| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/16/2003 | CN1430264A Non-volatile storage structure and its manufacturing method |
| 07/16/2003 | CN1430263A Method for forming copper lead wire in semiconductor device |
| 07/16/2003 | CN1430262A Forming method of wiring structure |
| 07/16/2003 | CN1430261A Manufacturing method of internal metal dielectric layer |
| 07/16/2003 | CN1430260A Groove component isolation structure |
| 07/16/2003 | CN1430259A Manufacturing method of nitrogen-contained silicon oxide lining layer using shallow slot separation process |
| 07/16/2003 | CN1430258A Method of integrated manufacturing high-voltage element and low voltage element |
| 07/16/2003 | CN1430257A Ion irradiating device |
| 07/16/2003 | CN1430256A Device and method for identifying working position of device conveying system in semiconductor device testing treatment machine |
| 07/16/2003 | CN1430255A Method of detection pattern defect process |
| 07/16/2003 | CN1430254A Integrated circuit packaging device with heat dissipation wiring design |
| 07/16/2003 | CN1430253A Welding method and welding device |
| 07/16/2003 | CN1430252A Manufacturing method of grid array packaged base pin surface |
| 07/16/2003 | CN1430251A Manufacturing method of stack chip package |
| 07/16/2003 | CN1430250A Separator suitable for PLCC type encapsulated circuit |
| 07/16/2003 | CN1430249A Method of avoiding spike phenomenan |
| 07/16/2003 | CN1430248A Semiconductor device and its manufacturing method |
| 07/16/2003 | CN1430247A Match circuit and plasma processing device |
| 07/16/2003 | CN1430246A Forming method for forming film with copper diffusion preventing by alumium |
| 07/16/2003 | CN1430245A Method for forming film of semiconductor device |
| 07/16/2003 | CN1430226A Film magnet storage device for writing data through bidirectional current |
| 07/16/2003 | CN1430192A Manufacturing method of transportation means, display and semiconductor device |
| 07/16/2003 | CN1429930A Solution for chemical machinery brightening of ruthenium |
| 07/16/2003 | CN1429927A Stablizing agent for stopping substituted cyclotetrasiloxane polymerizing |
| 07/16/2003 | CN1429873A Chemical mechanical polishing slurry for metal and method for preparing metal wire contact plug of semiconductor device by the slurry |
| 07/16/2003 | CN1429703A Pressure method and pressure device |
| 07/16/2003 | CN1429664A Applying method of liquid and its resin coating forming method |
| 07/16/2003 | CN1114991C Oscillation circuit and delay circuit |
| 07/16/2003 | CN1114956C Semiconductor device having LDD structure and method for producing the same |
| 07/16/2003 | CN1114954C 半导体存储器件 A semiconductor memory device |
| 07/16/2003 | CN1114953C Semiconductor device having novel layout pattern |
| 07/16/2003 | CN1114952C Semiconductor memory device |
| 07/16/2003 | CN1114950C Semiconductor device |
| 07/16/2003 | CN1114949C Semiconductor device and its manufacturing method |
| 07/16/2003 | CN1114946C Semiconductor device and manufacturing method and testing method of same |
| 07/16/2003 | CN1114945C Flexible tape substrate for semiconductor chip package and method of manufacturing such package |
| 07/16/2003 | CN1114943C Semiconductor device and its manufacturing method |
| 07/16/2003 | CN1114942C Method for forming contact plugs and simultaneously planarizing substrate surface in integrated circuit |
| 07/16/2003 | CN1114941C Method for mfg. semiconductor device |
| 07/16/2003 | CN1114940C Method for evaluating semiconductor device |
| 07/16/2003 | CN1114939C Method for making field effect transistors having sub-lithographic gates with vertical side walls |
| 07/16/2003 | CN1114938C Contact window tempering method for avoiding generation of mixed diffusion in dielectric layer |
| 07/16/2003 | CN1114937C Method of forming dielectric films with reduced metal contamination |
| 07/16/2003 | CN1114936C Semiconductor substrate and process for producing same |
| 07/16/2003 | CN1114577C Method of producing bismuth layer structured ferroelectric thin film |
| 07/16/2003 | CN1114566C Methods for treating semiconductor wafers |
| 07/15/2003 | US6594818 Memory architecture permitting selection of storage density after fabrication of active circuitry |
| 07/15/2003 | US6594813 Cell architecture with local interconnect and method for making same |
| 07/15/2003 | US6594810 Reconfigurable integrated circuit with a scalable architecture |
| 07/15/2003 | US6594800 Block based design methodology |
| 07/15/2003 | US6594747 Processing apparatus with integrated circuit and integrated circuit package |
| 07/15/2003 | US6594738 Semiconductor device in which MPU and DRAM as secondary cache memory are mounted on same chip to easily realize high speed of cycle time under restriction on chip size |
| 07/15/2003 | US6594625 Method for modeling diffusion of impurities in a semiconductor |
| 07/15/2003 | US6594611 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture |
| 07/15/2003 | US6594609 Scan vector support for event based test system |
| 07/15/2003 | US6594560 Automated-guided vehicle system and method for controlling the same |
| 07/15/2003 | US6594546 Plant for processing wafers |
| 07/15/2003 | US6594540 Misalignment tolerant techniques for dual damascene fabrication |
| 07/15/2003 | US6594446 Heat-treating methods and systems |
| 07/15/2003 | US6594414 Structure and method of fabrication for an optical switch |
| 07/15/2003 | US6594334 Exposure method and exposure apparatus |
| 07/15/2003 | US6594293 Relaxed InxGa1-xAs layers integrated with Si |
| 07/15/2003 | US6594197 Semiconductor integrated circuit device |
| 07/15/2003 | US6594193 Charge pump for negative differential resistance transistor |
| 07/15/2003 | US6594191 Segmented write line architecture |
| 07/15/2003 | US6594182 Semiconductor memory device having controlled impurity concentration profile, method for manufacturing thereof, and semiconductor manufacturing apparatus |
| 07/15/2003 | US6594175 High density giant magnetoresistive memory cell |
| 07/15/2003 | US6594172 Method of selectively forming local interconnects using design rules |
| 07/15/2003 | US6594120 Magnetoresistive element and magnetic memory element and magnetic head using the same |
| 07/15/2003 | US6594073 Antistatic optical pellicle |
| 07/15/2003 | US6594064 Electro-optical device, manufacturing method for manufacturing electro-optical device, and electronic equipment |
| 07/15/2003 | US6594024 Monitor CMP process using scatterometry |
| 07/15/2003 | US6594002 Wafer shape accuracy using symmetric and asymmetric instrument error signatures |
| 07/15/2003 | US6593998 Projection exposure system |
| 07/15/2003 | US6593983 Low power consumption liquid crystal display substrate |
| 07/15/2003 | US6593978 Method for manufacturing active matrix liquid crystal displays |
| 07/15/2003 | US6593977 IC card apparatus having patterned insulating layer formed between gate insulating film and semiconductor layer except for channel region and method of manufacture |
| 07/15/2003 | US6593800 Semiconductor integrated circuit device |
| 07/15/2003 | US6593792 Buffer circuit block and design method of semiconductor integrated circuit by using the same |
| 07/15/2003 | US6593699 Pads comprising RTV silicone rubbers on foundations having coolant fliuds and disks on shafts for rotation, used for semiconductors dopes |
| 07/15/2003 | US6593686 Electron gun and electron beam drawing apparatus using the same |
| 07/15/2003 | US6593665 Protective envelope for a semiconductor integrated circuit |
| 07/15/2003 | US6593664 Chip module with bond-wire connections with small loop height |
| 07/15/2003 | US6593663 Electronic device including stacked microchips |
| 07/15/2003 | US6593662 Stacked-die package structure |
| 07/15/2003 | US6593661 Method of repairing disconnected wiring and multilevel wiring structure |
| 07/15/2003 | US6593660 Plasma treatment to enhance inorganic dielectric adhesion to copper |
| 07/15/2003 | US6593659 Dual damascene structure with carbon containing SiO2 dielectric layers |
| 07/15/2003 | US6593657 Contact integration article |
| 07/15/2003 | US6593656 Multilevel copper interconnects for ultra large scale integration |
| 07/15/2003 | US6593655 Method for producing hydrogenated silicon oxycarbide films having low dielectric constant |
| 07/15/2003 | US6593654 Semiconductor device and method for manufacturing same |
| 07/15/2003 | US6593653 Low leakage current silicon carbonitride prepared using methane, ammonia and silane for copper diffusion barrier, etchstop and passivation applications |
| 07/15/2003 | US6593652 Semiconductor device reinforced by a highly elastic member made of a synthetic resin |
| 07/15/2003 | US6593650 Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials |
| 07/15/2003 | US6593648 Semiconductor device and method of making the same, circuit board and electronic equipment |
| 07/15/2003 | US6593647 Semiconductor device |
| 07/15/2003 | US6593645 Three-dimensional system-on-chip structure |
| 07/15/2003 | US6593641 Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
| 07/15/2003 | US6593638 Microelectronic integrated circuit structures comprising electroconductive buffer layers, doped perovskite thin films and insulator coverings, used for multilayer capacitors, ferro/piezoelectric and/or electrooptics |