/13/2003US6562186 Apparatus for plasma processing
05/13/2003US6562184 Planarization system with multiple polishing pads
05/13/2003US6562182 Method and apparatus for endpointing a chemical-mechanical planarization process
05/13/2003US6562146 Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide
05/13/2003US6562144 Wafer cleaning method
05/13/2003US6562141 Dual degas/cool loadlock cluster tool
05/13/2003US6562140 Apparatus for fabrication of thin films
05/13/2003US6562129 Formation method for semiconductor layer
05/13/2003US6562128 In-situ post epitaxial treatment process
05/13/2003US6562126 Method and device for producing optical fluoride crystals
05/13/2003US6562124 Method of manufacturing GaN ingots
05/13/2003US6562094 Reticle storage and retrieval system
05/13/2003US6562091 Slurry for chemical mechanical polishing of a semiconductor device and preparation method thereof
05/13/2003US6562079 Microwave discharge apparatus
05/13/2003US6561894 Clean box, clean transfer method and apparatus therefor
05/13/2003US6561890 For use in chemical mechanical polishing; abrasive fine inorganic powder and reinforcing fine silica powder dispersed in silicone rubber
05/13/2003US6561883 Method of polishing
05/13/2003US6561878 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
05/13/2003US6561876 CMP method and semiconductor manufacturing apparatus
05/13/2003US6561875 Apparatus and method for producing substrate with electrical wire thereon
05/13/2003US6561873 Method and apparatus for enhanced CMP using metals having reductive properties
05/13/2003US6561870 Adjustable force applying air platen and spindle system, and methods for using the same
05/13/2003US6561839 Process for forming shallow isolating regions in an integrated circuit and an integrated circuit thus formed
05/13/2003US6561798 Apparatus for processing a wafer
05/13/2003US6561796 Heating in a gas with a thermal conductivity and mean free path greater than that of oxygen, or by heating under a pressure less than 0.1 Torr.
05/13/2003US6561744 Wafer blade for wafer pick-up from a water tank and method for using
05/13/2003US6561743 For separating a pellet adhered on an adhesive sheet
05/13/2003US6561381 Closed loop control over delivery of liquid material to semiconductor processing tool
05/13/2003US6561343 Magnetic carrying device
05/13/2003US6561220 Apparatus and method for increasing throughput in fluid processing
05/13/2003US6561204 Apparatus and method for cleaning wafers with contact holes or via holes
05/13/2003US6561086 Automatic aligning pressing apparatus
05/13/2003US6561066 Cutting apparatus equipped with a blade aligning means
05/13/2003US6560896 Apparatus, method and system for the treatment of a wafer
05/13/2003US6560861 Microspring with conductive coating deposited on tip after release
05/13/2003US6560860 Providing multilayered low temperature co-fired ceramic assembly with constraining core to minimize shrinkage of outer ceramic layers having high density circuit features patterned thereon during firing
05/13/2003US6560857 Assembly device
05/13/2003US6560809 Substrate cleaning apparatus
05/13/2003CA2215023C Cleaning device and method
05/08/2003WO2003039219A1 Method for manufacturing multilayer circuit board for semiconductor device
05/08/2003WO2003039217A1 Method for opening the plastic housing of an electronic module
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