Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/01/2003US20030080109 Heater assembly for manufacturing a semiconductor device
05/01/2003US20030080108 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus
05/01/2003US20030080104 Heat treating apparatus and method
05/01/2003US20030080099 Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
05/01/2003US20030080092 Rework method for finishing metallurgy on chip carriers
05/01/2003US20030080091 Method of processing a sample surface having a masking material and an anti-reflective film using a plasma
05/01/2003US20030080090 Method and apparatus for restricting process fluid flow within a showerhead assembly
05/01/2003US20030080089 Contains sulfuric acid anions and a trivalent salt; anion-exchanger
05/01/2003US20030080084 Method of forming patterned thin film and method of fabricating micro device
05/01/2003US20030080083 Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment
05/01/2003US20030080011 Spool case for bonding wire, and method of handling spool using same
05/01/2003US20030079984 Sputtering apparatus and film forming method
05/01/2003US20030079957 Work conveying system
05/01/2003US20030079895 Lead frame of optical coupling device and manufacturing method of same
05/01/2003US20030079859 Arrayed fin cooler
05/01/2003US20030079853 Substrate support and method of fabricating the same
05/01/2003US20030079837 Semiconductor processing apparatus for continuously forming semiconductor film on flexible substrate
05/01/2003US20030079836 Carrier head for chemical mechanical polishing
05/01/2003US20030079835 Substrate processing apparatus
05/01/2003US20030079834 Shielding system for plasma chamber
05/01/2003US20030079829 Thin film forming apparatus and thin film forming method
05/01/2003US20030079828 Tool for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafers
05/01/2003US20030079823 Providing termination groups selected from identical-with Si-OH, identical-with Si- (OH)2, -Si-(OH)3, and -O-Si-(OH)3, and combinations thereof on the opposing surfaces and placing the opposing surfaces in contact
05/01/2003US20030079822 Direct bonding of articles containing silicon
05/01/2003US20030079764 Substrate processing apparatus and substrate processing method
05/01/2003US20030079763 Apparatus for cleaning wafers
05/01/2003US20030079762 Rotating a vertically oriented substrate; spraying fluid on the rotating substrate; at least partially reflecting fluid away from the substrate when the fluid is displaced from the substrate to a surface above the substrate
05/01/2003US20030079757 Method of cleaning cvd device and cleaning device therefor
05/01/2003US20030079734 Apparatus for removing tiebars after molding of semiconductor chip
05/01/2003US20030079691 Method and apparatus for dechucking a substrate
05/01/2003US20030079689 Induction heating devices and methods for controllably heating an article
05/01/2003US20030079688 Methods and apparatus for plasma doping by anode pulsing
05/01/2003US20030079687 Method and system for coating and developing
05/01/2003US20030079686 Gas delivery apparatus and method for atomic layer deposition
05/01/2003US20030079684 Wafer holder for semiconductor manufacturing apparatus, and method of manufacturing the wafer holder
05/01/2003US20030079683 Chemical vapor deposition; silicon carbide films; dielectrics
05/01/2003US20030079680 Method for mounting a semiconductor device
05/01/2003US20030079679 Spin coater
05/01/2003US20030079677 Method for fabricating a semiconductor epitaxial wafer having doped carbon and a semiconductor epitaxial wafer
05/01/2003US20030079676 High resistivity silicon carbide single crystal
05/01/2003US20030079674 Silicon semiconductor substrate and process for producing the same
05/01/2003US20030079583 Substrate cutting method and substrate cutting apparatus
05/01/2003US20030079550 Method and apparatus for regulating exhaust pressure in evacuation system of semiconductor process chamber
05/01/2003US20030079540 Control gate decoder for twin MONOS memory with two bit erase capability
05/01/2003US20030079416 Chemical mechanical polishing compositions for metal and associated materials and method of using same
05/01/2003CA2469463A1 Circuit formation by laser ablation of ink
05/01/2003CA2464110A1 Delta doped silicon carbide metal-semiconductor field effect transistors and methods of fabricating them
05/01/2003CA2464108A1 Pattern for improved visual inspection of semiconductor devices
04/2003
04/30/2003CN1415119A Method and apparatus for self-doping contacts to semiconductor
04/30/2003CN1415117A Adhesive film for semiconductor, leadframe using the same, semiconductor device and its manufacturing method
04/30/2003CN1415116A Spacer process to eliminate isolation trench corner transistor device
04/30/2003CN1415115A Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition
04/30/2003CN1415113A Method for manufacturing capacitor by forming silicon electrode having hemispherical silicon
04/30/2003CN1415104A Flip-chip mounted integrated circuit card element
04/30/2003CN1414827A Substrate conducting wiring cutting method and device, electronic device manufacturing method and device
04/30/2003CN1414705A Equipment and method of insulator epitaxial silicon transistor used in programmable logic device
04/30/2003CN1414640A Biperpendicular passage film electric crystal body and its manufacturing method
04/30/2003CN1414638A Capacitor element and its manufacturing method and semiconductor device and its manufacturing method
04/30/2003CN1414637A Nonvolatile semiconductor memory and its manufacturing method
04/30/2003CN1414636A Electron device with electrode and its manufacture
04/30/2003CN1414634A 半导体集成电路 The semiconductor integrated circuit
04/30/2003CN1414633A Electronic electrostatic discharge protection device and its manufacturing method
04/30/2003CN1414632A Double-usage of integrated circuit tube pin and signal switch over on the pin
04/30/2003CN1414630A Semiconductor chip and wiring base plate and manufactaring method, semiconductor chip, semiconductor device
04/30/2003CN1414629A Lead frame, its manufacturing method and manufacturing method for semiconductor device using it
04/30/2003CN1414627A Periphery of high-voltage element
04/30/2003CN1414626A Erasing method of P type channel silicon nitride ROM
04/30/2003CN1414625A Manufacturing method of flash storage having separated floating grid and its structure
04/30/2003CN1414624A Manufacturing method of biperpendicular channel film electric crystal body CMOS and its product
04/30/2003CN1414623A Wiring technology of copper doped metal based on A1 material
04/30/2003CN1414622A Double-mosaic process using metal hard cover screen
04/30/2003CN1414621A Integration method of deep submicron base layer anti reflection layer SiON
04/30/2003CN1414620A Manufacturing method of semiconductor device
04/30/2003CN1414619A Testing array and method for testing storage array
04/30/2003CN1414618A Crystal plate grade chip size encapsulating structure and its technology
04/30/2003CN1414617A Method for forming MOS device on silicon substrate
04/30/2003CN1414616A Laser ennealing equipment, TFT device and corresponding ennealing method
04/30/2003CN1414615A Manufacturing method of semiconductor device
04/30/2003CN1414614A Deposition method of copper barrier layer in double damask structure
04/30/2003CN1414613A Preparation process of deep submicron integrated circuit Cu barrier
04/30/2003CN1414612A Treatment method of antireflection film SiON surface hydrogenplasma body
04/30/2003CN1414611A Sedimentation technique of reducing SiC dielectric constant
04/30/2003CN1414610A Method and equipment of removing organic film
04/30/2003CN1414609A Antireflection film SiON surface CH4 plasma body treatment method
04/30/2003CN1414608A Chemical and mechanical grinding device for semiconductor crystal material
04/30/2003CN1414607A Chemical and mechanical grinding method of semiconductor material and its apparatus
04/30/2003CN1414606A Method and equipment of ion implantation
04/30/2003CN1414605A Semiconductor substrate, semiconductor element and its manufacturing method
04/30/2003CN1414604A Manufacturing method of semiconductor
04/30/2003CN1414603A Method of forming TiN barrier by chemical rapour phase deposition
04/30/2003CN1414602A Method and device for stripping semiconductor device by ring-type contact unit
04/30/2003CN1414566A Method for reducing coupling effect between nonvolatile memory storage cell
04/30/2003CN1414560A Film magnetic storing device for writing data by magetic field exerting
04/30/2003CN1414559A Storage device which-storage cell having series magnetic tunnel junction and tunnel junction
04/30/2003CN1414538A Liquid crystal display and its manufacture method
04/30/2003CN1414428A Identification method of new edition optical cover
04/30/2003CN1414377A Method for investigating film and its device
04/30/2003CN1414149A Method of building crystal to grow lead zirconate titanate film
04/30/2003CN1414134A Sputtering method
04/30/2003CN1413903A Transporting equipment
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