Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2003
05/27/2003US6569606 Method of reducing photoresist shadowing during angled implants
05/27/2003US6569605 Exposing photoresist films to light, then etching barrier layers and baking to form electrical ane electronic apparatus such as random acess memory computers
05/27/2003US6569599 High contrast ratio
05/27/2003US6569596 Photoresists comprising N-(ethylsulfonyloxy)succinimide, novolaks, curing agents and an acid generators such as alpha -(hexylsulfonyloxyimino)-4-methoxybenzyl cyanide; integrated circuits; semiconductors
05/27/2003US6569581 Alternating phase shifting masks
05/27/2003US6569578 Method for forming photo-mask
05/27/2003US6569577 Phase-shift photo mask blank comprising half-tone phase-shift film, having specified phase difference and transmittance at specified wavelengths and consisting of two layers in which refractive index of upper layer is smaller than that of lower
05/27/2003US6569575 Light coupling structure used as mask for exposure of resist, comprising protrusions guiding light towards end having lateral shape of structures to be exposed, where it is coupled directly into resist, and connections which block light
05/27/2003US6569535 Silicon wafer and epitaxial silicon wafer utilizing same
05/27/2003US6569532 With porous silica inorganic filler and curing agent; readily moldable, low moisture permeability and reliability in the cured state
05/27/2003US6569501 Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)
05/27/2003US6569496 CVD of metals capable of receiving nickel or alloys thereof using inert contact
05/27/2003US6569382 Electroosmotic movement and attachment of microscale and nanoscale devices
05/27/2003US6569380 Combined enclosure and heat sink formed without an adhesive layer
05/27/2003US6569367 Method for manufacturing electronic component
05/27/2003US6569350 An abrasive, urea hydrogen peroxide, tartaric acid, and a film forming agent; use to remove copper alloy, titanium, and titanium nitride
05/27/2003US6569349 Polyethylene oxide surfactant, ethylenediamine, hydrogen peroxide,benzotriazole, isopropyl alcohol, phosphoric acid
05/27/2003US6569307 Object plating method and system
05/27/2003US6569302 Substrate carrier
05/27/2003US6569282 Etching apparatus
05/27/2003US6569278 Powder metal polymer organic sheet punching for substrate conductors
05/27/2003US6569270 Process for producing a metal article
05/27/2003US6569252 Immersing object in solvent consisting of dipropylene glycol alkyl ether and tripropylene glycol alkyl ether, rinsing
05/27/2003US6569251 Contacting resist with cleaning composition comprising a homogeneous solution of propylene glycol alkyl ether acetate and at least one alcohol having an alkyl group of 2 to 3 carbon atoms
05/27/2003US6569249 Process for forming layers on substrates
05/27/2003US6569241 Substrate spinning apparatus
05/27/2003US6569238 Apparatus and method for depositing semi conductor film
05/27/2003US6569237 Method of pulling up silicon single crystal and method of manufacturing epitaxial wafer
05/27/2003US6569004 Polishing pad and method of manufacture
05/27/2003US6568999 Method and apparatus for cleaning a surface of a microelectronic substrate
05/27/2003US6568998 Using planarizing medium having relatively hard polishing pad and planarizing liquid including colloidal particles formed from silicon dioxide, manganese oxide, and cerium oxide
05/27/2003US6568997 Forming a passivating layer copper oxide for reducing the reaction of the copper metal with the polishing mixtures; reducing the problem of dishing of copper circuits of semiconductor devices
05/27/2003US6568996 Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor
05/27/2003US6568991 Method and apparatus for sensing a wafer in a carrier
05/27/2003US6568899 Wafer processing system including a robot
05/27/2003US6568896 Transfer chamber with side wall port
05/27/2003US6568863 Disposing an optical fiber, sealing the optical fiber and the interconnecting line with a molding material, and removing the interconnecting line, the molding material together with the optical fiber from the mold
05/27/2003US6568847 Judging method and processing apparatus
05/27/2003US6568581 Detection of wire bonding failures
05/27/2003US6568580 Bump bonding apparatus and method
05/27/2003US6568552 Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
05/27/2003US6568412 Rotary processing apparatus with holding bars having drain grooves
05/27/2003US6568408 Method and apparatus for removing a liquid from a surface of a rotating substrate
05/27/2003US6568385 Cutting machine
05/27/2003US6568384 Semiconductor material cutting and processing method
05/27/2003US6568346 Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply
05/27/2003US6568290 Method of measuring dishing using relative height measurement
05/27/2003US6568243 Method of evaluating capacitance value of capacitor on semiconductor substrate
05/27/2003US6568098 Alignment wafer
05/27/2003CA2271125C A new non-thermal process for annealing crystalline materials
05/22/2003WO2003043150A1 Light emitting element structure using nitride bulk single crystal layer
05/22/2003WO2003043094A1 Contact portion of semiconductor device, and thin film transistor array panel for display device including the contact portion
05/22/2003WO2003043093A1 A mask for crystallizing polysilicon and a method for forming thin film transistor using the mask
05/22/2003WO2003043092A2 Ohmic contact structure and method for the production of the same
05/22/2003WO2003043091A1 Trench-gate semiconductor devices and the manufacture thereof
05/22/2003WO2003043089A1 A field effect transistor semiconductor device
05/22/2003WO2003043088A1 Memory device
05/22/2003WO2003043087A1 Semiconductor device
05/22/2003WO2003043080A1 Lateral pnp transistor device, integrated circuit, and fabrication process thereof
05/22/2003WO2003043079A1 Semiconductor process and pmos varactor
05/22/2003WO2003043078A2 Preferential corner rounding of trench structures using post-fill oxidation
05/22/2003WO2003043077A1 Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus
05/22/2003WO2003043076A2 Surface protective sheet for use in wafer back grinding and process for producing semiconductor chip
05/22/2003WO2003043075A1 Method and apparatus for the production of process sensitive lithographic features
05/22/2003WO2003043074A2 Semiconductor component and method for contacting said semiconductor component
05/22/2003WO2003043073A2 A method of depositing low k barrier layers
05/22/2003WO2003043072A1 Etching method and plasma etcher
05/22/2003WO2003043071A1 Grinding pad and method of producing the same
05/22/2003WO2003043070A1 Laser annealing device and thin-film transistor manufacturing method
05/22/2003WO2003043069A1 Apparatus of chemical vapor deposition for forming a thin film
05/22/2003WO2003043067A1 Apparatus for manufacturing organic electro-luminescent light emitting devices for mass production
05/22/2003WO2003043066A2 Layered structures
05/22/2003WO2003043065A1 Mask and its manufacturing method, and method for manufacturing semiconductor device
05/22/2003WO2003043064A1 Substrate inspecting device, coating/developing device and substrate inspecting method
05/22/2003WO2003043062A1 Method of forming a patterned metal layer
05/22/2003WO2003043061A1 Apparatus and method for improving etch rate uniformity
05/22/2003WO2003043060A2 Reduced footprint tool for automated processing of substrates
05/22/2003WO2003043059A2 Advanced process control for immersion processing
05/22/2003WO2003043058A1 Device for treatment of substrates
05/22/2003WO2003043057A2 Synthesis strategies based on the appropriate use of inductance effects
05/22/2003WO2003043052A1 Magnet array in conjunction with rotating magnetron for plasma sputtering
05/22/2003WO2003043044A1 Mems device having a trilayered beam and related methods
05/22/2003WO2003043042A1 Mems device having electrothermal actuation and release and method for fabricating
05/22/2003WO2003043038A2 Mems device having contact and standoff bumps and related methods
05/22/2003WO2003043036A1 Method for homogeneously magnetizing an exchange-coupled layer system of a digital magnetic memory location device
05/22/2003WO2003043021A1 A multi-port static random access memory
05/22/2003WO2003043019A1 Cladding field enhancement of an mram device
05/22/2003WO2003043018A1 Magnetoresistance random access memory for improved scalability
05/22/2003WO2003043017A2 Magnetic device with magnetic tunnel junction, memory array and read/write methods using same
05/22/2003WO2003043015A2 Multiple turn for conductive line programming mram
05/22/2003WO2003043014A1 Voltage booster for non-volatile memories
05/22/2003WO2003042762A1 Chemical rinse composition
05/22/2003WO2003042721A2 Trilayered beam mems device and related methods
05/22/2003WO2003042629A1 Focus masking structures, focus patterns and measurements thereof
05/22/2003WO2003042434A1 Method and device for surface treatment of treated object
05/22/2003WO2003042433A1 Electropolishing assembly and methods for electropolishing conductive layers
05/22/2003WO2003042424A1 Self-ionized and inductively-coupled plasma for sputtering and resputtering
05/22/2003WO2003042423A1 Apparatus
05/22/2003WO2003042310A1 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
05/22/2003WO2003042073A1 Wafer support attachment for a semi-conductor wafer transport container
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