Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/22/2003US6596583 Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layers
07/22/2003US6596582 Method of manufacturing a semiconductor device
07/22/2003US6596581 Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure
07/22/2003US6596580 Recess Pt structure for high k stacked capacitor in DRAM and FRAM, and the method to form this structure
07/22/2003US6596579 Method of forming analog capacitor dual damascene process
07/22/2003US6596578 Semiconductor device and manufacturing method thereof
07/22/2003US6596577 Semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry
07/22/2003US6596576 Limiting hydrogen ion diffusion using multiple layers of SiO2 and Si3N4
07/22/2003US6596575 High voltage breakdown isolation semiconductor device and manufacturing process for making the device
07/22/2003US6596574 Method for forming a flash reference cell
07/22/2003US6596573 Thin film transistor including polycrystalline active layer and method for fabricating the same
07/22/2003US6596572 Method of fabricating a thin-film transistor having a plurality of island-like regions
07/22/2003US6596571 Method of manufacturing semiconductor device
07/22/2003US6596569 Thin film transistors
07/22/2003US6596568 Thin film transistor and fabricating method thereof
07/22/2003US6596567 Method for fabricating a semiconductor device having a impurity layer disposed between a non-doped silicon film and high melting-point metal film for reducing solid state reaction between said high melting-point metal film and polycrystal silicon film
07/22/2003US6596566 Conformal-coated pick and place compatible devices
07/22/2003US6596565 Chip on board and heat sink attachment methods
07/22/2003US6596564 Semiconductor device and method of manufacturing the same
07/22/2003US6596563 Method for double-layer implementation of metal options in an integrated chip for efficient silicon debug
07/22/2003US6596562 Semiconductor wafer singulation method
07/22/2003US6596561 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture
07/22/2003US6596559 Flip-chip package with optimized encapsulant adhesion and method
07/22/2003US6596558 Method for fabricating optical devices with defectless and antireflecting spot size converter
07/22/2003US6596555 Forming of quantum dots
07/22/2003US6596554 Body-tied-to-source partially depleted SOI MOSFET
07/22/2003US6596553 Method of pinhole decoration and detection
07/22/2003US6596551 Etching end point judging method, etching end point judging device, and insulating film etching method using these methods
07/22/2003US6596550 Method for monitoring substrate biasing during plasma processing of a substrate
07/22/2003US6596548 Method for fabricating a capacitor of a semiconductor device
07/22/2003US6596547 Methods of preventing reduction of IrOx during PZT formation by metalorganic chemical vapor deposition or other processing
07/22/2003US6596467 Integrated circuits of low dielectric material prepared using removable pore forming material
07/22/2003US6596466 For integrated circuit structure that includes a contact hole formed adjacent to an intermediate "cactus-shaped" structure
07/22/2003US6596459 Photosensitive polymer and resist composition containing the same
07/22/2003US6596442 Asymmetric halftone biasing for sub-grid pattern adjustment
07/22/2003US6596405 Antireflective porogens
07/22/2003US6596346 Activating the surface of polysiloxane or polycarbosilane stamp by oxygen plasma or photoactive crosslinker, reacting activated surface with a hydrophilic polymer
07/22/2003US6596344 Method of depositing a high-adhesive copper thin film on a metal nitride substrate
07/22/2003US6596343 Tetraethylorthosilicate Si(OC2H5)4, as a suitable organometallic compound which, when coming in contact with hydroxyl radicals, decomposes or breaks down into SiO2
07/22/2003US6596186 Mask for the selective growth of a solid, a manufacturing method for the mask, and a method for selectively growing a solid using the mask
07/22/2003US6596151 Electrodeposition chemistry for filling of apertures with reflective metal
07/22/2003US6596149 Making a semiconductor memory device
07/22/2003US6596138 Sputtering apparatus
07/22/2003US6596131 Bonding layer for metal or ceramic target
07/22/2003US6596123 Method and apparatus for cleaning a semiconductor wafer processing system
07/22/2003US6596115 Method and device for carrying out working steps on miniaturized modules
07/22/2003US6596095 Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereof
07/22/2003US6596093 Using carbon dioxide for removing water and solutes from semiconductor substrates
07/22/2003US6596088 On a semiconductor wafer, ring cutting, cleaning with water jets
07/22/2003US6596087 Method of cleaning conditioning disk
07/22/2003US6596086 Apparatus for thin film growth
07/22/2003US6596085 Methods and apparatus for improved vaporization of deposition material in a substrate processing system
07/22/2003US6596082 Dual cup spin coating system
07/22/2003US6596079 III-V nitride substrate boule and method of making and using the same
07/22/2003US6595841 Apparatus for holding wafer cassettes in a cassette tub during a chemical mechanical polishing process
07/22/2003US6595836 Calibration device for pad conditioner head of a CMP machine
07/22/2003US6595833 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
07/22/2003US6595832 Chemical mechanical polishing methods
07/22/2003US6595831 Method for polishing workpieces using fixed abrasives
07/22/2003US6595830 Method of controlling chemical mechanical polishing operations to control erosion of insulating materials
07/22/2003US6595794 Electrical contact method and apparatus in semiconductor device inspection equipment
07/22/2003US6595787 Low cost integrated out-of-plane micro-device structures and method of making
07/22/2003US6595506 Ion beam assisted diamond-like-carbon film coating is wear resistant
07/22/2003US6595406 Concave face wire bond capillary and method
07/22/2003US6595404 Method of producing electronic part with bumps and method of producing electronic part
07/22/2003US6595400 Wire bonding apparatus
07/22/2003US6595370 Particle filter
07/22/2003US6595224 Bath system with sonic transducers on vertical and angled walls
07/22/2003US6595220 Apparatus for conveying a workpiece
07/22/2003US6595075 Method and apparatus for testing cassette pod door
07/22/2003US6595050 Wire bonded sensor and method for manufacturing wire bonded sensor
07/22/2003US6594891 Process for forming multi-layer electronic structures
07/22/2003US6594890 Heating elastic adhesive pad to predetermined temperature to expand air in pores in surface of pad
07/22/2003US6594889 Method for processing leadframe
07/22/2003US6594847 Single wafer residue, thin film removal and clean
07/17/2003WO2003059028A2 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
07/17/2003WO2003059027A1 System for producing electrical and integrated circuits
07/17/2003WO2003059026A1 System for the manufacture of electric and integrated circuits
07/17/2003WO2003058812A1 Method for the hermetic encapsulation of a component
07/17/2003WO2003058730A1 Methods of making electromechanical three-trace junctions devices
07/17/2003WO2003058728A1 Electroluminescent device
07/17/2003WO2003058724A1 A thin film transistor array panel and a method for manufacturing the same
07/17/2003WO2003058723A1 Organic thin-film transistor and manufacturing method thereof
07/17/2003WO2003058722A1 High voltage power mosfet includes doped columns
07/17/2003WO2003058721A1 Organic semiconductor and method
07/17/2003WO2003058716A1 Discrete semiconductor component
07/17/2003WO2003058715A1 Integrated passive devices formed by demascene processing
07/17/2003WO2003058711A1 Asymmetric semiconductor device having dual work function gate and method of fabrication
07/17/2003WO2003058710A1 Method and structure for a heterojunction bipolar transistor
07/17/2003WO2003058709A2 Method for forming a shallow trench isolation structure with improved corner rounding
07/17/2003WO2003058708A1 Flip chip bonder and method therefor
07/17/2003WO2003058707A1 Semiconductor processing system and semiconductor carrying mechanism
07/17/2003WO2003058706A1 Work convey system, unmanned convey vehicle system, unmanned convey vehicle, and work convey method
07/17/2003WO2003058704A1 Method for producing a protection for chip edges and system for the protection of chip edges
07/17/2003WO2003058703A1 Methods for fabricating interconnect structures having low k dielectric properties
07/17/2003WO2003058702A1 Multiple conductive plug structure for lateral rf mos devices
07/17/2003WO2003058701A2 Uv-enhanced oxy-nitridation of semiconductor substrates
07/17/2003WO2003058700A1 Plasma treatment method
07/17/2003WO2003058699A1 Method of fault detection for material process system
07/17/2003WO2003058697A1 Method of manufacturing semiconductor chip
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