Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/10/2003WO2003056612A1 Method of forming copper interconnections for semiconductor integrated circuits on a substrate
07/10/2003WO2003056611A2 Resistless lithography method for producing fine structures
07/10/2003WO2003056610A1 Substrate treatment method and substrate treatment apparatus
07/10/2003WO2003056609A2 Apparatus and method for electroplating a wafer surface
07/10/2003WO2003056603A2 Self-ionized and inductively-coupled plasma for sputtering and resputtering
07/10/2003WO2003056561A1 Memory cell utilizing negative differential resistance field-effect transistors
07/10/2003WO2003056476A1 Design driven inspection or measurement
07/10/2003WO2003056393A1 Coating material for pattern fineness enhancement and method of forming fine pattern with the same
07/10/2003WO2003056392A1 Determining the aberrations of an imaging system
07/10/2003WO2003056385A1 A wire structure, a thin film transistor substrate of using the wire structure and a method of manufacturing the same
07/10/2003WO2003056305A1 A material independent optical profilometer
07/10/2003WO2003056073A1 Group iii nitride semiconductor substrate and its manufacturing method
07/10/2003WO2003056066A2 Apparatus for the generation and supply of fluorine gas
07/10/2003WO2003056060A1 Method of tisin deposition using a chemical vapor deposition process
07/10/2003WO2003055958A1 Abrasive composition containing organic particles for chemical mechanical planarization
07/10/2003WO2003055820A1 Method for adhering transparent articles and quartz glass plate prepared through adhesion and device using the same
07/10/2003WO2003055789A1 Mems element manufacturing method
07/10/2003WO2003055445A2 Compositions and methods for enhancing corticosteriod delivery
07/10/2003WO2003045673B1 Informational polymer film insert molding
07/10/2003WO2003043057A3 Synthesis strategies based on the appropriate use of inductance effects
07/10/2003WO2003041171A3 Heterojunction bipolar transistor with integrated mim capacitor
07/10/2003WO2003034492A3 Apparatus and methods for semiconductor ic failure detection
07/10/2003WO2003032431A8 Switch circuit and method of switching radio frequency signals
07/10/2003WO2003032367A3 Fabrication of an electrically conductive silicon carbide article
07/10/2003WO2003030217A3 Metal-to-metal antifuse employing carbon-containing antifuse material
07/10/2003WO2003020634A3 A method of fabrication of a sensor
07/10/2003WO2003012852A3 A method of depositing a dielectric film
07/10/2003WO2003012842A3 Semiconductor structure for monolithic switch matrix
07/10/2003WO2003012841A3 Semiconductor structures and devices not lattice matched to the substrate
07/10/2003WO2003007399A3 Low melting point polymer alignment
07/10/2003WO2003003982A3 Light-emitting nanoparticles and method of making same
07/10/2003WO2002101814A3 Method for the formation of contact holes for a number of contact regions for components integrated in a substrate
07/10/2003WO2002097866A3 Method of etching dielectric materials
07/10/2003WO2002095822A3 Method for packaging a microelectronic device using on-die bond pad expansion
07/10/2003WO2002069063A3 Method and apparatus for controlling a tool using a baseline control script
07/10/2003WO2002005343A3 System and method for comparing electronics manufacturing data
07/10/2003US20030131334 Synthesis strategies based on the appropriate use of inductance effects
07/10/2003US20030130812 Alignment method and parameter selection method
07/10/2003US20030130806 Process management system
07/10/2003US20030130761 Cassette and workpiece handler characterization tool
07/10/2003US20030130754 Processing system and processing method
07/10/2003US20030130482 Coating a novolac resin with average molecular weight of 1000-3000 amu and that has been fractionated to remove molecules < 350 amu and (non)fluorinated hydrocarbons onto a substrate and heating; smokeless
07/10/2003US20030130423 Thermosetting component, oligomer or polymer with cage structure, adhesion promoter; for use as dielectric substrate material, etch stop, hardmask, or air bridge in microchips, wafer coating; polyadamantanes
07/10/2003US20030130391 Coating liquid for producing insulating film having low dielectric constant
07/10/2003US20030130247 Compositions and methods for enhancing corticosteroid delivery
07/10/2003US20030130149 Sulfoxide pyrolid(in)one alkanolamine cleaner composition
07/10/2003US20030130146 Aqueous stripping and cleaning composition
07/10/2003US20030130106 Aluminum nitride ceramics, members for use in a system for producing semiconductors, and corrosion resistant members
07/10/2003US20030129931 Window member for chemical mechanical polishing and polishing pad
07/10/2003US20030129854 Apparatus and method for in-situ removal of polymer residue
07/10/2003US20030129853 Method for producing semiconductor device
07/10/2003US20030129852 Method for improving thickness uniformity of deposited ozone-TEOS silicate glass layers
07/10/2003US20030129851 Plasma deposition method and system
07/10/2003US20030129850 System for planarizing metal conductive layers
07/10/2003US20030129849 Plasma etching method
07/10/2003US20030129848 Pre-cleaning method of substrate for semiconductor device
07/10/2003US20030129847 FeRAM sidewall diffusion barrier etch
07/10/2003US20030129846 Method for achieving a uniform material removal rate in a CMP process
07/10/2003US20030129845 Methods for reducing the curvature in boron-doped silicon micromachined structures
07/10/2003US20030129844 Method for forming openings in low dielectric constant material layer
07/10/2003US20030129843 Planarizing recess etch
07/10/2003US20030129842 Method for forming openings in low dielectric constant material layer
07/10/2003US20030129840 Process for in-situ etching a hardmask stack
07/10/2003US20030129839 Method of forming a liner in shallow trench isolation
07/10/2003US20030129838 Abrasives for chemical mechanical polishing
07/10/2003US20030129837 Method for processing a substrate to form a structure
07/10/2003US20030129836 Semiconductor device and manufacturing method therefor
07/10/2003US20030129834 Semiconductor wafer with crystal lattice defects, and process for producing this semiconductor wafer
07/10/2003US20030129833 Electrode forming method and field effect transistor
07/10/2003US20030129832 Method of forming a wiring film
07/10/2003US20030129830 Method for forming multi-layer metal line of semiconductor device
07/10/2003US20030129829 Three-dimensional integrated semiconductor devices
07/10/2003US20030129828 Methods for making multiple seed layers for metallic interconnects
07/10/2003US20030129827 Method of depositing dielectric materials in damascene applications
07/10/2003US20030129826 Graded thin films
07/10/2003US20030129825 Method for forming multi-layer metal line of semiconductor device
07/10/2003US20030129823 Variable cross-section plated mushroom with stud for bumping
07/10/2003US20030129822 Cylindrical bonding structure and method of manufacture
07/10/2003US20030129821 Bump fabrication method
07/10/2003US20030129820 Co-implantation of group VI elements and N for formation of non-alloyed Ohmic contacts for n-type semiconductors
07/10/2003US20030129818 Masking member for forming fine electrode and manufacturing method therefor, method for forming electrode, and field effect transistor
07/10/2003US20030129817 Anneal sequence for high-k film property optimization
07/10/2003US20030129816 Plasma enhanced method for increasing silicon-containing photoresist selectivity
07/10/2003US20030129815 Hardmask gate patterning technique for all transistors using spacer gate approach for critical dimension control
07/10/2003US20030129814 Method of manufacturing semiconductor device
07/10/2003US20030129812 Vertical power component manufacturing method
07/10/2003US20030129811 Method of depositing silicon with high step coverage
07/10/2003US20030129810 Apparatus and processes for the mass production of photovoltaic modules
07/10/2003US20030129809 Wafer splitting method using cleavage
07/10/2003US20030129808 Chemical mechanical polishing in forming semiconductor device
07/10/2003US20030129807 Diffusion-enhanced crystallization of amorphous materials to improve surface roughness
07/10/2003US20030129806 Having deep p+ layer under blue and green pixels but not under red in color filter array
07/10/2003US20030129805 Methods of forming MIM type capacitors by forming upper and lower electrode layers in a recess that exposes a source/drain region of a transistor and MIM capacitors so formed
07/10/2003US20030129804 Process for reducing dopant loss for semiconductor devices
07/10/2003US20030129803 Transistor Structures
07/10/2003US20030129802 Silicon germanium heterojunction bipolar transistor with carbon incorporation
07/10/2003US20030129801 Methods of forming flash field effect transistor gates and non-flash field effect transistor gates
07/10/2003US20030129800 Method of reducing electrical shorts from the bit line to the cell plate
07/10/2003US20030129799 Capacitors of semiconductor devices and methods of fabricating the same
07/10/2003US20030129798 Fabrication of low-resistance electrodes in a deep trench using electrochemical methods
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